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    Glass cloth and film substrate using it
    111.
    发明申请
    Glass cloth and film substrate using it 审中-公开
    玻璃布和薄膜底物使用它

    公开(公告)号：US20060035552A1

    公开(公告)日：2006-02-16

    申请号：US10528434

    申请日：2003-09-18

    Applicant: Yoshinobu Fujimura ,  Yasuyuki Kimura

    Inventor： Yoshinobu Fujimura ,  Yasuyuki Kimura

    IPC: D03D15/00 ,  B32B1/00 ,  B32B27/04

    CPC classification number: D03D1/0082 ,  D03D15/0011 ,  H05K1/0366 ,  H05K2201/029 ,  Y10T442/2008 ,  Y10T442/2361 ,  Y10T442/2992 ,  Y10T442/322 ,  Y10T442/3301 ,  Y10T442/3309

    Abstract: Glass cloth which is formed of a warp yarn and a weft yarn of the same glass yarn, wherein a ratio of warp yarn width to weft yarn width is not less than 0.80 and not more than 1.20 and a ratio of an elongation rate in a length direction when a load in a range of 25 N to 100 N per 25 mm width of the glass cloth is added in a warp yarn direction, to an elongation rate in a width direction when said load is added in a weft yarn direction is not less than 0.80 and not more than 1.20.

    Abstract translation: 由经纱和同一玻璃纱的纬纱形成的玻璃布，其中经纱宽度与纬纱宽度的比率不小于0.80且不大于1.20，并且伸长率的长度 当在经纱方向上加入每25mm宽度的25N至100N的范围内的负载在纬纱方向上加入所述负载时的宽度方向上的延伸率不小于 大于0.80且不大于1.20。

    Method and apparatus for the integration of electronics in textiles
    114.
    发明申请
    Method and apparatus for the integration of electronics in textiles 审中-公开
    用于将电子产品整合到纺织品中的方法和设备

    公开(公告)号：US20050029680A1

    公开(公告)日：2005-02-10

    申请号：US10896366

    申请日：2004-07-21

    Applicant: Stefan Jung ,  Christl Lauterbach

    Inventor： Stefan Jung ,  Christl Lauterbach

    IPC: A41D13/00 ,  A41D1/00 ,  A41D31/00 ,  D03D15/00 ,  H05K3/28 ,  H01L21/44

    CPC classification number: H05K3/284 ,  A41D1/002 ,  H05K1/038 ,  H05K2201/029

    Abstract: Apparatus having at least one textile material in which at least one flexible, wire-like and/or thread-like electric conductor is arranged, at least one electronic component which has at least one electrically conductive contact point which is connected electrically to the conductor, at least a first hard encapsulation which covers and mechanically stabilizes at least the contact point of the component, and at least a second encapsulation, which is designed such that it permits a mechanical connection of the component to the textile material, wherein the second encapsulation comprises a silicone, a polyurethane and/or a textile adhesive.

    Abstract translation: 具有至少一种纺织材料的装置，其中布置有至少一个柔性，线状和/或线状导电体，至少一个电子部件，其具有至少一个电连接到导体的导电接触点， 至少第一硬封装，其至少覆盖和机械地稳定所述部件的接触点，以及至少第二封装，其被设计成使得其允许所述部件与所述纺织材料机械连接，其中所述第二封装包括 硅树脂，聚氨酯和/或织物粘合剂。

    Substrate for high-frequency module and high-frequency module
    117.
    发明申请
    Substrate for high-frequency module and high-frequency module 审中-公开
    基板用于高频模块和高频模块

    公开(公告)号：US20040130877A1

    公开(公告)日：2004-07-08

    申请号：US10472325

    申请日：2004-02-17

    Inventor： Akihiko Okubora

    IPC: H05K001/11 ,  H05K001/14

    CPC classification number: H01P1/20363 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/10 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/024 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/16 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/029 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: A high-frequency module having a communication function is provided which uses a circuit board including an organic substrate (5) formed from a woven glass fabric (21) formed by weaving glass fibers (22) into a mesh pattern and also an organic material (20) provided integrally on the woven glass fabric (21) as a core. The organic substrate (5) has the glass fibers (22) distributed at close intervals of nulle/4 (nulle: effective wavelength of high-frequency signal) in the wavelength traveling direction of the high-frequency signal in the conductor patterns where resonant lines for transmission of the high-frequency and passive elements are formed. In the high-frequency module, the nullvariationsnull of the dielectric constant etc. of the organic substrate, which would be caused by any thick and thin distributions of the glass fibers, can be reduced, and thus the conductive parts can work with stable performances, respectively.

    Abstract translation: 提供一种具有通信功能的高频模块，其使用包括由通过将玻璃纤维（22）编织成网状图案而形成的机织玻璃织物（21）形成的有机基板（5）的电路板，以及有机材料 20）一体地设置在作为芯的机织玻璃织物（21）上。 有机基板（5）具有在导体图案中的高频信号的波长传播方向上分布有lambdae / 4（lambdae：高频信号的有效波长）的玻璃纤维（22），其中共振线 用于传输高频和无源元件。 在高频模块中，可以减少由玻璃纤维的任何厚而薄的分布引起的有机基板的介电常数等的“变化”，因此导电部件可以稳定地工作 表演。

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