Abstract:
A semiconductor package of an embodiment includes a wiring substrate, a semiconductor chip provided on an upper surface of the wiring substrate, a sealing resin covering surfaces of the wiring substrate and the semiconductor chip, an infrared reflection layer containing any of aluminum, aluminum oxide, and titanium oxide, and an external terminal provided on a lower surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal. The infrared reflection layer is provided to the sealing resin on an upper side of a surface of the semiconductor chip on a side opposite to an upper surface of the wiring substrate.
Abstract:
A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.
Abstract:
A display device includes a first substrate on which a thin film transistor is formed and which is divided into a display area and a non-display area outside thereof, a second substrate arranged to face an upper surface of the first substrate, a light-shielding film provided in an area between the first substrate and the second substrate, and a circuit provided on an upper surface of the second substrate and in an area facing the display area. The second substrate includes a terminal part of the circuit, which is provided on the upper surface of the second substrate and in an area facing the non-display area. The terminal part is connected with a circuit driving substrate, which drives the circuit through an anisotropic conductive film covering the terminal part. The light-shielding film is provided to avoid at least part of an area facing the terminal part.
Abstract:
A display device includes a first substrate on which a thin film transistor is formed and which is divided into a display area and a non-display area outside thereof, a second substrate arranged to face an upper surface of the first substrate. a light-shielding film provided in an area between the first substrate and the second substrate, and a circuit provided on an upper surface of the second substrate and in an area facing the display area. The second substrate includes a terminal part of the circuit, which is provided on the upper surface of the second substrate and in an area facing the non-display area. The terminal part is connected with a circuit driving substrate, which drives the circuit through an anisotropic conductive film covering the terminal part. The light-shielding film is provided to avoid at least part of an area facing the terminal part.
Abstract:
Disclosed herein is a touch panel, including: a window substrate divided into an active area and a non-active area surrounding the active area; an electrode part having an electrode bezel pattern formed of a bezel ink in the active area of the window substrate and an electrode pattern integrally formed on one surface of the electrode bezel pattern; and a bezel part formed of the bezel ink in the non-active area of the window substrate, to surround the electrode part.
Abstract:
A display device includes a first substrate on which a thin film transistor is formed and which is divided into a display area and a non-display area outside thereof, a second substrate arranged to face an upper surface of the first substrate, a light-shielding film provided in an area between the first substrate and the second substrate, and a circuit provided on an upper surface of the second substrate and in an area facing the display area. The second substrate includes a terminal part of the circuit, which is provided on the upper surface of the second substrate and in an area facing the non-display area. The terminal part is connected with a circuit driving substrate, which drives the circuit, through an anisotropic conductive film covering the terminal part. The light-shielding film is provided to avoid at least part of an area facing the terminal part.
Abstract:
A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.
Abstract:
A multilayered polyimide film including a polyimide layer (b), and a pigment-containing polyimide layer (a) stacked on one surface or both surfaces of the polyimide layer (b), wherein the polyimide layer (b) is formed of a polyimide including an aromatic tetracarboxylic acid unit containing a 3,3′,4,4′-biphenyltetracarboxylic acid unit in an amount of 70 to 100 mol %, and an aromatic diamine unit containing a p-phenylenediamine unit in an amount of 70 to 100 mol %.
Abstract:
Provided are a method for producing an electrically conductive pattern, and an electrically conductive pattern produced by the method, the method including the steps of: a) forming an electrically conductive pattern on a substrate, and b) blackening the surface of the electrically conductive pattern by immersing the electrically conductive pattern in a halogen solution which oxidizes the surface of the electrically conductive pattern.