公开(公告)号：US5629098A

公开(公告)日：1997-05-13

申请号：US549197

申请日：1995-10-27

Applicant: Charles A. Poutasse ,  Katherine V. Sack ,  Andrea M. Kovacs ,  James R. Winchester

Inventor： Charles A. Poutasse ,  Katherine V. Sack ,  Andrea M. Kovacs ,  James R. Winchester

IPC: C08L63/00 ,  C08G59/18 ,  C08G59/20 ,  C09J7/02 ,  C09J163/00 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  B32B17/06 ,  B32B15/20

CPC classification number: H05K3/384 ,  C08G59/18 ,  C09J163/00 ,  H05K3/386 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0315 ,  H05K2203/0723 ,  H05K3/022 ,  H05K3/385 ,  H05K3/389 ,  Y10T428/12076 ,  Y10T428/12181 ,  Y10T428/12347 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12681 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31678

Abstract: This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunctional epoxy resin and (B-2) at least one compound represented by the formulaR--(G).sub.n (1)wherein in Formula (I): R is an aromatic, alicyclic or heterocyclic group; G is a functional group selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; and n is a number ranging from 3 up to the number of displaceable hydrogens on R; with the proviso that when at least one G is NH.sub.2 or R.sup.2 NH.sub.2, n is a number ranging from 2 up to the number of displaceable hydrogens on R, and when at least one G is (NHC(.dbd.NH)).sub.m NH.sub.2, n is a number ranging from 1 up to the number of displaceable hydrogens on R. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

Abstract translation: 本发明涉及粘合剂组合物，其包含：（A）至少一种多官能环氧基; 和（B）衍生自（B-1）至少一种双官能环氧树脂的组合物和（B-2）至少一种由式R-（G）n（1）表示的化合物，其中在式（I）中：R 是芳族，脂环族或杂环基; G是选自COOH，OH，SH，NH2，NHR1，（NHC（= NH））mNH2，R2COOH，R2OH，R2SH，R2NH2和R2NHR1的官能团，其中R1是烃基，R2是 亚烷基或亚烷基，m是1至约4的数; 并且n是从3到R上的可置换氢的数目的数字; 条件是当至少一个G是NH 2或R 2 NH 2时，n是在R上的可移动氢数2之间的数目，当至少一个G是（NHC（= NH））m NH 2时，n是 数目范围从1到可位移氢数R上。本发明还涉及具有粘附到其至少一侧的上述粘合剂组合物的铜箔以增强所述箔和电介质基底之间的粘附。 本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

公开(公告)号：US5525433A

公开(公告)日：1996-06-11

申请号：US468655

申请日：1995-06-06

Applicant: Charles A. Poutasse ,  Katherine V. Sack ,  Andrea M. Kovacs ,  James R. Winchester

Inventor： Charles A. Poutasse ,  Katherine V. Sack ,  Andrea M. Kovacs ,  James R. Winchester

IPC: C08L63/00 ,  C08G59/18 ,  C08G59/20 ,  C09J7/02 ,  C09J163/00 ,  H05K1/03 ,  H05K3/02 ,  H05K3/38 ,  B32B15/20 ,  C08F283/00

CPC classification number: H05K3/384 ,  C08G59/18 ,  C09J163/00 ,  H05K3/386 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0315 ,  H05K2203/0723 ,  H05K3/022 ,  H05K3/385 ,  H05K3/389 ,  Y10T428/12076 ,  Y10T428/12181 ,  Y10T428/12347 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12681 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31678

Abstract: This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunetional epoxy resin and (B-2) at least one compound represented by the formulaR--(G).sub.n (I)wherein in Formula (I): R is an aromatic, alicyclic or heterocyclic group; G is a functional group selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; and n is a number ranging from 3 up to the number of displaceable hydrogens on R; with the proviso that when at least one G is NH.sub.2 or R.sup.2 NH.sub.2, n is a number ranging from 2 up to the number of displaceable hydrogens on R, and when at least one G is (NHC(.dbd.NH)).sub.m NH.sub.2, n is a number ranging from 1 up to the number of displaceable hydrogens on R. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

Abstract translation: 本发明涉及粘合剂组合物，其包含：（A）至少一种多官能环氧基; 和（B）衍生自（B-1）至少一种不饱和环氧树脂的组合物和（B-2）至少一种由式R-（G）n（I）表示的化合物，其中在式（I）中：R 是芳族，脂环族或杂环基; G是选自COOH，OH，SH，NH2，NHR1，（NHC（= NH））mNH2，R2COOH，R2OH，R2SH，R2NH2和R2NHR1的官能团，其中R1是烃基，R2是 亚烷基或亚烷基，m是1至约4的数; 并且n是从3到R上的可置换氢的数目的数字; 条件是当至少一个G是NH 2或R 2 NH 2时，n是在R上的可移动氢数2之间的数目，当至少一个G是（NHC（= NH））m NH 2时，n是 数目范围从1到可移位的氢数R上。本发明还涉及具有粘附到其至少一侧上的粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘附。 本发明还涉及包含铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

公开(公告)号：US5362534A

公开(公告)日：1994-11-08

申请号：US110437

申请日：1993-08-23

Applicant: Darryl J. McKenney ,  Robert D. Cyr

Inventor： Darryl J. McKenney ,  Robert D. Cyr

IPC: H05K3/00 ,  H05K3/46 ,  B32B9/00

CPC classification number: H05K3/4611 ,  H05K3/4626 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K3/4652 ,  H05K3/4691 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T428/1438 ,  Y10T428/24917 ,  Y10T428/31515 ,  Y10T428/31522

Abstract: A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer. A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.

Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括从导电层提供的第一基底，其在其第一表面上设置有固化的粘合剂层。 然后将半固化粘合剂层设置在固化的粘合剂层上，并且将第二基底设置在半固化的粘合剂层上。

公开(公告)号：US4699841A

公开(公告)日：1987-10-13

申请号：US832582

申请日：1986-02-24

Applicant: Ernst F. Kundinger ,  Erich Klimesch ,  Hans-Georg Zengel ,  Jeffery D. Lasher

Inventor： Ernst F. Kundinger ,  Erich Klimesch ,  Hans-Georg Zengel ,  Jeffery D. Lasher

IPC: B32B15/08 ,  B32B15/088 ,  B32B15/092 ,  B32B27/00 ,  B32B27/28 ,  B32B27/34 ,  C08J5/12 ,  H05K1/03

CPC classification number: H05K1/036 ,  B32B27/28 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/066 ,  Y10T428/26 ,  Y10T428/2826 ,  Y10T428/294 ,  Y10T428/2947 ,  Y10T428/3154 ,  Y10T428/31721

Abstract: A multilayer laminate having at least one layer of a no longer formable fully aromatic polyimide and at least one layer of substrate material, the layer of no longer formable polyimide adhering directly on one side to the layer of substrate material with a peel strength of at least 4.0 N/cm. The layer of no longer also formable polyimide is also insoluble in phenolic solvents, has a tensile strength of from 100 to 150 N/mm.sup.2, a breaking elongation of from 15 to 100%, a dielectric dissipation factor of from 1.5.times.10.sup.-3 to 5.times.10.sup.-3 at 1 kHz. Additionally, a layer of heat-sealable high-temperature adhesive selected from the class of polyacrylates, polysulfone resins, epoxy resins, fluoropolymer resins, silicone resins or butyl rubbers is joined to that side of the polyimide layer which is remote from the substrate material.

Abstract translation: 具有至少一层不可成形的完全芳香族聚酰亚胺和至少一层基材的多层层压体，不可再生成的聚酰亚胺层直接粘在基材材料层上，剥离强度至少为 4.0 N / cm。 不再是可成型聚酰亚胺的层也不溶于酚类溶剂，拉伸强度为100〜150N / mm2，断裂伸长率为15〜100％，介电损耗因数为1.5×10 -3〜5×10 -3，1 kHz。 此外，选自聚丙烯酸酯类，聚砜树脂，环氧树脂，含氟聚合物树脂，有机硅树脂或丁基橡胶的一类可热封的高温粘合剂被接合到远离基材的聚酰亚胺层的那一侧。

公开(公告)号：US12016128B2

公开(公告)日：2024-06-18

申请号：US17462157

申请日：2021-08-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Young Hwang ,  Byeong Kyun Choi ,  Jin Seok Lee ,  Moo Seong Kim

IPC: H05K3/10 ,  H05K1/09

CPC classification number: H05K3/10 ,  H05K1/09 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0959 ,  H05K2203/0723

Abstract: A circuit board according to an embodiment includes an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes a copper foil layer disposed on the insulating layer, a first plating layer disposed on the copper foil layer, and a second plating layer disposed on the first plating layer, and wherein the copper foil layer has a thickness in a range of 2 μm to 5 μm.

公开(公告)号：US09955574B2

公开(公告)日：2018-04-24

申请号：US14369909

申请日：2012-01-13

Applicant: Koichiro Tanaka ,  Kazuki Kammuri

Inventor： Koichiro Tanaka ,  Kazuki Kammuri

IPC: B32B15/00 ,  H05K1/03 ,  B32B15/08 ,  H05K1/09 ,  H05K3/02 ,  B32B7/02 ,  B32B15/20 ,  H05K1/05

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1

公开(公告)号：US20180077796A1

公开(公告)日：2018-03-15

申请号：US15813353

申请日：2017-11-15

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski

IPC: H05K1/03 ,  C08L71/12 ,  C08L71/00 ,  C08G65/48

CPC classification number: H05K1/0353 ,  B32B17/02 ,  B32B17/064 ,  C03C25/323 ,  C08G65/485 ,  C08L71/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0366 ,  H05K3/025 ,  H05K2201/0358 ,  Y10T428/31678 ,  Y10T442/2992

Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

公开(公告)号：US09549471B2

公开(公告)日：2017-01-17

申请号：US13579073

申请日：2011-06-16

Applicant: Kazuki Kammuri

Inventor： Kazuki Kammuri

IPC: H05K1/03 ,  H05K3/02 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20

CPC classification number: H05K3/022 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31678

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, wherein equation 1: (f3×t3)/(f2×t2)=>1 is satisfied when t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and equation 2: 1

Abstract translation: 包括铜箔和层压在其上的树脂层的铜箔复合体，其中当t2（mm）是铜箔的厚度，f2（mm）时，等式1：（f3×t3）/（f2×t2）=> 1 MPa）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，式2： 当f1（N / mm）在铜箔和树脂层之间的剥离强度为180°时，满足1 <= 33f1 /（F×T），F（MPa）是拉伸应变下的铜箔复合材料的强度为30％ ，T（mm）为铜箔复合体的厚度。

公开(公告)号：US20160316561A1

公开(公告)日：2016-10-27

申请号：US14885318

申请日：2015-10-16

Applicant: SK hynix Inc.

Inventor： Jong Hyun NAM

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K1/02

CPC classification number: H05K1/113 ,  H01L23/49822 ,  H01L23/562 ,  H05K1/0271 ,  H05K1/0298 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/2009 ,  H05K2203/0562 ,  H05K2203/063

Abstract: A printed circuit board includes an inner layer having a supporting pattern and via pad patterns that are disposed to be spaced apart from each other in a lateral direction, an outer layer disposed over or below the inner layer and including a circuit pattern, a via plug connecting the circuit pattern layer to any one of the via pad patterns. The supporting pattern is stiffer than the via pad patterns, and at least two of the via pad patterns are electrically connected to each other by a via pad connecting pattern located at substantially the same level as the via pad patterns.

Abstract translation: 印刷电路板包括具有支撑图案的内层和通过垫片图案设置成在横向彼此间隔开，外层设置在内层上方或下方，并且包括电路图案，通孔插头 将电路图案层连接到通孔垫图案中的任何一个。 支撑图案比通孔焊盘图案更硬，并且通孔焊盘图案中的至少两个通过位于与通孔焊盘图案基本相同的电平的通孔焊盘连接图案彼此电连接。

公开(公告)号：US20160231520A1

公开(公告)日：2016-08-11

申请号：US15029016

申请日：2014-09-11

Applicant: NITTO DENKO CORPORATION

Inventor： Naoki Shibata ,  Yuichi Tsujita

IPC: G02B6/42 ,  H05K1/11

CPC classification number: G02B6/4245 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4232 ,  G02B6/4239 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/117 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0358 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/10121 ,  H05K2201/2009 ,  H05K2201/2054

Abstract: In an opto-electric hybrid board according to the present invention, an electrical interconnect line and an optical element are provided on a first surface of a substrate, and an optical waveguide optically coupled to the optical element is provided on a second surface of the substrate. A reinforcement layer for reinforcing the substrate is integrally mounted on the first surface of the substrate on which the electrical interconnect line and the optical element are provided, with an adhesive layer therebetween. A connector pad part for externally electrically connecting the electrical interconnect line is provided on the second surface of the substrate on which the optical waveguide is provided. With this configuration, the reinforcement layer is mounted on the substrate with high strength without adverse effects exerted on the optical element and the optical waveguide.

Abstract translation: 在根据本发明的光电混合基板中，在基板的第一表面上设置电互连线和光学元件，并且在基板的第二表面上设置光耦合到光学元件的光波导 。 用于加强基板的加强层一体地安装在其上设置有电互连线和光学元件的基板的第一表面上，其间具有粘合剂层。 在其上设置有光波导的基板的第二表面上设置有用于外部电连接电互连线的连接器焊盘部分。 利用这种构造，加强层以高强度安装在基板上，而不会对光学元件和光波导产生不利影响。