Inserter sealer system
    113.
    发明授权

    公开(公告)号:US10195895B2

    公开(公告)日:2019-02-05

    申请号:US15292547

    申请日:2016-10-13

    Inventor: Craig D. Richard

    Abstract: An optimized system and method for application of liquid for moistening adhesive on envelope flaps as part of an automated mail production process. Envelopes with open envelope flaps are transported beneath a moistening brush so that an interior side of the flaps, having adhesive thereon, come into contact with a lower end of the moistening brush. A flow of liquid is provided from a liquid supply coupled to the moistening brush to keep the moistening brush wet as moisture is transferred to the envelope flaps. The rate at which liquid is regulated such that moisture is maintained on the brush and a selected quantity of liquid (a dose) is provided for each envelope flap that it moistened. The dose is automatically determined as a function of physical dimensions of the envelope flap, and to optimize sealing of the envelope without excess dripping.

    Method for protecting an electronic circuit board

    公开(公告)号:US10175291B2

    公开(公告)日:2019-01-08

    申请号:US15809039

    申请日:2017-11-10

    Applicant: Foresite, Inc.

    Inventor: Terry L. Munson

    Abstract: A method for protecting an assembled circuit board by providing a layer of rosin micro-spheres directly on the components to be protected, heating the micro-spheres to a temperature of about 65° C. for a time sufficient to cause the micro-spheres to flow and the rosin to crosslink, and then allowing the board to cool until the rosin returns to its solid state. The rosin micro-spheres may be put onto the board and components by first loading the microspheres onto a transfer tape and then positioning the transfer tape, microspheres down, over the components to be protected. After the rosin is heated the tape may be removed. The method is effective for protecting assembled boards against airborne S to prevent creep corrosion of the copper metallization, and for protecting against Sn to prevent the formation of tin whiskers in tin-plated or soldered lead-free assemblies.

    Slurry application device and slurry application method

    公开(公告)号:US10118194B2

    公开(公告)日:2018-11-06

    申请号:US15507925

    申请日:2015-09-02

    Abstract: A slurry application device includes: a slurry supply unit configured to supply slurry to a surface of a traveling base material; a slurry application unit including a first roll body disposed at the downstream side in relation to the slurry supply unit and configured to press the first roll body against the slurry to apply the slurry onto the surface and to adjust an adhesion amount of the slurry such that a film thickness of the slurry becomes one time or more and two times or less of a target film thickness; and a slurry adhesion amount adjustment unit including a second roll body disposed at the downstream side in relation to the slurry application unit and configured to press the second roll body against the slurry to adjust the slurry adhesion amount such that the film thickness of the slurry becomes the target film thickness.

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