Abstract:
The present disclosure provides a touch device. The touch device includes a touch panel and an external circuit. The touch panel is configured to detect touch operations. The external circuit is configured to drive the touch panel. A plurality of connection structures extend from edges of the touch panel towards the external circuit. The plurality of connection structures are electrically conductive and are electrically coupled to the external circuit. The connection structures are configured to transmit touch signals from the touch panel to the external circuit.
Abstract:
A low-stress line workpiece and a method for integrally forming the same is disclosed. Firstly, an in-mold injection molding mold is provided, wherein a function film, a 3D curved-surface plastic material, and an anti-rainbow stripe combination layer are placed in the in-mold injection molding mold. The in-mold injection molding mold is used to mold the function film, the plastic material and the combination layer into a low-stress line workpiece integrally formed by in-mold forming The low-stress line workpiece includes the function film, the plastic layer and the combination layer, wherein the plastic layer is located between the function film and the combination layer. The present invention provides a low-stress line workpiece with high surface hardness and a method for forming the same to reduce lamination fabrication processes and improve lamination yield.
Abstract:
A touch sensing module includes a substrate, sensing electrodes, and a covering layer. The sensing electrodes are disposed on a surface of the substrate. Each of the sensing electrodes has a first end and a second end opposite to the first end. The second end is adopted to be electrically connected with an external circuit. The covering layer is disposed on a side of the sensing electrodes distal from the substrate, and covers the sensing electrodes. The covering layer has openings. The first ends of the sensing electrodes are exposed within the openings respectively.
Abstract:
A panel assembly includes a frame, a cell module, a retaining structure, and a flexible circuit board. The frame has a first surface and a second surface respectively located at opposite sides of the frame. The cell module and the retaining structure are respectively disposed on the first and second surfaces. The flexible circuit board is connected to the cell module and bended to extend over the second surface. The flexible circuit board has a through hole having a passing zone and an inwardly reduced zone communicated with each other. A part of the retaining structure extends from the second surface to a side of the flexible circuit board distal to the second surface via the inwardly reduced zone for preventing the flexible circuit board from moving away from the second surface. The passing zone is configured for the retaining structure to pass through.
Abstract:
An enhanced blind cover and a method for fabricating the same is disclosed. Firstly, a cover having at least one blind hole is provided. Then, liquidized protection glue is formed on an inner sidewall and an inner bottom surface of the blind hole. Finally, the liquidized protection glue is solidified to form solidified protection glue.
Abstract:
The present disclosure provides a method for manufacturing a blind hole of an insulating substrate for an electronic device. The method includes following steps. A patterned photoresist layer is formed over the insulating substrate. The patterned photoresist layer has an opening exposing a portion of the insulating substrate. A wet etching process is performed to remove the exposed insulating substrate to form a blind hole in the opening.
Abstract:
A touch panel includes a substrate, plural conducting wires, an insulating layer, and a ground layer. The substrate includes an active region and a peripheral region surrounding the active region. The conducting wires are disposed in the peripheral region and extend along a first direction. The insulating layer is disposed on the conductive wires. The ground layer is disposed at an edge of the peripheral region and at least partially on the insulating layer, and the ground layer is at least partially in contact with the substrate.
Abstract:
The present invention discloses a touch control device, which is addressed to the rimple problem resulting from the full-lamination design of the touch control panel and the liquid crystal display module. The present invention compensates for the elevation drop of the slightly lower control circuit region of the liquid crystal display module in a thickness-increasing way to make the entire liquid crystal display module have an identical elevation. In some embodiments, the present invention increases the thickness of a portion of a ground tape or an optical adhesion layer to compensate for the elevation drop of the liquid crystal display module with respect to the touch control panel. Thereby, the rimple problem is effectively solved.
Abstract:
A substrate structure includes a substrate, a buffer layer, and a protecting layer. The substrate includes a side surface. The buffer layer is disposed between the side surface of the substrate and the protecting layer, and the hardness of the protecting layer is greater than the hardness of the buffer layer.
Abstract:
An electronic device includes at least one curved region, and at least one fingerprint sensor. The at least one fingerprint sensor is installed under the curved region to acquire fingerprint when the at least one curved region is touched.