公开(公告)号：US12124092B2

公开(公告)日：2024-10-22

申请号：US18045177

申请日：2022-10-10

Applicant: MD Elektronik GmbH

Inventor： Helmut Pritz ,  Thomas Halbig

IPC: H04B10/00 ,  G02B6/38 ,  H01R12/70 ,  H05K1/18

CPC classification number: G02B6/3897 ,  H01R12/7023 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2201/10189

Abstract: A connector for a circuit board includes a connector housing having a mounting arm. The mounting arm has a first fastening element that is releasably connectable to a first connecting element on the circuit board. The connection between the first fastening element and the first connecting element can be established and/or released by deflecting the mounting arm. A securing unit is disposed on the connector housing in such a way that the securing unit is movable between a releasing position and a locking position. In the locking position, the securing unit blocks deflection of the mounting arm. In the releasing position, the securing unit enables deflection of the mounting arm.

公开(公告)号：US20240314917A1

公开(公告)日：2024-09-19

申请号：US18120900

申请日：2023-03-13

Applicant: Microsoft Technology Licensing, LLC

Inventor： Ruslan NAGIMOV

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/0212 ,  H05K7/20372 ,  H05K2201/064 ,  H05K2201/09063

Abstract: The discussion relates to thermal management. One example can include a circuit board including inner, intermediate, and outer generally concentric zones and a cryogenically cooled chip located in the inner zone as well as non-cryogenic electronic components positioned in the outer zone. In this example, the intermediate zone can have a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.

公开(公告)号：US20240312735A1

公开(公告)日：2024-09-19

申请号：US18673963

申请日：2024-05-24

Applicant: Hubbell Incorporated

Inventor： John E. Brower

IPC: H01H9/50 ,  G01R31/327 ,  H01H71/08 ,  H01H71/12 ,  H05K1/16

CPC classification number: H01H9/50 ,  G01R31/3277 ,  H01H71/08 ,  H01H71/125 ,  H05K1/165 ,  H05K2201/09027 ,  H05K2201/09063

Abstract: A testing system may include a printed-circuit board coil embedded on a printed circuit board. The testing system may further include a test circuit electrically connected to the printed-circuit board coil, the test circuit configured to: receive a signal from the printed-circuit board coil, analyze the signal from the printed-circuit board coil, and determine a fault based on the signal from the printed circuit board coil.

公开(公告)号：US20240260192A1

公开(公告)日：2024-08-01

申请号：US18517388

申请日：2023-11-22

Applicant: Samsung Display Co., LTD.

Inventor： KYUNG-MOK LEE ,  YOUNGMIN CHO ,  DONG-YOUB LEE

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10537

Abstract: A display device includes a display panel and a circuit board. The display panel includes a display region and a bonding region. A plurality of pixels is disposed in the display region. The bonding region is spaced apart from the display region in a first direction. A plurality of pad electrodes is disposed in the bonding region. The circuit board is disposed on the display panel. The circuit board includes a first portion overlapping the display panel between the display region and the bonding region in a plan view. Accordingly, a dead space of the display device may be reduced, and a region in which a battery or the like is disposed in the display device may be secured by reducing an area in which the circuit board is disposed after the display panel is bent.

公开(公告)号：US12052823B2

公开(公告)日：2024-07-30

申请号：US17864562

申请日：2022-07-14

Applicant: Fulian Precision Electronics (Tianjin) Co., LTD.

Inventor： Chia-Kang Wu ,  Kun-Yang Cheng

IPC: H05K1/14

CPC classification number: H05K1/14 ,  H05K2201/09063 ,  H05K2201/10227 ,  H05K2201/2027

Abstract: A guiding device includes a first telescopic member, a second telescopic member, and an elastic member. The first telescopic member includes a main body with a sliding cavity. The second telescopic member includes a connecting portion and a guiding portion connected to the connecting portion. The guiding portion is slidably inserted into the sliding cavity. Opposite ends of the elastic member are respectively connected to the connecting portion and the main body. The elastic member pushes the main body in a direction away from the connecting portion. The disclosure also provides a mainboard connection structure having the above guiding device.

公开(公告)号：US12044399B2

公开(公告)日：2024-07-23

申请号：US17551143

申请日：2021-12-14

Applicant: NICHIA CORPORATION

Inventor： Isamu Niki

IPC: F21V9/35 ,  F21V9/30 ,  F21V19/00 ,  F21Y115/30 ,  H01S5/00 ,  H05K1/18 ,  H05K3/30

CPC classification number: F21V9/35 ,  F21V9/30 ,  F21V19/002 ,  H01S5/0087 ,  H05K1/18 ,  H05K3/306 ,  F21Y2115/30 ,  H01S5/005 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A method of manufacturing a light-emitting device includes: providing a light source including a first substrate and a light-emitting element coupled to the first substrate; and after the providing of the light source, forming one or more positioning holes in the first substrate at locations spaced apart from a light-emitting part of the light source by predetermined distances in a top plan view.

公开(公告)号：US20240237222A1

公开(公告)日：2024-07-11

申请号：US18364578

申请日：2023-08-03

Applicant: Samsung Display Co., LTD.

Inventor： HYEONJI KIM ,  JUYEOP SEONG ,  HEE-KWON LEE

IPC: H05K1/18 ,  H01L25/18 ,  H05K1/02 ,  H10K59/90

CPC classification number: H05K1/189 ,  H01L25/18 ,  H05K1/0209 ,  H05K1/0218 ,  H10K59/90 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10128

Abstract: A display device includes a display substrate including a display area, a pixel in the display area, a pad area adjacent to the display area, and a pad in the pad area, a driving chip on the display substrate, in the pad area, and a circuit board which is on the display substrate and electrically connected to the display substrate at the pad, the circuit board defining a groove of the circuit board and covering the driving chip at the groove.

公开(公告)号：US11991820B2

公开(公告)日：2024-05-21

申请号：US17127133

申请日：2020-12-18

Applicant: Comcast Cable Communications, LLC

Inventor： Osman Cueto ,  David Luksenberg

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0272 ,  H05K1/181 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/10151

Abstract: An apparatus, such as a sensor device, may include a housing. The housing may include a top wall, bottom wall, and one or more side walls that define a cavity. A circuit board may be positioned within the housing. One or more chamber side walls may surround a portion of the circuit board and define a chamber within the cavity of the housing. A pathway may be provided that defines a fluid communication channel between the portion of the circuit board and an exterior of the housing. For example, a portion of the pathway may be provided along a perimeter of or through an activation member, such as a push-button or switch positioned along an exterior of the housing.

公开(公告)号：US11968778B2

公开(公告)日：2024-04-23

申请号：US17703520

申请日：2022-03-24

Applicant: Korea Institute of Science and Technology

Inventor： Phillip Lee ,  SeungJun Chung ,  HeeSuk Kim ,  JeongGon Son ,  SukJoon Hwang

IPC: H05K1/02 ,  A41D1/00 ,  A41D1/06 ,  A41D13/00 ,  A41D13/05 ,  A42B1/041 ,  A42B1/08 ,  A42B1/22 ,  A43B23/28 ,  B32B38/08 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0283 ,  H05K3/00 ,  H05K2201/09063

Abstract: Disclosed is a method of manufacturing a stretchable substrate having improved stretch uniformity according to various embodiments of the present disclosure in order to implement the above-described object. The method may include forming an auxetic including a plurality of unit structures, and attaching one or more elastic sheets to the auxetic and forming a stretchable substrate.

公开(公告)号：US11961785B2

公开(公告)日：2024-04-16

申请号：US18215854

申请日：2023-06-29

Applicant: Vitesco Technologies GmbH

Inventor： Jens Reiter ,  Rico Hartmann ,  Christian Lammel

IPC: H01L23/40 ,  H01L25/11 ,  H05K1/18

CPC classification number: H01L23/4006 ,  H05K1/18 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L25/115 ,  H05K2201/09063 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10757

Abstract: A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.