公开(公告)号：US20070210556A1

公开(公告)日：2007-09-13

申请号：US11714875

申请日：2007-03-06

Applicant: David Tak-Wei Hon ,  Kai Liu ,  Jin Feng Li

Inventor： David Tak-Wei Hon ,  Kai Liu ,  Jin Feng Li

IPC: B62K15/00

CPC classification number: B62K15/008 ,  B62K2015/005

Abstract: The present invention discloses a folding bicycle, wherein a folding joint is installed on the beam, and the rear fork is hinged with the frame via a hinge axle, on the rear fork is installed a support bar which rests against the frame; and wherein the beam is S-shaped, and the hinge axle is tilted by an acute angle with respect to the central axle of the frame. When the bicycle is folded, the front and rear wheels are located separately, each at one side of the beam and within the concave section of the S-shaped beam, so that the bicycle is more compact and has a less width after being folded.

Abstract translation: 本发明公开了一种折叠自行车，其中折叠接头安装在梁上，后叉通过铰链轴与框架铰接，后叉上安装有支撑杆，靠在框架上; 并且其中所述梁是S形的，并且所述铰链轴相对于所述框架的中心轴倾斜一个锐角。 当自行车折叠时，前轮和后轮分别位于梁的一侧并且在S形梁的凹部内，使得自行车更紧凑并且在折叠之后具有较小的宽度。

公开(公告)号：US20060239898A1

公开(公告)日：2006-10-26

申请号：US11404700

申请日：2006-04-14

Applicant: Kai-Li Jiang ,  Kai Liu ,  Shou-Shan Fan

Inventor： Kai-Li Jiang ,  Kai Liu ,  Shou-Shan Fan

IPC: D01F9/12 ,  G01N31/10

CPC classification number: D01F9/127 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B2202/08 ,  C30B25/14 ,  C30B29/602 ,  Y10T428/2931 ,  Y10T436/25875

Abstract: A method for measuring a growth rate of a carbon nanotube includes the following steps: (a) providing a substrate (12); (b) forming a catalyst layer on the substrate; (c) heating the substrate to a predetermined temperature; (d) intermittently introducing/providing and then interrupting a reaction gas proximate the substrate to grow a patterned carbon nanotube array, each carbon nanotube having at least one line mark formed thereon as a result of the patterned growth; and (e) calculating the growth rate which is equal to a length between a pair of line marks divided by a time interval between said two line marks.

Abstract translation: 碳纳米管的生长速度测定方法包括以下步骤：（a）提供基板（12）; （b）在基板上形成催化剂层; （c）将衬底加热至预定温度; （d）间歇地引入/提供并且然后中断靠近衬底的反应气体以生长图案化的碳纳米管阵列，每个碳纳米管作为图案生长的结果形成在其上的至少一个线标记; 和（e）计算等于一对线标记之间的长度除以所述两条线标记之间的时间间隔的长度的生长速率。

公开(公告)号：US20060145319A1

公开(公告)日：2006-07-06

申请号：US11027081

申请日：2004-12-31

Applicant: Ming Sun ,  Kai Liu ,  Xiao Zhang ,  Yueh Ho ,  Leeshawn Luo

Inventor： Ming Sun ,  Kai Liu ,  Xiao Zhang ,  Yueh Ho ,  Leeshawn Luo

IPC: H01L23/02

CPC classification number: H01L23/49562 ,  H01L21/6835 ,  H01L23/49575 ,  H01L24/33 ,  H01L24/36 ,  H01L24/39 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01065 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/37099 ,  H01L2924/206

Abstract: This invention discloses a power device package for containing, protecting and providing electrical contacts for a power transistor. The power device package includes a top and bottom lead frames for directly no-bump attaching to the power transistor. The power transistor is attached to the bottom lead frame as a flip-chip with a source contact and a gate contact directly no-bumping attaching to the bottom lead frame. The power transistor has a bottom drain contact attaching to the top lead frame. The top lead frame further includes an extension for providing a bottom drain electrode substantially on a same side with the bottom lead frame. In a preferred embodiment, the power device package further includes a joint layer between device metal of source, gate or drain and top or bottom lead frame, through applying ultrasonic energy. In another embodiment, a layer of conductive epoxy or adhesive, a solder paste, a carbon paste, or other types of attachment agents for direct no-bumping attaching the power transistor to one of the top and bottom lead frames.

公开(公告)号：US09439060B2

公开(公告)日：2016-09-06

申请号：US13538732

申请日：2012-06-29

Applicant: Kai Liu ,  Peter S. Wang ,  Pascal M. Adjakple

Inventor： Kai Liu ,  Peter S. Wang ,  Pascal M. Adjakple

IPC: H04W8/08 ,  H04W36/00 ,  H04W80/04 ,  H04W48/20 ,  H04W84/04

CPC classification number: H04W36/08 ,  H04W8/082 ,  H04W36/0061 ,  H04W36/0083 ,  H04W48/20 ,  H04W80/04 ,  H04W84/042 ,  H04W84/045 ,  H04W88/16

Abstract: Methods and apparatus are described for supporting wireless transmit/receive unit (WTRU) mobility between Home (evolved) Node Bs (H(e)NBs) that are configured to communicate with a Local Gateway (L-GW). The H(e)NBs and/or L-GW may belong to one or more Local H(e)NB Networks (LHNs). A WTRU may receive services including Selected Internet Protocol (IP) Traffic Offload (SIPTO) or Local IP Access (LIPA) services from the L-GW via one or more H(e)NBs. The WTRU may continue to receive SIPTO or LIPA services after a handover to another H(e)NB that may be in communication with the same L-GW and may belong to the same LHN. The WTRU may receive information related to the LHN or the L-GW to allow continuation of SIPTO or LIPA services as the WTRU moves among H(e)NBs and/or out of the LHN. The WTRU may receive and/or maintain one or more LHN Lists.

Abstract translation: 描述了用于支持被配置为与本地网关（L-GW）通信的家庭（演进）节点B（H（e）NB）之间的无线发射/接收单元（WTRU）移动性的方法和装置。 H（e）NB和/或L-GW可以属于一个或多个本地H（e）NB网络（LHN）。 WTRU可以经由一个或多个H（e）NB从L-GW接收包括所选择的因特网协议（IP）业务卸载（SIPTO）或本地IP接入（LIPA））服务的服务。 在切换到可以与同一L-GW通信并且可以属于相同LHN的另一H（e）NB之后，WTRU可以继续接收SIPTO或LIPA服务。 当WTRU在H（e）NB和/或LHN之间移动时，WTRU可以接收与LHN或L-GW相关的信息，以允许继续SIPTO或LIPA服务。 WTRU可以接收和/或维护一个或多个LHN列表。

公开(公告)号：US09398555B2

公开(公告)日：2016-07-19

申请号：US13464132

申请日：2012-05-04

Applicant: Mahmoud Watfa ,  Ulises Olvera-Hernandez ,  Pascal M. Adjakple ,  Kai Liu ,  Peter S. Wang ,  Saad Ahmad ,  Behrouz Aghili

Inventor： Mahmoud Watfa ,  Ulises Olvera-Hernandez ,  Pascal M. Adjakple ,  Kai Liu ,  Peter S. Wang ,  Saad Ahmad ,  Behrouz Aghili

IPC: H04W60/04 ,  H04W84/04 ,  H04W76/02 ,  H04W76/04

CPC classification number: H04W72/04 ,  H04W60/00 ,  H04W60/04 ,  H04W76/10 ,  H04W76/12 ,  H04W76/27 ,  H04W80/04 ,  H04W84/042 ,  H04W88/06 ,  H04W92/10

Abstract: Methods and apparatus are described for transmitting and receiving data by a wireless transmit/receive unit (WTRU) over the control plane. The methods may receive data without the use of an Internet Protocol (IP) address. In an example method, a WTRU may enter an evolved packet system (EPS) mobility management (EMM)-registered control plane only (CPO) state after receiving an attach accepted message for CPO operation, and enter an EMM-deregistered state after receiving a detach message, a tracking area update (TAU) reject message or an attach reject message. In another method, a WTRU may switch between operational modes that use an IP address and a user plane to transmit and receive data, and the CPO mode.

Abstract translation: 描述了用于通过无线发射/接收单元（WTRU）在控制平面上发送和接收数据的方法和装置。 该方法可以接收数据而不使用因特网协议（IP）地址。 在一个示例性方法中，WTRU在接收到用于CPO操作的附接接受消息之后，可以进入演进分组系统（EPS）移动性管理（EMM）注册控制面（CPO）状态，并且在接收到之后进入EMM去注册状态 分离消息，跟踪区域更新（TAU）拒绝消息或附着拒绝消息。 在另一种方法中，WTRU可以在使用IP地址和用户平面的操作模式之间切换以发送和接收数据，以及CPO模式。

公开(公告)号：US20150076676A1

公开(公告)日：2015-03-19

申请号：US14029555

申请日：2013-09-17

Applicant: Jun Lu ,  François Hébert ,  Kai Liu ,  Xiaotian Zhang

Inventor： Jun Lu ,  François Hébert ,  Kai Liu ,  Xiaotian Zhang

IPC: H01L23/495 ,  H01L25/07

CPC classification number: H01L23/492 ,  H01L24/97 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/97 ,  H01L2924/13091 ,  H01L2924/15156 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00

Abstract: A power semiconductor device package includes a conductive assembly including a connecting structure and a semiconductor die having an aperture formed therethrough, the aperture being sized and configured to spacedly receive the connecting structure. In an alternative embodiment, a power semiconductor device package includes a conductive assembly including a connecting structure and a pair of semiconductor die disposed on either side of the connecting structure in spaced relationship thereto.

Abstract translation: 功率半导体器件封装包括导电组件，其包括连接结构和具有穿过其形成的孔的半导体管芯，所述孔的尺寸和构造为间隔地接收连接结构。 在替代实施例中，功率半导体器件封装包括导电组件，该导电组件包括连接结构和设置在与之间隔开的连接结构的任一侧上的一对半导体管芯。

公开(公告)号：US08951847B2

公开(公告)日：2015-02-10

申请号：US13611754

申请日：2012-09-12

Applicant: Nikhil Vishwanath Kelkar ,  Kai Liu

Inventor： Nikhil Vishwanath Kelkar ,  Kai Liu

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/16245 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48141 ,  H01L2224/48145 ,  H01L2224/4826 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85186 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Embodiments of a leadframe for a device packaging are used not only for structural support and connectivity to the I/O pins to the external world, but also for housing and/or mounting devices above and below the leadframe. Being electrically conductive, the leadframe also serves as a low resistance interconnect and good current carrier between the bondpads on one device or between the bondpads on different devices above and/or below the leadframe.

Abstract translation: 用于器件封装的引线框的实施例不仅用于对外部世界的I / O引脚的结构支持和连接，还用于引导框架上方和下方的外壳和/或安装设备。 导电框架还用作一个器件上的焊盘之间的低电阻互连和良好的电流载体，或者位于引线框架上方和/或下方的不同器件上的焊盘之间。

公开(公告)号：US08828256B2

公开(公告)日：2014-09-09

申请号：US12319595

申请日：2009-01-08

Applicant: Chen Feng ,  Kai Liu ,  Yong-Chao Zhai ,  Kai-Li Jiang ,  Shou-Shan Fan

Inventor： Chen Feng ,  Kai Liu ,  Yong-Chao Zhai ,  Kai-Li Jiang ,  Shou-Shan Fan

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  C01B31/02 ,  B82Y30/00 ,  B82Y40/00

CPC classification number: C01B31/0233 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B32/168 ,  C01B2202/08 ,  Y10S977/734 ,  Y10S977/742

Abstract: A method for making a carbon nanotube film includes the steps of providing an array of carbon nanotubes, treating the array of carbon nanotubes by plasma, and pulling out a carbon nanotube film from the array of carbon nanotubes treated by the plasma.

Abstract translation: 制造碳纳米管膜的方法包括以下步骤：提供碳纳米管阵列，通过等离子体处理碳纳米管阵列，并从由等离子体处理的碳纳米管阵列拉出碳纳米管膜。

公开(公告)号：US20140238013A1

公开(公告)日：2014-08-28

申请号：US14067555

申请日：2013-10-30

Applicant: Junqiao Wu ,  Kai Liu ,  Kevin Wang

Inventor： Junqiao Wu ,  Kai Liu ,  Kevin Wang

IPC: F03G7/06

CPC classification number: F03G7/06

Abstract: This disclosure provides systems, methods, and apparatus related to vanadium dioxide microactuators. In one aspect, a method includes depositing a vanadium dioxide layer on a sacrificial layer disposed on a substrate. A metal layer is deposited on the vanadium dioxide layer. The metal layer is patterned. Portions of the vanadium dioxide layer that are not covered by the metal layer are removed. At least a portion of the sacrificial layer is removed to form a cantilever-type structure including the vanadium dioxide layer and the metal layer disposed on the vanadium dioxide layer.

Abstract translation: 本公开提供了与二氧化钒微致动器相关的系统，方法和装置。 一方面，一种方法包括在设置在基底上的牺牲层上沉积二氧化钒层。 金属层沉积在二氧化钒层上。 金属层被图案化。 去除未被金属层覆盖的二氧化钒层的部分。 牺牲层的至少一部分被去除以形成包括二氧化钒层和设置在二氧化钒层上的金属层的悬臂式结构。

公开(公告)号：US08782150B2

公开(公告)日：2014-07-15

申请号：US13109969

申请日：2011-05-17

Applicant: Nobukazu Sugiyama ,  Srivastava Nanduri ,  Andy Nguyen ,  Kai Liu ,  Lobrenzo Wingo ,  Jeffrey Tang ,  Aran Sadja ,  Ludovic Douillet ,  William Collins

Inventor： Nobukazu Sugiyama ,  Srivastava Nanduri ,  Andy Nguyen ,  Kai Liu ,  Lobrenzo Wingo ,  Jeffrey Tang ,  Aran Sadja ,  Ludovic Douillet ,  William Collins

IPC: G06F15/16

CPC classification number: G06F9/5055 ,  G06F9/546 ,  G06F9/547

Abstract: A method and device is provided for platform independent device communication by detecting a request at a processor-based device to perform a function, determining an external device corresponding to the request, retrieving a tag for the external device for performing a function corresponding to the request and generating a message implemented in XMPP, having embedded therein the tag, wherein the tag is essential at the external device for performing the function corresponding to the request. Receiving the message at a device, determining whether the message comprises a device message, retrieving a tag included in the message, wherein the tag corresponds to an executable command to perform a function and executing the tag to perform the function.

Abstract translation: 通过检测基于处理器的设备执行功能的请求，确定与该请求相对应的外部设备，提供用于平台无关设备通信的方法和设备，检索外部设备的标签以执行与该请求对应的功能 以及生成在其中嵌入了标签的XMPP中实现的消息，其中该标签在外部设备上是必不可少的，用于执行与该请求相对应的功能。 在设备处接收消息，确定消息是否包括设备消息，检索包括在消息中的标签，其中标签对应于执行功能的可执行命令并执行标签来执行该功能。