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    Thin micromachined structures
    121.
    发明授权
    Thin micromachined structures 有权
    薄的微加工结构

    公开(公告)号：US06808956B2

    公开(公告)日：2004-10-26

    申请号：US09749171

    申请日：2000-12-27

    Applicant: Cleopatra Cabuz ,  Jeffrey Alan Ridley

    Inventor： Cleopatra Cabuz ,  Jeffrey Alan Ridley

    IPC: H01L2100

    CPC classification number: B81C1/0015 ,  B81B2201/0228 ,  B81C2201/019

    Abstract: Methods for making thin silicon layers suspended over recesses in glass wafers or substrates are disclosed. The suspended silicon wafers can be thin and flat, and can be made using methods not requiring heavy doping or wet chemical etching of the silicon. Devices suitable for production using methods according to the invention include tuning forks, combs, beams, inertial devices, and gyroscopes. One embodiment of the present invention includes providing a thin silicon wafer, and a glass wafer or substrate. Recesses are formed in one surface of the glass wafer, and electrodes are formed in the recesses. The silicon wafer is then bonded to the glass wafer over the recesses. The silicon wafer is them etched to impart the desired suspended or silicon wafer structure. In another embodiment of the present invention, the silicon wafer has a patterned metal layer. The silicon wafer is bonded to the glass wafer, with the patterned metal layer positioned adjacent the recesses in the glass wafer. The silicon wafer is selectively etched down to the metal layer, which serves as an etch stop. The metalized layer can provide sharper feature definition at the silicon-metalization layer interface, and may also serve to seal gasses within the recessed cavities of the glass wafer during the silicon etching process. The metal layer can then be subsequently removed.

    Abstract translation: 公开了将薄硅层悬浮在玻璃晶片或衬底中的凹槽上的方法。 悬浮的硅晶片可以是薄且平坦的，并且可以使用不需要对硅进行重掺杂或湿化学蚀刻的方法制成。 适用于根据本发明的方法生产的装置包括调谐叉，梳，梁，惯性装置和陀螺仪。 本发明的一个实施例包括提供薄硅晶片和玻璃晶片或基板。 凹部形成在玻璃晶片的一个表面上，电极形成在凹部中。 然后将硅晶片在凹槽上结合到玻璃晶片。 硅晶片被刻蚀以赋予所需的悬浮或硅晶片结构。 在本发明的另一个实施例中，硅晶片具有图案化的金属层。 硅晶片结合到玻璃晶片，图案化金属层位于玻璃晶片中的凹槽附近。 硅晶片被选择性地向下蚀刻到用作蚀刻停止层的金属层。 金属化层可以在硅 - 金属化层界面处提供更清晰的特征定义，并且还可以用于在硅蚀刻工艺期间将气体密封在玻璃晶片的凹陷空腔内。 然后可以随后去除金属层。

    Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge
    122.
    发明申请
    Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge 失效

    公开(公告)号：US20040209413A1

    公开(公告)日：2004-10-21

    申请号：US10841649

    申请日：2004-05-07

    Inventor： Richard D. Harris ,  Robert J. Kretschmann

    IPC: H01L021/30

    CPC classification number: B81C1/00357 ,  B81C2201/019 ,  B81C2203/0109

    Abstract: A method for fabricating MEMS structures includes etching a recess in either an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure, or to the lower surface of the wafer that is bonded to the substrate. Accordingly, once the etching processes of the wafer are completed, the recess facilitates the release of an internal movable structure within the fabricated MEMS structure without the use of a separate sacrificial material. Furthermore, a bridge, which is preferably insulating, is pre-etched before the wafer is attached to the substrate.

    Reduced substrate micro-electro-mechanical systems (MEMS) device and system for producing the same
    125.
    发明申请
    Reduced substrate micro-electro-mechanical systems (MEMS) device and system for producing the same 失效
    减少衬底微电机械系统（MEMS）装置及其制造系统

    公开(公告)号：US20040188786A1

    公开(公告)日：2004-09-30

    申请号：US10401963

    申请日：2003-03-31

    Inventor： Eyal Bar-Sadeh ,  Alexander Talalyevsky ,  Eyal Ginsburg

    IPC: H01L029/82 ,  H01L021/00

    CPC classification number: B81B7/0064 ,  B81C1/00158 ,  B81C2201/019 ,  B81C2203/0118 ,  H03H3/0072 ,  H03H3/02 ,  H03H2003/027

    Abstract: Briefly, a reduced substrate Micro-Electro-Mechanical Systems (MEMS) device, for example, a low-loss Film Bulk Acoustic Resonators (FBAR) filter or a low-loss FBAR Radio Frequency filter, and a process and a system to produce the same. A reduced substrate MEMS device in accordance with embodiments of the present invention may include a membrane bonded between packaging parts. A process in accordance with embodiments of the present invention may include bonding a first packaging part to a MEMS device including a support substrate, removing the support substrate, and bonding a second packaging part to the MEMS device.

    Abstract translation: 简而言之，减少衬底的微电子机械系统（MEMS）装置，例如低损耗膜散射声谐振器（FBAR）滤波器或低损耗FBAR射频滤波器，以及一种制造 相同。 根据本发明的实施例的还原衬底MEMS器件可以包括结合在包装部件之间的膜。 根据本发明的实施例的方法可以包括将第一包装部件接合到包括支撑基板的MEMS装置，去除支撑基板以及将第二包装部件接合到MEMS装置。

    Semiconductor wafer comprising micro-machined components and a method for fabricating the semiconductor wafer
    126.
    发明申请
    Semiconductor wafer comprising micro-machined components and a method for fabricating the semiconductor wafer 有权
    包括微加工部件的半导体晶片和用于制造半导体晶片的方法

    公开(公告)号：US20040169284A1

    公开(公告)日：2004-09-02

    申请号：US10786426

    申请日：2004-02-25

    Inventor： Colin Stephen Gormley ,  Stephen Alan Brown ,  Scott Carlton Blackstone

    IPC: H01L027/14

    CPC classification number: G02B26/0841 ,  B81B2201/042 ,  B81C1/00357 ,  B81C2201/019

    Abstract: A semiconductor wafer (1) having a matrix array of micro-mirrors (2) comprises a component substrate (4) carried on a base substrate (5). The component substrate (4) comprises a membrane layer (8) in which the micro-mirrors (2) are formed and a supporting handle layer (9). The base substrate (5) comprises a base layer (15) from which a plurality of pedestals (18) extend upwardly therefrom into cavities (14) in the handle layer (9) corresponding to the micro-mirrors (2). Each pedestal (18) carries electrodes (25) for co-operating with the micro-mirrors (2) for tilting thereof. Conductors (28) through vias (27) in the pedestals (18) connect the electrodes (25) to electrically conductive tracks (29) on a bottom surface (16), and in turn through conductors (36) through vias (35) to addressing terminals (33) for addressing the electrodes (25). By forming the pedestals (18) in the base substrate (5) and projecting the pedestals into the cavities (14) in the handle layer (9) the handle layer (9) is recessed into the base substrate (5) thereby facilitating the provision of a handle layer (9) of depth sufficient for adequately supporting the membrane layer (8) during fabrication of the wafer (1).

    Abstract translation: 具有微反射镜（2）的矩阵阵列的半导体晶片（1）包括承载在基底（5）上的部件基板（4）。 部件基板（4）包括其中形成微反射镜（2）的膜层（8）和支撑手柄层（9）。 基底（5）包括基底层（15），多个基座（18）从该基底层向上延伸到对应于微反射镜（2）的手柄层（9）中的空腔（14）。 每个基座（18）承载电极（25），用于与微反射镜（2）协作以使其倾斜。 基座（18）中的导体（28）通孔（27）将电极（25）连接到底表面（16）上的导电轨道（29），并依次通过导体（36）穿过通孔（35）至 用于寻址电极（25）的寻址端子（33）。 通过在基底基板（5）中形成基座（18）并将基座突出到手柄层（9）中的空腔（14）中，手柄层（9）凹入基底（5），从而便于提供 的手柄层（9），其深度足以在制造晶片（1）期间充分地支撑膜层（8）。

    Multi-seal fluid conductor electrical switch device and method of manufacture therefor
    129.
    发明授权
    Multi-seal fluid conductor electrical switch device and method of manufacture therefor 失效
    多密封流体导体电气开关装置及其制造方法

    公开(公告)号：US06765162B2

    公开(公告)日：2004-07-20

    申请号：US10687121

    申请日：2003-10-15

    Applicant: Marvin G. Wong ,  You Kondoh

    Inventor： Marvin G. Wong ,  You Kondoh

    IPC: H01H5700

    CPC classification number: B81C1/00873 ,  B81C1/00357 ,  B81C2201/019 ,  H01H1/0036 ,  H01H29/28 ,  H01H61/02 ,  H01H2029/008 ,  H01H2061/006

    Abstract: A switch device and a method of manufacture are provided that includes providing two substrates. The two substrates collectively include a fluid conductor switch device structure and a trench surrounding the fluid conductor switch device structure. An inner seal material is deposed on one of the substrates and an outer seal material is deposited in the trench. The substrates are joined to one another using the inner seal material and a peripheral hermetic seal is formed between the substrates using the outer seal material.

    Abstract translation: 提供一种开关装置和制造方法，其包括提供两个基板。 两个基板共同地包括流体导体开关装置结构和围绕流体导体开关装置结构的沟槽。 内部密封材料被放置在其中一个基底上，并且外部密封材料沉积在沟槽中。 使用内密封材料将基板彼此接合，并且使用外部密封材料在基板之间形成周边密封。

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