Abstract:
High area-density arrays, such as diode array vidicon camera tube targets and electron tube electrode screens, are made by photolithographic printing utilizing a photomask diffraction image rather than a photomask shadow for exposing a photoresist masking layer. To form the masking layer, a relatively flat photoresist layer is exposed to a periodic array diffraction image from a photomask. The exposed portions of the layer are removed, leaving an array of unexposed portions. Alternatively, the unexposed portions of the layer may be removed, leaving an array of exposed portions. During the exposure, the layer is oscillated over a distance of essentially one-quarter the wavelength of the light and in a direction substantially perpendicular to the surface of the layer to avoid the appearance of interference fringe patterns after development.
Abstract:
A machine that moves a light sensitive film with respect to a light beam along X and Y axes, in which the light beam is controlled as to shape and image on the film by means of an indexable wheel carrying differently shaped apertures with the aperture in alignment with the beam defining the shape of the image formed, and in which the beam impingement on the film is also controlled to permit movement without producing an image. The machine has especial utility in making printed circuit board film negatives as it is capable of automatic operation by a numerically controlled system using programmed commands.
Abstract:
Apparatus, method, and system for exposing a photosensitive printing plate to radiation, including a plurality of LED point sources configured to emit UV light. The plurality of LED point sources in at least one of a front side set or back side set are controllable in subsets smaller than an entirety of the collective irradiation field corresponding to the respective set. A holder receives the printing plate in a stationary position to receive incident radiation and a controller is configured to control the plurality of LED source subsets. A first LED point source subset is configured to be controlled at a first intensity differing by a factor relative to a second intensity of a second LED point source subset to give the radiation emitted by the respective set an intended degree of homogeneity.
Abstract:
The method for manufacturing a timepiece component includes: providing (E1) a substrate having an upper surface (21); applying (E2) an anti-glare treatment to all or part of the upper surface (21) of the substrate (20); depositing (E31) a layer of photoresist (40) on the upper surface of the substrate (20); exposing (E32) the photoresist (40) to exposure radiation (45) according to a predetermined pattern; and developing (E33) the photoresist (40), so as to form a mould delimited at least partially by the photoresist (40) and by a portion of the at least one upper surface (21) of the substrate (20).
Abstract:
A method, a control means and an exposure apparatus for exposing a relief precursor (P) with a light source (2), the illumination area of the light source (2) covering part of the area of the precursor, wherein exposing the total area of the precursor is performed during an exposure pass by moving relatively to each other the light source and the precursor, the method comprising a step (20) of providing a mask (4) on a photosensitive layer, a first exposing step (ES1) comprising exposing during one or more exposure passes the precursor according to a first intensity profile (IP1) and a first speed profile (SP1); a second exposing step (ES2) comprising exposing during one or more exposure passes the precursor according to a second intensity profile (IP2) different from the first intensity profile (IP1) and a second speed profile (SP2) different from the first speed profile (SP1).
Abstract:
To uniformize the light intensity distribution on an irradiated surface in a light source device including a light-emitting diode (LED) array, a light source device includes a light-emitting diode (LED) array including a circuit having a substrate, a plurality of LED chips on the substrate, and a power supply. A predetermined plane is illuminated with light from the LED array. The plurality of LED chips includes first LED chips and second LED chips different from the first LED chips placed in a same column of the circuit, and the first LED chips have a placement angle different from a placement angle of the second LED chips.
Abstract:
A microlithographic illumination unit for post-exposure of a photoresist provided on a wafer in a microlithography process, has at least one light source and a light-guiding and light-mixing element for coupling the electromagnetic radiation generated by the light source into the photoresist. This light-guiding and light-mixing element has a first pair of mutually opposite side faces, the maximum spacing of which has a first value. Multiple reflections of the electromagnetic radiation on these side faces take place, wherein the light-guiding and light-mixing element has a second pair of mutually opposite side faces, the maximum spacing of which has a second value. The maximum extent of the light-guiding and light-mixing element in the light propagation direction of the electromagnetic radiation has a third value. This third value is greater than the first value and is smaller than the second value.