Film exposing machine for making negatives
    122.
    发明授权
    Film exposing machine for making negatives 失效
    电影曝光机制造负面影片

    公开(公告)号:US3604801A

    公开(公告)日:1971-09-14

    申请号:US3604801D

    申请日:1968-06-11

    Inventor: YOUNG JOSEPH W

    CPC classification number: G03F7/201

    Abstract: A machine that moves a light sensitive film with respect to a light beam along X and Y axes, in which the light beam is controlled as to shape and image on the film by means of an indexable wheel carrying differently shaped apertures with the aperture in alignment with the beam defining the shape of the image formed, and in which the beam impingement on the film is also controlled to permit movement without producing an image. The machine has especial utility in making printed circuit board film negatives as it is capable of automatic operation by a numerically controlled system using programmed commands.

    METHOD FOR MANUFACTURING A TIMEPIECE COMPONENT
    127.
    发明公开

    公开(公告)号:US20240219840A1

    公开(公告)日:2024-07-04

    申请号:US18293503

    申请日:2022-07-28

    Applicant: ROLEX SA

    CPC classification number: G03F7/201 G04B19/042

    Abstract: The method for manufacturing a timepiece component includes: providing (E1) a substrate having an upper surface (21); applying (E2) an anti-glare treatment to all or part of the upper surface (21) of the substrate (20); depositing (E31) a layer of photoresist (40) on the upper surface of the substrate (20); exposing (E32) the photoresist (40) to exposure radiation (45) according to a predetermined pattern; and developing (E33) the photoresist (40), so as to form a mould delimited at least partially by the photoresist (40) and by a portion of the at least one upper surface (21) of the substrate (20).

    METHOD FOR EXPOSURE OF RELIEF PRECURSORS WITH MULTIPLE PROFILES

    公开(公告)号:US20240061340A1

    公开(公告)日:2024-02-22

    申请号:US18267042

    申请日:2021-12-17

    CPC classification number: G03F7/201 G03F7/203 G03F7/2032

    Abstract: A method, a control means and an exposure apparatus for exposing a relief precursor (P) with a light source (2), the illumination area of the light source (2) covering part of the area of the precursor, wherein exposing the total area of the precursor is performed during an exposure pass by moving relatively to each other the light source and the precursor, the method comprising a step (20) of providing a mask (4) on a photosensitive layer, a first exposing step (ES1) comprising exposing during one or more exposure passes the precursor according to a first intensity profile (IP1) and a first speed profile (SP1); a second exposing step (ES2) comprising exposing during one or more exposure passes the precursor according to a second intensity profile (IP2) different from the first intensity profile (IP1) and a second speed profile (SP2) different from the first speed profile (SP1).

    Light source device, illuminating apparatus, exposing apparatus, and method for manufacturing article

    公开(公告)号:US11698589B2

    公开(公告)日:2023-07-11

    申请号:US17031647

    申请日:2020-09-24

    Inventor: Noboru Osaka

    CPC classification number: G03F7/201 G03F7/2008 G03F7/7005 G03F7/70133

    Abstract: To uniformize the light intensity distribution on an irradiated surface in a light source device including a light-emitting diode (LED) array, a light source device includes a light-emitting diode (LED) array including a circuit having a substrate, a plurality of LED chips on the substrate, and a power supply. A predetermined plane is illuminated with light from the LED array. The plurality of LED chips includes first LED chips and second LED chips different from the first LED chips placed in a same column of the circuit, and the first LED chips have a placement angle different from a placement angle of the second LED chips.

    MICROLITHOGRAPHIC ILLUMINATION UNIT
    130.
    发明申请

    公开(公告)号:US20190113849A1

    公开(公告)日:2019-04-18

    申请号:US16208662

    申请日:2018-12-04

    Abstract: A microlithographic illumination unit for post-exposure of a photoresist provided on a wafer in a microlithography process, has at least one light source and a light-guiding and light-mixing element for coupling the electromagnetic radiation generated by the light source into the photoresist. This light-guiding and light-mixing element has a first pair of mutually opposite side faces, the maximum spacing of which has a first value. Multiple reflections of the electromagnetic radiation on these side faces take place, wherein the light-guiding and light-mixing element has a second pair of mutually opposite side faces, the maximum spacing of which has a second value. The maximum extent of the light-guiding and light-mixing element in the light propagation direction of the electromagnetic radiation has a third value. This third value is greater than the first value and is smaller than the second value.

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