公开(公告)号：US07034403B2

公开(公告)日：2006-04-25

申请号：US10411163

申请日：2003-04-10

Applicant: Ranjith Divigalpitiya ,  David A. Kanno ,  Patrice Jannic ,  Christophe Arnold ,  Richard Sabatier ,  Glen Connell

Inventor： Ranjith Divigalpitiya ,  David A. Kanno ,  Patrice Jannic ,  Christophe Arnold ,  Richard Sabatier ,  Glen Connell

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/29 ,  C08L67/00 ,  C08L77/00 ,  C09J9/02 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0281 ,  H01L2924/00

Abstract: An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that includes elongated electrically conductive particles. The bond provides at least one electrical pathway between the first electronic element and the second electronic element through an elongated contact region. This bond is functionally maintained for at least about 200 flexes.

Abstract translation: 一种电子组件，包括第一电子元件，第二电子元件以及它们之间的耐久性柔性接合。 该键包括包括细长导电颗粒的各向异性导电粘合剂。 该键通过细长的接触区域在第一电子元件和第二电子元件之间提供至少一个电路径。 该键在功能上维持至少约200个弯曲。

公开(公告)号：US06878305B2

公开(公告)日：2005-04-12

申请号：US10696521

申请日：2003-10-28

Applicant: George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: C03C10/02 ,  H05K3/32 ,  B32B31/00 ,  H01L29/43 ,  H01L35/24

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.

Abstract translation: 使用聚合物和磁性材料颗粒的组合物将组分偶联到下面的衬底上。 当在组件和印刷电路板之间施加组合物时，可以对组合物进行磁场以将磁性材料颗粒对准到组件和下层衬底之间的导电路径中。 同时，聚合物基材料可以固化或固化，以固定由磁性材料颗粒形成的导电路径。

公开(公告)号：US20040108133A1

公开(公告)日：2004-06-10

申请号：US10619632

申请日：2003-07-16

Inventor： Takeshi Sano ,  Hirofumi Kobayashi ,  Hideaki Ohkura

IPC: H01L023/48 ,  H05K001/18

CPC classification number: H05K3/325 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13386 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13455 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0314 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/0542 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05147

Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Abstract translation: 电子设备包括电子部件，其包括至少一个第一电极，包括至少一个第二电极的基板和形成在所述至少一个第一电极上的至少一个凸块，并由包括具有橡胶弹性的树脂的弹性导电树脂形成， 以及包括涂覆有金，银，镍和铜之一的表面层的针状导电填料。 所述至少一个第一电极和所述至少一个第二电极通过使所述至少一个凸块与所述至少一个第二电极机械接触而彼此电连接。

公开(公告)号：US20040087173A1

公开(公告)日：2004-05-06

申请号：US10696521

申请日：2003-10-28

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.

公开(公告)号：US06693031B2

公开(公告)日：2004-02-17

申请号：US10039710

申请日：2002-01-04

Applicant: Gerald G. Advocate, Jr. ,  Francis J. Downes, Jr. ,  Luis J. Matienzo ,  Ronald A. Kaschak ,  John S. Kresge ,  Daniel C. Van Hart

Inventor： Gerald G. Advocate, Jr. ,  Francis J. Downes, Jr. ,  Luis J. Matienzo ,  Ronald A. Kaschak ,  John S. Kresge ,  Daniel C. Van Hart

IPC: H01L2144

CPC classification number: H01L23/5226 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/383 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0248 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0353 ,  H01L2924/00

Abstract: An electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure. The method provides a substrate having a metallic sheet within a dielectric layer. The metallic sheet includes a metal such as copper. An opening in the substrate, such as a blind via, is formed by laser drilling through the dielectric layer and partially through the metallic sheet. If the opening is a blind via, then the laser drilling is within an outer ring of the blind via cross section using a laser beam having a target diameter between about 20% and about 150% of a radius of the blind via cross section. A surface at the bottom of the opening, called a “blind surface,” includes a metallic protrusion formed by the laser drilling, such that the metallic protrusion is integral with a portion of the blind surface. The metallic protrusion includes the metal of the metallic sheet and at least one constituent element from the dielectric layer. The metallic protrusion is then etched to form a metallic interlocking structure that is integral with the portion of the blind surface. The metallic interlocking structure includes discrete metallic fibers, with each metallic fiber having a curved (or curled) geometry. Each metallic fiber has its own unique composition that includes the metal, at least one constituent element of the dielectric layer, or both.

Abstract translation: 一种电子结构，包括用于将导电镀层接合到金属表面的金属互锁结构，以及形成电子结构的方法。 该方法提供了在电介质层内具有金属片的衬底。 金属片包括铜等金属。 通过激光钻孔穿过电介质层并且部分地穿过金属片，形成诸如盲孔之类的衬底中的开口。 如果开口是盲孔，则激光钻孔是通过横截面的盲孔通过横截面的半径的约20％至约150％之间的目标直径的激光束在盲孔的外环内。 在开口底部的称为“盲面”的表面包括通过激光钻孔形成的金属突起，使得金属突起与盲表面的一部分成一体。 金属突起包括金属片的金属和来自电介质层的至少一个构成元件。 然后蚀刻金属突起以形成与盲表面的一部分成一体的金属互锁结构。 金属互锁结构包括分立的金属纤维，每个金属纤维具有弯曲（或卷曲）的几何形状。 每种金属纤维具有其独特的组成，其包括金属，介电层的至少一个构成元件，或两者。

公开(公告)号：US20030121602A1

公开(公告)日：2003-07-03

申请号：US10039300

申请日：2002-01-02

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: B32B031/00 ,  B31F005/04 ,  B27G011/02 ,  B32B031/24

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.

Abstract translation: 使用聚合物和磁性材料颗粒的组合物将组分偶联到下面的衬底上。 当在组件和印刷电路板之间施加组合物时，可以对组合物进行磁场以将磁性材料颗粒对准到组件和下层衬底之间的导电路径中。 同时，聚合物基材料可以固化或固化，以固定由磁性材料颗粒形成的导电路径。

公开(公告)号：US20030102154A1

公开(公告)日：2003-06-05

申请号：US10342969

申请日：2003-01-15

Applicant: Tessera, Inc.

Inventor： Belgacem Haba

IPC: H05K001/11

CPC classification number: H01L21/568 ,  B29C70/62 ,  B29C70/882 ,  G02F1/1339 ,  H01L21/6835 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27438 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4623 ,  H05K2201/0133 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/09536 ,  H05K2203/104 ,  H05K2203/105 ,  H01L2924/00

Abstract: A layer of an anisotropic material has a pair of substantially flat oppositely-directed major faces, a vertical direction extending between the faces and horizontal directions transverse to the vertical direction, the layer including a dielectric material and a plurality of conductive particles in the dielectric material. The particles are distributed non-uniformly in the horizontal directions so as to provide areas of high particle concentration interspersed with areas of low particle concentration.

Abstract translation: 各向异性材料层具有一对基本平坦的相反方向的主面，垂直方向在横向于垂直方向的面和水平方向之间延伸，所述层包括电介质材料和电介质材料中的多个导电颗粒 。 颗粒在水平方向上不均匀地分布，以提供散布有低颗粒浓度区域的高颗粒浓度的区域。

公开(公告)号：US06518091B1

公开(公告)日：2003-02-11

申请号：US09655300

申请日：2000-09-05

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H01L2144

CPC classification number: H01L21/568 ,  B29C70/62 ,  B29C70/882 ,  G02F1/1339 ,  H01L21/6835 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27438 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4623 ,  H05K2201/0133 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/09536 ,  H05K2203/104 ,  H05K2203/105 ,  H01L2924/00

Abstract: A method of making an anisotropic conductive element for use in microelectronic packaging includes providing a layer of material having a pair of oppositely-directed major faces, the layer incorporating a curable dielectric material in a fluid condition and electrically conductive particles in the curable dielectric material and applying a magnetic field to the layer of a material so as to alter the configuration of the particles and so as to form areas of high particle concentration defining a plurality of conductive paths extending between the major faces of the layer of a material. After applying the magnetic field, the dielectric material is cured. The layer may be compressed for moving the conductive particles together to provide lower resistance electrical paths through the layer. In certain embodiments, at last some of the conductive particles are elongated so that when the magnetic field is applied to the layer of a material, the magnetic field turns the axes of elongation of at least some of the elongated particles towards the vertical direction. In other embodiments, the magnetic field moves at least some of the conductive particles in horizontal directions.

Abstract translation: 制造用于微电子封装的各向异性导电元件的方法包括提供具有一对相反方向的主面的材料层，该层包含处于流体状态的可固化电介质材料和可固化电介质材料中的导电颗粒，以及 对材料层施加磁场，以便改变颗粒的构型并形成高的颗粒浓度的区域，从而限定在材料层的主要表面之间延伸的多个导电路径。 施加磁场后，介电材料固化。 该层可以被压缩以将导电颗粒移动到一起以提供穿过层的较低电阻的电路径。 在某些实施例中，最后一些导电颗粒是细长的，使得当磁场被施加到材料层时，磁场使至少一些细长颗粒的伸长轴线向垂直方向转动。 在其他实施例中，磁场沿水平方向移动至少一些导电颗粒。

公开(公告)号：US06190509B1

公开(公告)日：2001-02-20

申请号：US09034515

申请日：1998-03-04

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H05F300

CPC classification number: H01L21/568 ,  B29C70/62 ,  B29C70/882 ,  G02F1/1339 ,  H01L21/6835 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27438 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4623 ,  H05K2201/0133 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/09536 ,  H05K2203/104 ,  H05K2203/105 ,  H01L2924/00

Abstract: A method of making an anisotropic conductive element for use in microelectronic packaging includes providing a layer of an anisotropic conductive material incorporating a dielectric material in a fluid condition and electrically conductive particles in the dielectric material and applying a field to the anisotropic conductive material so as to alter the configuration of the particles. The layer has a pair of oppositely directed major faces, a vertical direction between the major faces and horizontal directions parallel to the major faces. The field applied to the layer of anisotropic conductive material may include electrical or magnetic fields. In certain embodiments, at last some of the conductive particles are elongated so that when the field is applied to the layer of anisotropic conductive material, the field turns the axes of elongation of at least some of the elongated particles towards the vertical direction. In other embodiments the field moves at least some of the conductive particles in horizontal directions.

Abstract translation: 制造用于微电子封装的各向异性导电元件的方法包括提供在介质材料中结合有电介质材料的介电材料和介电材料中的导电颗粒的各向异性导电材料层，并向各向异性导电材料施加场，以便 改变粒子的配置。 该层具有一对相对定向的主面，主要面之间的垂直方向和平行于主面的水平方向。 施加到各向异性导电材料层的场可以包括电场或磁场。 在某些实施例中，最后一些导电颗粒是细长的，使得当场施加到各向异性导电材料层时，该场将至少一些细长颗粒的延伸轴线朝向垂直方向转动。 在其它实施例中，该场沿水平方向移动至少一些导电颗粒。

公开(公告)号：US5965245A

公开(公告)日：1999-10-12

申请号：US712509

申请日：1996-09-13

Applicant: Norio Okano ,  Kazuhito Kobayashi ,  Akishi Nakaso

Inventor： Norio Okano ,  Kazuhito Kobayashi ,  Akishi Nakaso

IPC: C08J5/24 ,  C08K7/02 ,  C09D5/25 ,  H05K1/03 ,  B32B9/00

CPC classification number: C08K7/02 ,  C08J5/24 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249995 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/269 ,  Y10T428/2949 ,  Y10T428/31529

Abstract: A prepreg comprising a semi-cured thermosetting resin and electrically insulating whiskers or short fibers dispersed in said semi-cured thermosetting resin, and if necessary, a carrier film attached or bound to said prepreg is suitable for producing multilayer printed circuit boards of reduced thinness, high wiring density and high connection reliability with high productivity and low production cost.

Abstract translation: 一种预浸料，其包含半固化的热固性树脂和分散在所述半固化的热固性树脂中的电绝缘的晶须或短纤维，并且如果需要，附着或结合到所述预浸料的载体膜适用于制备薄的减薄的多层印刷电路板， 高布线密度和高连接可靠性，生产效率高，生产成本低。