Head suspension assembly and storage medium drive
    131.
    发明申请
    Head suspension assembly and storage medium drive 审中-公开
    头悬挂组件和存储介质驱动

    公开(公告)号:US20080151428A1

    公开(公告)日:2008-06-26

    申请号:US11904415

    申请日:2007-09-27

    CPC classification number: G11B5/5565 G11B5/4853 G11B5/6011

    Abstract: A first joint member connects the surface of a support body to a first end surface of a head slider. A second joint member connects the surface of the support body to a second end surface of the head slider. The first and second end surfaces respectively stand upright from the surface of the support body at opposite ends of the head slider. The centroid of a first joint surface established between the first joint member and the first end surface is located in a range between the front surface of the head slider and the neutral plane. The neutral plane is established when the head slider is deformed to convex or concave the front surface. When temperature changes, the bending deformation of the medium-opposed surface is reduced. This results in prevention of a change in the flying height of the head slider.

    Abstract translation: 第一接合构件将支撑体的表面连接到磁头滑块的第一端面。 第二联接构件将支撑体的表面连接到头滑块的第二端表面。 第一和第二端面分别从头部滑块的相对端处从支撑体的表面竖立。 在第一接头构件和第一端面之间建立的第一接头表面的质心位于头部滑块的前表面和中立平面之间的范围内。 当磁头滑块变形成凸面或凹面时,建立中立平面。 当温度变化时,介质相对表面的弯曲变形减小。 这导致防止磁头滑块的飞行高度的变化。

    Head suspension assembly and storage device
    134.
    发明申请
    Head suspension assembly and storage device 失效
    头悬挂装配和存放装置

    公开(公告)号:US20080013215A1

    公开(公告)日:2008-01-17

    申请号:US11605703

    申请日:2006-11-29

    CPC classification number: G11B5/4826 G11B5/4833

    Abstract: A hinge plate is bonded to a base plate and a load beam in a head suspension assembly. The load beam includes a wide section and a narrow section extending forward from the front end of the wide section. The head suspension assembly allows the load beam to have a narrower width based on the narrow section. The load beam is thus allowed to enjoy a reduced weight. The mass is reduced at a position distanced from the centerline of the load beam. This results in a reduction in the inertial force around the centerline in the load beam. The inventors have demonstrated that the resonance frequency of the first torsion mode is allowed to fall in a higher frequency range. The resonance of the head suspension assembly can be reduced.

    Abstract translation: 铰链板结合到头板悬挂组件中的基板和负载梁。 负载梁包括宽的部分和从宽部分的前端向前延伸的窄部分。 头悬挂组件允许负载梁基于窄部分具有较窄的宽度。 因此允许负载梁享受减轻的重量。 在远离负载梁的中心线的位置处,质量减小。 这导致负载梁中心线周围的惯性力减小。 发明人已经证明,允许第一扭转模式的共振频率落在更高的频率范围内。 可以减小头悬挂组件的共振。

    Suspension for head slider
    136.
    发明申请
    Suspension for head slider 失效
    悬挂头滑块

    公开(公告)号:US20070019331A1

    公开(公告)日:2007-01-25

    申请号:US11283729

    申请日:2005-11-22

    CPC classification number: G11B5/4813 G11B5/4826

    Abstract: A plate member is made of a metal material lighter than stainless steel in a suspension for a head slider. This leads to a reduction in the weight of the suspension. The natural frequency of the suspension is thus raised. Moreover, the viscoelastic member is interposed between the front surface of the plate member and the back surface of the flexure. This structure allows either the plate member or the flexure to act as a base and the other to act as a constraining member. In other words, the plate member, the flexure and the viscoelastic member in combination act as a so-called vibration damper including constraining layers. The viscoelastic member serves to further suppress vibration of the plate member and the flexure.

    Abstract translation: 板构件由用于头滑块的悬架中的不同于不锈钢的金属材料制成。 这导致悬架的重量减小。 因此悬挂的固有频率提高。 此外,粘弹性构件插入在板构件的前表面和挠曲件的后表面之间。 该结构允许板构件或挠曲件用作基座,另一个用作约束构件。 换句话说,组合的板构件,挠曲件和粘弹构件用作包括约束层的所谓的振动阻尼器。 粘弹性构件用于进一步抑制板构件的振动和挠曲。

    Multiplexing apparatus
    137.
    发明授权
    Multiplexing apparatus 失效
    复用装置

    公开(公告)号:US06970460B2

    公开(公告)日:2005-11-29

    申请号:US09781998

    申请日:2001-02-14

    Abstract: A circuit size of a multiplexing apparatus is reduced. In terminal interface units 21a to 23a, data from a terminal is received by each of terminal-side line interface sub-unit 211, and then celluralized by a cell assembly/disassembly sub-unit 28a. The cell is transmitted directly to a priority control unit 242a. In the priority control unit 242a, the cell received from each of the terminal interface units 21a to 23a is stored in each of priority control buffers 243a, and then sent to an ATM network interface unit 24a in the order of priorities sequentially. The cell is synchronized with a line of an ATM network 1a by a network synchronizing sub-unit 241a, and transmitted to the line of the ATM network 1a. With this constitution, an internal bus is unnecessary.

    Abstract translation: 复用装置的电路尺寸减小。 在终端接口单元21a至23a中,来自终端的数据由终端侧接口子单元211中的每一个接收,然后由小区组合/拆卸子单元28a进行蜂窝化。 小区被直接发送到优先级控制单元242a。 在优先级控制单元242a中,从每个终端接口单元21a至23a接收的小区被存储在每个优先级控制缓冲器243a中,然后按优先级顺序发送到ATM网络接口单元24a 顺序。 小区与网络同步子单元241a的ATM网络1a的一行同步,并发送到ATM网络1a的线路。 通过这种结构,不需要内部总线。

    High-frequency module
    138.
    发明申请
    High-frequency module 审中-公开
    高频模块

    公开(公告)号:US20050037804A1

    公开(公告)日:2005-02-17

    申请号:US10882098

    申请日:2004-06-30

    CPC classification number: H04B1/40

    Abstract: A high-frequency module is provided that includes a reception portion that processes a reception signal received by a reception antenna, and a transmission portion that processes a transmission signal to be supplied to a transmission antenna. The reception portion includes a demultiplexer circuit that divides a reception signal received at the reception antenna to two reception lines having different frequency bands from each other. The transmission portion includes power amplifier circuits and a demultiplexer circuit. The high-frequency module is configured so that the demultiplexer circuit and the like included in the reception portion, as well as the power amplifier circuits and the demultiplexer circuit included in the transmission portion, are provided inside a multi-layer substrate.

    Abstract translation: 提供了一种高频模块,其包括处理由接收天线接收的接收信号的接收部分和处理要发送到发送天线的发送信号的发送部分。 接收部分包括将在接收天线处接收的接收信号彼此分成具有不同频带的两个接收线的解复用器电路。 传输部分包括功率放大器电路和解复用器电路。 高频模块被配置为使得包括在接收部分中的解复用器电路等以及包括在传输部分中的功率放大器电路和解复用器电路被设置在多层基板内。

    Modular jack
    139.
    发明授权
    Modular jack 失效
    模块化插孔

    公开(公告)号:US06776667B2

    公开(公告)日:2004-08-17

    申请号:US10713200

    申请日:2003-11-17

    CPC classification number: H01R24/64

    Abstract: A modular jack (41) in which a modular plug (75) is plugged, comprises a housing body (42) including a cavity (52) at a front side thereof in which the modular plug (75) is plugged and a rear wall (56) having openings (57 and 58) and fixed portions (59 and 60), and a plurality of terminals (43-50) fixed to the fixed portions (59 and 60) and extend to the cavity (52) in a form of cantilevered beams supported by the fixed portions (59 and 60).

    Abstract translation: 插入有模块化插头(75)的模块插座(41)包括壳体(42),壳体主体(42)在其前侧包括空腔(52),模块插头(75)被插入其中,后壁 具有开口(57和58)和固定部分(59和60)的多个端子(56),以及固定到固定部分(59和60)并且以固定部分(59和60)的形式延伸到空腔 由固定部分(59和60)支撑的悬臂梁。

    Head slider supporting device, disk device and suspension having thermal protection for head IC chip
    140.
    发明授权
    Head slider supporting device, disk device and suspension having thermal protection for head IC chip 失效
    磁头滑块支持装置,磁盘装置和悬架,具有头部IC芯片的热保护功能

    公开(公告)号:US06583962B2

    公开(公告)日:2003-06-24

    申请号:US10174607

    申请日:2002-06-19

    CPC classification number: G11B5/486 G11B5/4833 G11B7/122 G11B21/00 G11B21/16

    Abstract: A suspension has an extending end and the other end. A head IC chip mounting portion is provided between the extending end and the other end of the suspension. A head slider is loaded on a first surface of the suspension at a position on the side of the extending end with respect to the head IC chip mounting portion, the head slider integrally including a head. A head IC chip is mounted at the head IC chip mounting portion of the suspension. First wiring patterns extend along the suspension between a portion of the suspension, at which portion the head slider is loaded, and the head IC chip mounting portion. Second wiring patterns extend along the suspension between the head IC chip mounting portion and the other end of the suspension. The head IC chip is mounted at the head IC chip mounting portion in a condition in which a certain portion of the head IC chip is positioned on the side of a second surface of the suspension, which second surface is opposite to the first surface.

    Abstract translation: 悬架具有延伸端和另一端。 头部IC芯片安装部分设置在悬架的延伸端和另一端之间。 磁头滑块相对于头IC芯片安装部分在延伸端侧的位置处装载在悬架的第一表面上,磁头滑块整体地包括磁头。 磁头IC芯片安装在悬架的头部IC芯片安装部分。 第一布线图案沿着悬架的一部分在头部滑块被加载的部分和头部IC芯片安装部分之间延伸。 第二布线图案沿着头IC封装安装部分和悬架的另一端之间的悬架延伸。 头IC芯片安装在头IC芯片安装部分,其中头IC封装的某一部分位于悬架的第二表面侧,该第二表面与第一表面相对。

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