Thermosetting polymer-based composite materials
    136.
    发明授权
    Thermosetting polymer-based composite materials 有权
    热固性聚合物基复合材料

    公开(公告)号:US08940827B2

    公开(公告)日:2015-01-27

    申请号:US12570537

    申请日:2009-09-30

    Applicant: Xiujun Wang

    Inventor: Xiujun Wang

    Abstract: The present invention relates to a lead-free, non-toxic and arc resistant composite material having a thermosetting polymer, at least one heavy particulate filler, at least one light particulate filler and, optionally, at least one arc resistant filler. The composite material may be utilized in manufacturing articles used in radiation shielding and other applications where arc resistant and dielectric strength are desired.

    Abstract translation: 本发明涉及具有热固性聚合物,至少一种重颗粒填料,至少一种轻微颗粒填料和任选至少一种耐电弧填料的无铅,无毒和耐电弧的复合材料。 复合材料可以用于制造用于辐射屏蔽和其它需要耐电弧和介电强度的应用中的制品。

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