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    EPOXY RESIN COMPOSITION, AND, PREPREG AND COPPER CLAD LAMINATE MANUFACTURED USING THE COMPOSITION
    133.
    发明申请
    EPOXY RESIN COMPOSITION, AND, PREPREG AND COPPER CLAD LAMINATE MANUFACTURED USING THE COMPOSITION 审中-公开
    环氧树脂组合物，以及使用组合物制备的预制和铜箔层压板

    公开(公告)号：US20150189745A1

    公开(公告)日：2015-07-02

    申请号：US14420517

    申请日：2012-09-14

    Applicant: Shengyi Technology Co., Ltd.

    Inventor： Xianping Zeng ,  Nana Ren

    IPC: H05K1/03 ,  B32B5/02 ,  B32B15/14 ,  H05K1/05

    CPC classification number: H05K1/0373 ,  B32B15/14 ,  B32B15/20 ,  B32B27/38 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/7265 ,  B32B2457/08 ,  C08G59/28 ,  C08G59/3227 ,  C08G59/4246 ,  C08G59/4276 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/0066 ,  C08K5/49 ,  H05K2201/012 ,  Y10T428/249921 ,  Y10T442/2475 ,  C08L63/00 ,  C08L67/00

    Abstract: The present invention relates to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition comprises components as follows: an epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain, a phosphorus-containing halogen-free flame retardant compound and an active ester hardener; the amount of the epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain is 100 parts by weight, the amount of the phosphorus-containing halogen-free flame retardant compound is 10-150 parts by weight. The equivalent ratio of the amount of the active ester hardener, based on the ratio between epoxy equivalent and active ester equivalent, is 0.85-1.2. The prepreg and the copper-clad laminate made by using the epoxy resin composition have excellent dielectric performance, moisture-heat resistant performance, simultaneously have a high glass transition temperature and a lower water absorption rate and simultaneously realize halogen-free flame retardancy, achieving UL-94V-0.

    Abstract translation: 本发明涉及环氧树脂组合物和通过使用它们制备的预浸料和覆铜层压板。 环氧树脂组合物包含如下组分：含有3个或更多个环氧基且在分子链中含有氮的环氧树脂，含磷无卤阻燃化合物和活性酯硬化剂; 在分子链中含有3个以上环氧基并含有氮的环氧树脂的量为100重量份，含磷无卤阻燃化合物的量为10-150重量份。 基于环氧当量与活性酯当量之比的活性酯硬化剂的当量比为0.85-1.2。 通过使用环氧树脂组合物制成的预浸料坯和覆铜层压板具有优异的介电性能，耐湿热性能，同时具有高的玻璃化转变温度和较低的吸水率，同时实现无卤阻燃，达到UL -94V-0。

    Method for preparing phosphorus-containing polyphenylene oxide resin with low molecular weight
    135.
    发明授权
    Method for preparing phosphorus-containing polyphenylene oxide resin with low molecular weight 有权
    低分子量含磷聚苯醚树脂的制备方法

    公开(公告)号：US08889816B2

    公开(公告)日：2014-11-18

    申请号：US14236109

    申请日：2011-12-29

    Applicant: Yundong Meng ,  Kehong Fang

    Inventor： Yundong Meng ,  Kehong Fang

    IPC: C08G79/02 ,  H05K1/03 ,  C08G65/48 ,  H05K1/02

    CPC classification number: C08G65/485 ,  C08G65/46 ,  C08G65/48 ,  C08K5/49 ,  H05K1/024 ,  H05K1/0373 ,  H05K2201/012 ,  C08L71/12 ,  C08L71/123

    Abstract: Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000. By dispersing the phosphorus-containing phenolic compound into the solution of polyphenylene oxide resin, and carrying out the re-dispersing reaction in the presence of the initiator to prepare the phosphorus-containing polyphenylene oxide resin with a low molecular weight, the obtained phosphorus-containing polyphenylene oxide resin with a low molecular weight is convenient to process, and suitable for use as the matrix resin of composite materials for high-frequency circuit boards or as an additive component for other polymeric materials.

    Abstract translation: 公开了一种制备低分子量含磷聚苯醚树脂的方法，包括步骤1：提供含磷酚类化合物和数均分子量大于原子的聚苯醚树脂 10000; 步骤2：将原始聚苯醚树脂溶解在溶剂中以制备原始聚苯醚树脂的溶液; 步骤3：将含磷酚类化合物加入原料聚苯醚树脂的溶液中; 步骤4：引发引发剂，并在引发剂的作用下，在高于60℃的反应温度下进行再分散反应; 步骤5：反应完成后，得到的产物是低分子量的含磷聚苯醚树脂，其数均分子量为1000-6000。 通过将含磷酚类化合物分散在聚苯醚树脂的溶液中，在引发剂的存在下进行再分散反应，制备低分子量的含磷聚苯醚树脂，得到的含磷 具有低分子量的聚苯醚树脂方便加工，适用于高频电路板复合材料的基体树脂或其它聚合物材料的添加剂成分。

    Composite material and high frequency substrate made therefrom
    136.
    发明授权
    Composite material and high frequency substrate made therefrom 有权
    复合材料和由其制成的高频基板

    公开(公告)号：US08883316B2

    公开(公告)日：2014-11-11

    申请号：US12694948

    申请日：2010-01-27

    Applicant: Min She Su

    Inventor： Min She Su

    IPC: B32B15/00 ,  H05K1/03 ,  C08F212/14 ,  C08F212/34 ,  C08J5/24 ,  C08L25/18 ,  C08F212/08 ,  C08L9/06 ,  C08K3/40 ,  C08K7/14 ,  C08K3/00 ,  C08K5/00 ,  C08K5/14

    CPC classification number: C08J5/24 ,  C08F212/08 ,  C08F212/14 ,  C08F212/34 ,  C08J2309/00 ,  C08J2309/06 ,  C08J2325/18 ,  C08J2353/02 ,  C08K3/013 ,  C08K3/40 ,  C08K5/0066 ,  C08K5/14 ,  C08K7/14 ,  C08L9/06 ,  C08L25/18 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/31533 ,  Y10T428/31544 ,  Y10T428/31547 ,  Y10T428/31645 ,  Y10T442/2992 ,  C08L2666/06 ,  C08L2666/04

    Abstract: The present invention relates to a composite material, a high-frequency circuit substrate made therefrom and making method thereof. The composite material comprises 20-70 parts by weight of thermosetting mixture, a fiberglass cloth, a powder filler, a flame retardant, and a cure initiator. The thermosetting mixture includes a resin containing vinyl in the amount of more than 60% composed of carbon and hydrogen with its molecular weight being less than 11000, and a solid styryl resin of middle or low molecular weight with unsaturated double bonds. The made high-frequency circuit substrate comprises a plurality of prepregs mutually overlapped, and copper foils respectively covered on both sides of overlapped prepregs. Each prepreg is made from the composite material. The composite material of the present invention enable to readily make prepregs. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and good heat resistance, and is convenient for process operation. Therefore, the composite material of the present invention is suitable for making circuit substrates of high-frequency electronic equipments.

    Abstract translation: 复合材料及其制造方法技术领域本发明涉及复合材料，由其制成的高频电路基板及其制造方法。 复合材料包含20-70重量份的热固性混合物，玻璃纤维布，粉末填料，阻燃剂和固化引发剂。 热固性混合物包括含有分子量小于11000的由碳和氢组成的含量超过60％的乙烯基树脂和具有不饱和双键的中等或低分子量的固体苯乙烯基树脂。 制成的高频电路基板包括相互重叠的多个预浸料，分别覆盖在重叠的预浸料的两侧的铜箔。 每个预浸料由复合材料制成。 本发明的复合材料能够容易地制备预浸料。 由复合材料制成的高频电路基板具有低介电常数，低介电损耗角正切和良好的耐热性，方便操作。 因此，本发明的复合材料适用于制造高频电子设备的电路基板。

    METHOD FOR PREPARING PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE RESIN WITH LOW MOLECULAR WEIGHT
    139.
    发明申请
    METHOD FOR PREPARING PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE RESIN WITH LOW MOLECULAR WEIGHT 有权
    用低分子量制备含磷的聚苯乙烯氧化物树脂的方法

    公开(公告)号：US20140148556A1

    公开(公告)日：2014-05-29

    申请号：US14236109

    申请日：2011-12-29

    Applicant: Yundong Meng ,  Kehong Fang

    Inventor： Yundong Meng ,  Kehong Fang

    IPC: C08G65/48

    CPC classification number: C08G65/485 ,  C08G65/46 ,  C08G65/48 ,  C08K5/49 ,  H05K1/024 ,  H05K1/0373 ,  H05K2201/012 ,  C08L71/12 ,  C08L71/123

    Abstract: Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound to into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000.By dispersing the phosphorus-containing phenolic compound into the solution of polyphenylene oxide resin, and carrying out the re-dispersing reaction in the presence of the initiator to prepare the phosphorus-containing polyphenylene oxide resin with a low molecular weight, the obtained phosphorus-containing polyphenylene oxide resin with a low molecular weight is convenient to process, and suitable for use as the matrix resin of composite materials for high-frequency circuit boards or as an additive component for other polymeric materials.

    Abstract translation: 公开了一种制备低分子量含磷聚苯醚树脂的方法，包括步骤1：提供含磷酚类化合物和数均分子量大于原子的聚苯醚树脂 10000; 步骤2：将原始聚苯醚树脂溶解在溶剂中以制备原始聚苯醚树脂的溶液; 步骤3：将含磷酚类化合物加入原料聚苯醚树脂的溶液中; 步骤4：引发引发剂，并在引发剂的作用下，在高于60℃的反应温度下进行再分散反应; 步骤5：反应完成后，得到的产物是低分子量的含磷聚苯醚树脂，其数均分子量为1000-6000。 通过将含磷酚类化合物分散在聚苯醚树脂的溶液中，在引发剂的存在下进行再分散反应，制备低分子量的含磷聚苯醚树脂，得到的含磷 具有低分子量的聚苯醚树脂方便加工，适用于高频电路板复合材料的基体树脂或其它聚合物材料的添加剂成分。

    Flame retardant compositions with a phosphorated compound
    140.
    发明授权
    Flame retardant compositions with a phosphorated compound 有权
    具有磷酸化合物的阻燃组合物

    公开(公告)号：US08697864B2

    公开(公告)日：2014-04-15

    申请号：US13411823

    申请日：2012-03-05

    Applicant: David Bedner ,  William D. Varnell

    Inventor： David Bedner ,  William D. Varnell

    IPC: C07D251/40

    CPC classification number: C09K21/12 ,  B32B27/04 ,  C08G59/621 ,  C08K5/0066 ,  C08K5/1515 ,  C08K5/521 ,  C08L63/00 ,  C08L71/12 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2203/122 ,  C08L2666/22

    Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 μm2 to about 1965 μm2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.

    Abstract translation: 公开了无卤素或基本上不含卤素的阻燃组合物。 在某些实例中，组合物包含无卤素或基本上不含卤素的环氧化物和一种或多种磷酸化化合物。 在一些实例中，磷酸化化合物包含小于10微米的平均粒度。 在其他实施例中，磷酸化化合物的表面积为78.5μm2至约1965μm2。 还公开了使用该组合物的预浸料，层压板，模制品和印刷电路板。

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