公开(公告)号：US20150000961A1

公开(公告)日：2015-01-01

申请号：US13932699

申请日：2013-07-01

Applicant: Hamilton Sundstrand Corporation

Inventor： Rachel Farner ,  Jay W. Kokas ,  Kenneth J. Trotman ,  Kerry R. Querns

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10416 ,  H05K2201/10553

Abstract: An apparatus includes a printed wiring board, a post that supports the printed wiring board, and a heat pipe on the printed wiring board with a first end positioned near an electronic component attached to the printed wiring board and a second end positioned near the post.

Abstract translation: 一种装置包括印刷线路板，支撑印刷线路板的柱和印刷线路板上的热管，第一端位于靠近印刷线路板的电子部件附近，第二端位于柱附近。

公开(公告)号：US20140132891A1

公开(公告)日：2014-05-15

申请号：US14130174

申请日：2013-04-11

Applicant: LIQUID DESIGN SYSTEMS INC.

Inventor： Naoya Tohyama ,  Makoto Kurihara

IPC: G09G3/34

CPC classification number: G09G3/342 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133612 ,  G02F2001/133628 ,  G09G3/3426 ,  G09G2320/0626 ,  G09G2360/16 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2924/0002 ,  H05B33/0803 ,  H05B33/086 ,  H05K1/0204 ,  H05K3/4644 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00

Abstract: An illumination device includes a metal base substrate in a flat planar shape, a plurality of LED modules, and a driving unit which drives each of the LEDs arranged on the metal base substrate. The LED modules have an organic substrate, a plurality of LEDs which are arranged on the organic substrate, a metal member, LED control signal terminals which are set on the edge of the organic substrate, and voltage feed terminals which are set on the edge of the organic substrate. The metal member corresponds to each LED and to which the heat from the LEDs is conducted, and which is electrically connected via a switch element from an electrode of the LED, and which penetrates the organic substrate toward its width direction from the LED mounting surface of the organic substrate and is exposed from the opposite surface.

Abstract translation: 照明装置包括平面形状的金属基底基板，多个LED模块以及驱动布置在金属基底基板上的每个LED的驱动单元。 LED模块具有有机基板，布置在有机基板上的多个LED，设置在有机基板的边缘上的金属部件，LED控制信号端子以及设置在有机基板的边缘上的电压馈送端子 有机基质。 金属构件对应于每个LED并且来自LED的热量被传导到该LED，并且其经由开关元件从LED的电极电连接，并且从LED的安装表面朝向其宽度方向穿过有机基板 有机基底并从相对表面露出。

公开(公告)号：US08704101B2

公开(公告)日：2014-04-22

申请号：US13539505

申请日：2012-07-02

Applicant: Shih-Hao Sun

Inventor： Shih-Hao Sun

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L23/3677 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5389 ,  H01L25/16 ,  H01L25/167 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09581 ,  H05K2201/10416 ,  H05K2203/1469 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In a manufacturing method of a package carrier, a substrate having an upper surface, a lower surface, and an opening communicating the two surfaces is provided. An electronic device is disposed inside the opening. A first insulation layer and a superimposed first metal layer are laminated on the upper surface; a second insulation layer and a superimposed second metal layer are laminated on the lower surface. The opening is filled with the first and second insulation layers. First blind holes, second blind holes, and a heat-dissipation channel are formed. A third metal layer is formed on the first and second blind holes and an inner wall of the heat-dissipation channel. A heat-conducting device is disposed inside the heat-dissipation channel and fixed into the heat-dissipation channel via an insulation material. The first and second metal layers are patterned to form a first patterned metal layer and a second patterned metal layer.

Abstract translation: 在包装载体的制造方法中，提供具有上表面，下表面和连通两个表面的开口的基板。 电子设备设置在开口内。 第一绝缘层和叠置的第一金属层层叠在上表面上; 第二绝缘层和叠加的第二金属层层叠在下表面上。 开口填充有第一和第二绝缘层。 形成第一盲孔，第二盲孔和散热通道。 在第一和第二盲孔和散热通道的内壁上形成第三金属层。 导热装置设置在散热通道的内部并通过绝缘材料固定到散热通道中。 图案化第一和第二金属层以形成第一图案化金属层和第二图案化金属层。

公开(公告)号：US20130228273A1

公开(公告)日：2013-09-05

申请号：US13862298

申请日：2013-04-12

Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.

Inventor： Wen-Chung Chiang

IPC: H05K13/00

CPC classification number: H05K13/00 ,  H01L23/3677 ,  H01L23/3735 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2924/01322 ,  H05K1/0204 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K2201/10416 ,  Y10T29/49128 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1057 ,  H01L2924/00

Abstract: A ceramic circuit board for use in packaging an electronic element includes a ceramic-copper plate, and a heat-dissipating unit that is adapted for dissipating heat from the electronic element. The ceramic-copperplate includes a ceramic substrate that has opposite first and second surfaces, and a through-hole formed through the first and second surfaces, a top copper pattern that overlies the first surface of the ceramic substrate and that has at least two conducting portions spaced apart from each other, and a bottom copper layer that underlies the second surface of the ceramic substrate. The heat-dissipating unit includes a heat-dissipating layer that is disposed in the through-hole of the ceramic substrate above the bottom copper layer and that has a thermal conductivity larger than that of the ceramic substrate. A method of making the ceramic circuit board is also disclosed.

Abstract translation: 用于封装电子元件的陶瓷电路板包括陶瓷铜板和适于从电子元件散热的散热单元。 陶瓷铜板包括具有相对的第一表面和第二表面的陶瓷基板和穿过第一和第二表面形成的通孔，顶部铜图案覆盖在陶瓷基板的第一表面上，并且具有至少两个导电部分 彼此间隔开的底部铜层和位于陶瓷基板的第二表面下方的底部铜层。 散热单元包括散热层，该散热层设置在陶瓷基板的贯通孔底部铜层的上方，导热率大于陶瓷基板的导热率。 还公开了制造陶瓷电路板的方法。

公开(公告)号：US08415565B2

公开(公告)日：2013-04-09

申请号：US12585293

申请日：2009-09-10

Applicant: Shigeki Nagase ,  Motoo Nakai ,  Kouya Yoshida ,  Hiroshi Sumasu ,  Nobuhiro Uchida

Inventor： Shigeki Nagase ,  Motoo Nakai ,  Kouya Yoshida ,  Hiroshi Sumasu ,  Nobuhiro Uchida

IPC: H05K1/00

CPC classification number: H05K1/021 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0298 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/10416 ,  H05K2203/049 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A multilayer circuit substrate includes: a laminated circuit portion in which conductive layers and resin insulating layers are alternately laminated; and a metal substrate portion, wherein the laminated circuit portion is fixed to the metal substrate portion so that at least part of a lower surface of the laminated circuit portion is in contact with at least part of an upper surface of the metal substrate portion. An electronic component is mounted on the metal substrate portion.

Abstract translation: 多层电路衬底包括：层叠电路部分，其中导电层和树脂绝缘层交替层叠; 以及金属基板部，其中，所述层叠电路部固定在所述金属基板部，使得所述层叠电路部的下表面的至少一部分与所述金属基板部的上表面的至少一部分接触。 电子部件安装在金属基板部分上。

公开(公告)号：US08354597B2

公开(公告)日：2013-01-15

申请号：US12216511

申请日：2008-07-07

Applicant: Takahiko Yokai ,  Toshiki Naito

Inventor： Takahiko Yokai ,  Toshiki Naito

IPC: H05K1/03 ,  G11B5/48 ,  H05K1/00

CPC classification number: H05K1/05 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/09745 ,  H05K2201/10416 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/0723 ,  Y10T29/49124

Abstract: A wired circuit board includes a metal supporting board having at least one depressed portion, a conductive portion embedded in the at least one depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wires formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.

Abstract translation: 布线电路板包括具有至少一个凹陷部分的金属支撑板，嵌入至少一个凹陷部分中的导电部分并且由具有比金属支撑板的导电性更高的导电性的材料形成，绝缘层形成在 金属支撑板以覆盖导电部分，并且以相互间隔的关系形成在绝缘层上以与导电部分相对的多个导线。

公开(公告)号：US20120217525A1

公开(公告)日：2012-08-30

申请号：US13283605

申请日：2011-10-28

Applicant: SHIUN-WEI CHAN ,  CHIH-HSUN KE ,  CHAO-HSIUNG CHANG

Inventor： SHIUN-WEI CHAN ,  CHIH-HSUN KE ,  CHAO-HSIUNG CHANG

IPC: H01L33/60

CPC classification number: H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/1815 ,  H01L2924/18165 ,  H05K1/0204 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00014

Abstract: An LED package includes a light transmissive encapsulation, an LED die embedded in the encapsulation from a bottom surface of the encapsulation, a positive electrode electrically connected to an anode of the LED die, and a negative electrode electrically connected to a cathode of the LED die. The encapsulation includes a light emitting surface opposite to the bottom surface thereof. The LED die includes a front surface for outputting light outward, and a back surface opposite to the front surface. The front surface is covered by the encapsulation and faces the light emitting surface of the encapsulation. The back surface is exposed outside. A light emitting device is provided by mounting the LED package to a circuit board. The circuit board has a heat conductor connecting with the LED die.

Abstract translation: LED封装包括透光封装，嵌入从封装底表面的封装中的LED管芯，与LED管芯的阳极电连接的正电极，以及与LED管芯的阴极电连接的负电极 。 封装包括与其底表面相对的发光表面。 LED管芯包括用于向外输出光的前表面和与前表面相对的后表面。 前表面被封装覆盖，并面向封装的发光表面。 背面暴露在外面。 通过将LED封装安装到电路板来提供发光器件。 电路板具有与LED管芯连接的导热体。

公开(公告)号：US08253026B2

公开(公告)日：2012-08-28

申请号：US12414780

申请日：2009-03-31

Applicant: Steffen Strauss ,  Michael Weis

Inventor： Steffen Strauss ,  Michael Weis

IPC: H05K7/20

CPC classification number: H05K1/0207 ,  F21K9/00 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00

Abstract: A printed circuit board is provided with at least one via hole, in which a heat dissipating element is arranged, wherein at least one radiant source is arranged on the heat dissipating element. The lighting device is provided with at least one such printed circuit board.

Abstract translation: 印刷电路板设置有至少一个通孔，其中布置有散热元件，其中至少一个辐射源设置在散热元件上。 照明装置设置有至少一个这样的印刷电路板。

公开(公告)号：US20120002374A1

公开(公告)日：2012-01-05

申请号：US13232358

申请日：2011-09-14

Applicant: Hiroshi KATO ,  Kyohei TAKEUCHI

Inventor： Hiroshi KATO ,  Kyohei TAKEUCHI

IPC: H05K7/20

CPC classification number: H05K7/08 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/308 ,  H05K7/2049 ,  H05K7/205 ,  H05K2201/09054 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10689

Abstract: The electronic control device includes: a printed circuit board; a heat-generating member having a plurality of legs which are mounted on the printed circuit board by connections between the legs and the printed circuit board; and a casing which radiates heat that is transferred from the heat-generating member, wherein: the legs are connected via press-fit connections with the printed circuit board.

Abstract translation: 电子控制装置包括：印刷电路板; 具有多个腿部的发热部件，其通过腿部和印刷电路板之间的连接安装在印刷电路板上; 以及辐射从发热部件传递的热量的壳体，其中：腿部通过压配合连接到印刷电路板。

公开(公告)号：US20110096495A1

公开(公告)日：2011-04-28

申请号：US12994286

申请日：2009-05-26

Applicant: Andreas Heise

Inventor： Andreas Heise

IPC: H05K7/20 ,  H05K3/30

CPC classification number: H05K1/0263 ,  H05K1/0204 ,  H05K2201/10416 ,  Y10T29/4913

Abstract: Circuit board arrangement, in particular multiple layer circuit board arrangement with at least one low-power circuit path, wherein the circuit board arrangement is suitable for population with at least one electronic circuit board element to be cooled, wherein the circuit board consisting of a nonconductive material includes at least one cooling inlay embedded in the circuit board for cooling of the power component, wherein the cooling inlay forms at least in part, a high power guide element for the at least one electronic power component, wherein the line cross section or the power carry capacity of the high power guide element is significantly greater than the line cross section or the current carry capacity of the low power circuit path, and wherein the high power guide element is used and/or is also used for electrical contacting of the power component.

Abstract translation: 电路板布置，特别是具有至少一个低功率电路路径的多层电路板布置，其中电路板布置适合具有至少一个要冷却的电子电路板元件的群体，其中由不导电的电路板组成的电路板 材料包括嵌入在电路板中用于冷却功率部件的至少一个冷却嵌体，其中冷却嵌体至少部分地形成用于至少一个电子功率部件的高功率引导元件，其中，线截面或 高功率引导元件的功率承载能力明显大于低功率电路路径的线路截面或当前承载能力，并且其中使用高功率引导元件和/或还用于电力的电接触 零件。