公开(公告)号：US09781798B2

公开(公告)日：2017-10-03

申请号：US15093558

申请日：2016-04-07

Applicant: Xicato, Inc.

Inventor： Gerard Harbers ,  Barry Mark Loveridge ,  Martin Emil Mueller ,  Peter K. Tseng ,  Warren A. Kartadinata

IPC: H05B37/02 ,  H05B33/08 ,  F21V23/00 ,  F21V23/04 ,  F21V29/70 ,  H05K1/02 ,  H05K1/18 ,  F21V7/00 ,  F21V17/10 ,  F21V23/06 ,  F21Y105/10 ,  F21K9/64 ,  F21Y115/10 ,  F21Y101/02

CPC classification number: H05B33/0854 ,  F21K9/64 ,  F21V7/00 ,  F21V17/10 ,  F21V23/006 ,  F21V23/0435 ,  F21V23/0464 ,  F21V23/06 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05B37/0272 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10159

Abstract: An LED based illumination device includes a plurality of LEDs that emit light through an output port of a housing. The LED based illumination device includes a heat sink that is in thermal contact with the plurality of LEDs. A peripheral electrical circuit board is configured to be contained within the housing, e.g., surrounding at least a portion of the heat sink. The peripheral electrical circuit board may include a radio frequency (RF) transceiver configured to communicate data between the LED based illumination device and another electronic device. A primary electrical circuit board may be electrically coupled to the peripheral electrical circuit board and electrically coupled to the plurality of LEDs.

公开(公告)号：US09769992B2

公开(公告)日：2017-09-26

申请号：US13926198

申请日：2013-06-25

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Joseph Hendrik Anna Maria Jacobs

IPC: A01G9/22 ,  A01G9/26 ,  D03D1/00 ,  D03D15/00 ,  F41H3/02 ,  H05K1/02 ,  H05K1/03

CPC classification number: A01G9/26 ,  A01G9/20 ,  A01G9/22 ,  D03D1/0047 ,  D03D1/007 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/0011 ,  D03D15/0066 ,  D03D15/0088 ,  D10B2101/06 ,  D10B2101/08 ,  D10B2101/20 ,  D10B2321/041 ,  D10B2321/10 ,  D10B2401/16 ,  D10B2401/22 ,  D10B2505/18 ,  F41H3/02 ,  H05K1/0274 ,  H05K1/038 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10113 ,  Y02A40/258 ,  Y02A40/274

Abstract: A shading device for a greenhouse includes a shading element and at least one lighting element, wherein the shading element comprises an outer side and an inner side. The shading element is formed from interwoven electrically conductive first thread elements and electrically insulating second thread elements. The first and/or second thread elements each may be adapted for reflecting an ambient light. The lighting element(s) may be arranged at the inner side of the shading element and connected with the first thread elements, and the lighting element(s) may be driven by an electrical current, conducted by the first thread elements, resulting in the emission of an artificial light, which may illuminate a plant growing in the greenhouse.

公开(公告)号：US09769970B2

公开(公告)日：2017-09-19

申请号：US14971380

申请日：2015-12-16

Applicant: Panasonic Factory Solutions Asia Pacific

Inventor： Mun Ji Low ,  Xiao Wang ,  Poh Hwee William Chua ,  Kim Sui Wong ,  Guanghui Yang

IPC: B07C5/08 ,  H05K13/04 ,  B07C5/344 ,  B07C1/06 ,  G01V8/12 ,  H05K13/08 ,  H05K13/02 ,  H01L21/67 ,  H05K1/18

CPC classification number: G01V8/12 ,  B07C1/06 ,  B07C5/344 ,  H01L21/67271 ,  H05K1/181 ,  H05K13/028 ,  H05K13/0813 ,  H05K13/082 ,  H05K2201/10106

Abstract: An apparatus and method for feeding electronic components for insertion onto circuit boards, the apparatus comprising: a vibratory bowl configured for receiving electronic components and for lining up the electronic components onto a moveable conveyor, the vibratory bowl is configured for vibrating and guiding each of the electronic components towards an opening in the vibratory bowl where each of the electronic components is transferred to the conveyor; a component processing unit configured for checking operation of each of the electronic components lined up along the conveyor and for removing any defective electronic component failing the operation check; and a component feeder configured for transferring each of the electronic components that are non-defective to a machine for handling insertion of the electronic components onto circuit boards.

公开(公告)号：US09761766B2

公开(公告)日：2017-09-12

申请号：US15013457

申请日：2016-02-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kosuke Takehara ,  Hisaki Fujitani ,  Naoki Tagami

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L33/60 ,  H01L33/20 ,  H01L33/54 ,  H01L33/44 ,  H01L25/075 ,  H05K1/02

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05K1/0274 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED module includes a mount board and an LED chip. The mount board includes: an insulation substrate that includes resin and glass; a first conductor, a second conductor and a third conductor; and a white resist layer. The white resist layer is provided with a first opening, a second opening and at least one third opening for exposing the first conductor, the second conductor and the third conductor, respectively. The LED module further includes a wavelength conversion layer disposed between the LED chip and the third conductor in a thickness direction of the LED chip. The wavelength conversion layer includes phosphor particles that are excited by first light emitted from the LED chip to emit second light having wavelengths greater than wavelengths of the first light.

公开(公告)号：US09759405B2

公开(公告)日：2017-09-12

申请号：US15132243

申请日：2016-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang Ho Shin ,  Seok Chan Hong ,  Sung Oh Ahn

IPC: F21V13/04 ,  H01L33/60 ,  H05K3/00 ,  F21K9/60 ,  F21V5/04 ,  F21V7/05 ,  G02F1/1335

CPC classification number: F21V13/04 ,  F21K9/60 ,  F21V5/04 ,  F21V7/05 ,  G02F1/133611 ,  H01L33/60 ,  H05K3/0052 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2201/209

Abstract: A light emitting module includes a circuit board having a plurality of reflective portions arranged in one direction and connection portions connecting the plurality of reflective portions, light emitting devices mounted on the plurality of reflective portions, and lens units disposed to cover the light emitting devices within boundaries of surfaces, of the plurality of reflective portions, on which the light emitting devices are mounted. A width of each of the connection portions in the other direction, perpendicular to the one direction thereof, is smaller than a diameter of each of the lens units, thus reducing a generation of a dark portion.

公开(公告)号：US09756698B2

公开(公告)日：2017-09-05

申请号：US15211813

申请日：2016-07-15

Applicant: JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD.

Inventor： Aiming Xiong ,  Xintong Liu ,  Xiaojia Wu

IPC: H05B37/00 ,  H05B41/00 ,  H05B33/08 ,  F21K9/278 ,  F21K9/272 ,  F21V15/015 ,  F21V23/06 ,  F21V19/02 ,  F21V29/70 ,  F21V23/00 ,  F21Y115/10

CPC classification number: H05B33/0887 ,  F21K9/272 ,  F21K9/278 ,  F21V3/02 ,  F21V15/015 ,  F21V19/02 ,  F21V23/003 ,  F21V23/02 ,  F21V23/06 ,  F21V25/04 ,  F21V29/70 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05B33/0815 ,  H05B33/083 ,  H05K1/147 ,  H05K2201/10106 ,  H05K2201/10295

Abstract: An LED tube lamp is disclosed. The LED tube lamp includes an LED module for emitting light, the LED module comprising an LED unit comprising an LED; a rectifying circuit for rectifying an external driving signal to produce a rectified signal; and a mode determination circuit configured to detect a state of a property of the rectified signal, for selectively determining on performing a first mode or a second mode of lighting according to the state of the property of the rectified signal; wherein when the LED tube lamp performs the first mode of lighting, the mode determination circuit allows continual current to flow through the LED unit until the external driving signal is disconnected from the LED tube lamp; and when the LED tube lamp performs the second mode of lighting, the mode determination circuit regulates the continuity of current to flow through the LED unit.

公开(公告)号：US20170244015A1

公开(公告)日：2017-08-24

申请号：US15591112

申请日：2017-05-10

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Hiroto TAMAKI

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/28 ,  H01L33/32 ,  H01L33/30 ,  H05K1/18 ,  H01L33/50 ,  H05K1/03 ,  H05K1/11 ,  H05K1/09 ,  H05K1/02 ,  H01L33/64 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/282 ,  H05K2201/0209 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer, an internal conductive layer, a lower conductive layer, vias, and a covering layer. The upper conductive layer is disposed on an upper surface of the uppermost ceramic layer. The internal conductive layer is interposed between the ceramic layers. The lower conductive layer is disposed on a lower surface of the lowermost ceramic layer. The vias connect the upper conductive layer, the internal conductive layer, and the lower connective layer. The covering layer covers a portion of the upper conductive layer. The upper conductive layer includes a covered region covered with the covering layer and an element mount region. An upper surface of the element mount region is higher than an upper surface of the covered portion.

公开(公告)号：US20170241601A1

公开(公告)日：2017-08-24

申请号：US15503947

申请日：2014-08-22

Applicant: TAOLIGHT COMPANY LIMITED

Inventor： Huahui Li ,  Jiezhao Wang ,  Yingying Zhao ,  Bertrand Delalande ,  Bruno Couthouis ,  Jean-Eudes Leroy ,  Libo Wu

IPC: F21K9/65 ,  F21K9/232 ,  H05K1/05 ,  H05B33/08 ,  F21V19/00 ,  F21V29/70

CPC classification number: F21K9/65 ,  F21K9/232 ,  F21K9/62 ,  F21S10/023 ,  F21V19/0015 ,  F21V29/70 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0857 ,  H05K1/053 ,  H05K2201/10106 ,  Y02B20/383

Abstract: An illumination device including an LED mounting platform (2) having a peripheral region (2a) and a relatively inner region (2b); at least one warm white LED (3) and at least one cool white LED (4) mounted adjacent the peripheral region (2a) of the LED mounting platform (2), and, at least one RGB LED (5) mounted adjacent the relatively inner region (2b) of the LED mounting platform (2); a diffusion cover (10) configured to allow light emitted from the at least one warm white LED (3), the at least one cool white LED (4), and the at least one RGB LED (5) to pass therethrough; and wherein at least one light emission characteristic of light emitted from the at least one warm white LED (3), the at least one cool white LED (4), and/or the at least one RGB LED (5) is configured to be selectably varied in response to an input control signal so as to produce a plurality of lighting modes.

公开(公告)号：US20170238415A1

公开(公告)日：2017-08-17

申请号：US15518797

申请日：2015-10-02

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Mitsuru KOBAYASHI

IPC: H05K1/02 ,  G01S17/08 ,  G01V8/12

CPC classification number: H05K1/0284 ,  G01S17/08 ,  G01V8/12 ,  H01L2224/48091 ,  H01L2924/15153 ,  H01L2924/15159 ,  H05K1/119 ,  H05K1/141 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10378 ,  H01L2924/00014

Abstract: A three-dimensional circuit substrate according to the present disclosure includes a base body and a wiring pattern formed on an outer surface of the base body. Also, the outer surface of the base body includes a mounting surface which faces the substrate when the three-dimensional circuit substrate is mounted onto the substrate, and an installation surface which is different from the mounting surface and is a surface where an electronic component is installable. Further, a recess is formed on a side where the mounting surface is provided in the base body.

公开(公告)号：US09730319B2

公开(公告)日：2017-08-08

申请号：US14568544

申请日：2014-12-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Man Hue Choi ,  Min Jae Kim ,  Se Woong Na ,  Hyun Gyu Park ,  In Hee Cho ,  Seung Kwon Hong

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  G02F1/1335

CPC classification number: H05K1/0281 ,  G02F1/133615 ,  G02F2001/133612 ,  H05K1/0278 ,  H05K1/181 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/046 ,  H05K2201/10106

Abstract: Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.