公开(公告)号：US08309858B2

公开(公告)日：2012-11-13

申请号：US12358869

申请日：2009-01-23

Applicant: Akihiro Kojima ,  Yoshiaki Sugizaki ,  Yoshiaki Shimooka

Inventor： Akihiro Kojima ,  Yoshiaki Sugizaki ,  Yoshiaki Shimooka

IPC: H05K1/16

CPC classification number: B81B7/0038 ,  B81B2201/0221 ,  B81B2203/04 ,  B81C1/00476

Abstract: A substrate includes a functional element. An insulating first film forms a cavity which stores the functional element, together with the substrate, and includes a plurality of through-holes. An insulating second film covers the plurality of through-holes, is formed on the first film, and has a gas permeability which is higher than that of the first film. An insulating third film is formed on the second film and has a gas permeability which is lower than the second film. An insulating fourth film is formed on the third film and has an elasticity which is larger than the third film.

Abstract translation: 衬底包括功能元件。 绝缘的第一膜形成空腔，其与基板一起存储功能元件，并且包括多个通孔。 绝缘的第二膜覆盖多个通孔，形成在第一膜上，并且具有比第一膜高的透气性。 在第二薄膜上形成绝缘的第三薄膜，其透气度低于第二薄膜。 绝缘的第四膜形成在第三膜上，并且具有大于第三膜的弹性。

公开(公告)号：US20120228726A1

公开(公告)日：2012-09-13

申请号：US13413889

申请日：2012-03-07

Applicant: Tomohiro SAITO

Inventor： Tomohiro SAITO

IPC: H01L29/84 ,  H01L21/02

CPC classification number: H01G5/18 ,  B81B2201/018 ,  B81B2201/0221 ,  B81B2203/0109 ,  B81C1/00611 ,  B81C2201/0126

Abstract: According to one embodiment, a MEMS includes a first electrode, a first auxiliary structure and a second electrode. The first electrode is provided on a substrate. The first auxiliary structure is provided on the substrate and adjacent to the first electrode. The first auxiliary structure is in an electrically floating state. The second electrode is provided above the first electrode and the first auxiliary structure,

Abstract translation: 根据一个实施例，MEMS包括第一电极，第一辅助结构和第二电极。 第一电极设置在基板上。 第一辅助结构设置在基板上并与第一电极相邻。 第一辅助结构处于电浮动状态。 第二电极设置在第一电极和第一辅助结构之上，

公开(公告)号：US20100214716A1

公开(公告)日：2010-08-26

申请号：US12391083

申请日：2009-02-23

Applicant: Lianjun Liu ,  Melvy F. Miller

Inventor： Lianjun Liu ,  Melvy F. Miller

IPC: H01G5/16 ,  H01L21/20 ,  H01L21/02

CPC classification number: H01G5/011 ,  B81B3/0072 ,  B81B2201/0221 ,  H01G5/18 ,  H01L28/40 ,  H01L41/0973 ,  Y10T29/435

Abstract: A MEMS capacitive device (90) includes a fixed capacitor plate (104) formed on a surface (102) of a substrate (100). A movable capacitor plate (114) is suspended above the fixed capacitor plate (104) by compliant members (116) anchored to the surface (102). A movable element (120) is positioned in spaced apart relationship from the movable capacitor plate (104) and has an actuator (130) formed thereon. Actuation of the actuator (130) causes abutment of a portion of the movable element (120) against a contact surface (136) of the movable plate (114). The abutment moves the movable plate (114) toward the fixed plate (104) to alter a capacitance (112) between the plates (104, 114). Another substrate (118) may be coupled to the substrate (100) such that a surface (126) of the substrate (118) faces the surface (102) of the substrate (100). The movable element (120) may be formed on the surface (126).

Abstract translation: MEMS电容器件（90）包括形成在衬底（100）的表面（102）上的固定电容器板（104）。 可移动电容器板（114）通过锚固到表面（102）的柔性构件（116）悬置在固定电容器板（104）的上方。 可移动元件（120）与可移动电容器板（104）间隔开并且具有形成在其上的致动器（130）。 致动器（130）的致动导致可移动元件（120）的一部分抵靠可动板（114）的接触表面（136）。 抵靠将可移动板（114）移向固定板（104）以改变板（104,114）之间的电容（112）。 衬底（118）可以耦合到衬底（100），使得衬底（118）的表面（126）面向衬底（100）的表面（102）。 可移动元件（120）可以形成在表面（126）上。