公开(公告)号：US20120063139A1

公开(公告)日：2012-03-15

申请号：US13320527

申请日：2010-05-11

Applicant: Ulrich Benkart ,  Andreas Kampfrath ,  Anton Lauerer

Inventor： Ulrich Benkart ,  Andreas Kampfrath ,  Anton Lauerer

IPC: F21V21/00 ,  B23P11/00

CPC classification number: H05K3/284 ,  B29C39/10 ,  B29C39/12 ,  F21S4/24 ,  F21V31/005 ,  F21Y2115/10 ,  H01R25/162 ,  H05K1/0286 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/40 ,  H05K2201/0133 ,  H05K2201/0909 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2203/1147 ,  Y10T29/49826

Abstract: A light band (1;19;33;40), comprising a band-shaped carrier (4,5) for at least one light source (6), in particular a light emitting diode (6), wherein the carrier includes electrical contacts (7), and at least one sealing hood (2,2a,2b;10,10a,10b;16;34; 41a,41b) fastened to the carrier (4,5), which at least partially overarches at least one of the electrical contacts.

Abstract translation: 包括用于至少一个光源（6）的带状载体（4,5），特别是发光二极管（6）的光带（1; 19; 33; 40），其中所述载体包括电接触 （7）中的至少一个以及紧固到所述载体（4,5）上的至少一个密封罩（2,2a，2b; 10,10a，10b; 16; 34; 41a，41b），所述密封罩至少部分地覆盖 电接点。

公开(公告)号：US08105453B2

公开(公告)日：2012-01-31

申请号：US12029545

申请日：2008-02-12

Applicant: Akiyoshi Kawamura ,  Takayuki Tsukizawa ,  Tetsuya Ikeda

Inventor： Akiyoshi Kawamura ,  Takayuki Tsukizawa ,  Tetsuya Ikeda

IPC: C03B29/00 ,  B32B13/04 ,  B32B3/14

CPC classification number: H05K3/0052 ,  H01L21/4807 ,  H05K1/0272 ,  H05K1/0306 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/0909 ,  H05K2201/09163 ,  H05K2201/09781 ,  Y10T428/166

Abstract: In a method for producing a multilayer ceramic substrate, a green ceramic laminate includes green conductive patterns arranged on a plurality of ceramic green sheets and portions to be formed into a plurality of multilayer ceramic substrates. Boundary-defining conductive patterns are arranged on the ceramic green sheets and along boundaries of the multilayer ceramic substrates. The boundary-defining conductive patterns have firing shrinkage characteristics that are different from those of the ceramic green sheets. During firing of the green ceramic laminate, cavities adjacent to edges of the boundary-defining conductive patterns are formed. A sintered ceramic laminate is divided at edges passing through the cavities.

Abstract translation: 在多层陶瓷基板的制造方法中，生坯陶瓷层叠体包括布置在多个陶瓷生片上的绿色导电图案和形成多个多层陶瓷基板的部分。 边界限定导电图案布置在陶瓷生片上并沿着多层陶瓷基片的边界。 边界限定导电图案具有与陶瓷生片不同的焙烧收缩特性。 在焙烧生坯陶瓷层压板期间，形成与边界限定导电图案的边缘相邻的空腔。 烧结的陶瓷层压体在通过空腔的边缘处分开。

公开(公告)号：US20120012368A1

公开(公告)日：2012-01-19

申请号：US13242043

申请日：2011-09-23

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K1/142 ,  H05K3/36 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/096

Abstract: A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material.

Abstract translation: 一种布线基板，包括：具有基材的主基板和具有开口部分;以及柔性刚性印刷布线板，其与主基板连接在主基板的开口部分中，并且包括刚性基板和柔性基板，刚性 基材包括非柔性基材，柔性基材包括柔性基材。

公开(公告)号：US20110271522A1

公开(公告)日：2011-11-10

申请号：US13121896

申请日：2008-07-17

Applicant: Charles Still ,  David R. Stoscup

Inventor： Charles Still ,  David R. Stoscup

IPC: H05K3/00

CPC classification number: H05K3/363 ,  H05K1/0269 ,  H05K1/141 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09918 ,  H05K2203/0195 ,  H05K2203/082 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: In an embodiment of the present invention a method for making an electronic assembly is provided. The method comprises positioning a substrate having a plurality of segmented portions. A first segmented portion has a first plurality of conductive traces terminating to form a first plurality of conductive pads. A second segmented portion has a second plurality of conductive traces terminating to form a second plurality of conductive pads. A flex circuit is placed onto the conductive pads. The flex circuit includes a third plurality of conductive traces terminating at a first end to form a first plurality of connecting pads and terminating at a second end to form a second plurality of connecting pads. Electronic components are electrically coupled to the first and second plurality of conductive traces to form a primary PCB and a daughter PCB. The connecting pads are electrically coupled to the conductive pads for electrically coupling the daughter PCB to the primary PCB.

Abstract translation: 在本发明的实施例中，提供了一种用于制造电子组件的方法。 该方法包括定位具有多个分段部分的基底。 第一分段部分具有终止以形成第一多个导电焊盘的第一多个导电迹线。 第二分段部分具有终止以形成第二多个导电焊盘的第二多个导电迹线。 柔性电路放置在导电焊盘上。 柔性电路包括第三多个导电迹线，其终止于第一端以形成第一多个连接焊盘，并在第二端处终止以形成第二多个连接焊盘。 电子部件电耦合到第一和第二多个导电迹线以形成初级PCB和子PCB。 连接焊盘电耦合到导电焊盘，用于将子PCB电连接到主PCB。

公开(公告)号：US20110247207A1

公开(公告)日：2011-10-13

申请号：US13164776

申请日：2011-06-21

Applicant: JUN-QING ZHANG ,  CHIH-YI TU ,  SZU-MIN HUANG

Inventor： JUN-QING ZHANG ,  CHIH-YI TU ,  SZU-MIN HUANG

IPC: H05K3/46 ,  H05K3/40 ,  H05K3/36

CPC classification number: H05K3/4697 ,  H05K1/0393 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0394 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit being created so as to align with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract translation: 一种制造多层FPCB的方法，包括提供第一基板，第二基板和粘合剂层; 在粘合剂层上限定开口; 限定所述第一基板的介电层中的第一狭缝; 层压第一基板，粘合剂层和第二基板; 在所述第一基板的所述导电层中形成第二狭缝，所述第二狭缝被形成为与所述第一狭缝对准，切割所述第一基板，所述粘合剂层和所述第二基板，从而形成具有不同数量的多层柔性印刷电路板 的层次在不同的地区。

公开(公告)号：US08022305B2

公开(公告)日：2011-09-20

申请号：US12428860

申请日：2009-04-23

Applicant: Takashi Yui ,  Atsushi Saiki

Inventor： Takashi Yui ,  Atsushi Saiki

IPC: H05K1/00

CPC classification number: H05K3/0052 ,  H05K3/005 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/167 ,  Y10T29/4913

Abstract: A semiconductor device fabrication method includes: forming an elongated hole 5 in a wiring board plate along a perimeter line 3 of a plurality of wiring board regions defined over the wiring board plate with a connecting portion left unremoved at a corner of each of the wiring board regions; mounting semiconductor elements on the wiring board regions; and cutting the connecting portion using a punch 8 to isolate the wiring board regions from the wiring board plate into wiring boards. Each of the wiring boards has a cut edge formed by the punch, the cut edge starting from an end of the elongated hole 5 provided on a first side of the perimeter line 3 and extending across part of the connecting portion inside the perimeter line 3, the cut edge being angled inward of the wiring board so as to slope downward from the end of the elongated hole 5.

Abstract translation: 半导体器件制造方法包括：沿着布线板板上限定的多个布线板区域的周边线3在布线板板上形成细长孔5，其中连接部分在左边未被移除在每个布线板的拐角处 区域; 将半导体元件安装在布线板区域上; 并使用冲头8切割连接部分，以将布线板区域与布线板板隔离成线路板。 每个布线板具有由冲头形成的切割边缘，切割边缘从设置在周边线3的第一侧上的细长孔5的端部开始并延伸穿过周边线3内的连接部分的一部分， 切割边缘从布线板向内倾斜，从而从细长孔5的端部向下倾斜。

公开(公告)号：US07981758B2

公开(公告)日：2011-07-19

申请号：US12908317

申请日：2010-10-20

Applicant: Huankiat Seh ,  Yongki Min ,  Islam A. Salama

Inventor： Huankiat Seh ,  Yongki Min ,  Islam A. Salama

IPC: H01L21/02

CPC classification number: H05K1/185 ,  H01L23/50 ,  H01L23/642 ,  H01L24/97 ,  H01L25/50 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/183 ,  H05K3/0032 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49146

Abstract: A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer, depositing one or more passive electronic components into each of the plurality of separated non-removed portions, and curing the separated non-removed portions of the dielectric layer.

Abstract translation: 一种方法可以包括将电介质层沉积到衬底上，去除电介质层的部分以产生电介质层的多个分离的未除去部分，将一个或多个无源电子元件沉积到多个分离的未除去的每一个中 部分，并且固化电介质层的分离的未除去部分。

公开(公告)号：US07940339B2

公开(公告)日：2011-05-10

申请号：US11644251

申请日：2006-12-21

Applicant: Yasuo Horiuchi

Inventor： Yasuo Horiuchi

IPC: H04N5/64

CPC classification number: H05K3/301 ,  H04N5/64 ,  H04N5/642 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10606

Abstract: The formation of the retaining member 42 at the forming of the main board 40 so as to be able to be cut off and the cutting-off from the main board 40 after the board forming of the main board 40 causes the retaining member 42 to be separated in a letterpress shape from the main board 40. In addition, on the main board 40, the earphone plug socket 44 is mounted with the plug-in inlet 44b facing the outer periphery, the slit is formed and the projected part 43a of the retaining member 42 is fitted into the slit as well. Further, the fitting of the retaining member 42 into the slit 46 causes the side edge 43b thereof to abut on a groove 44a at the back surface of the earphone plug socket 44.

Abstract translation: 在主板40的板形成之后，在形成主板40时能够被切断和从主板40的切断形成保持构件42，使得保持构件42成为 从主板40以凸版形状分离。此外，在主板40上，耳机插头插座44安装有插入口44b，其面向外周，形成狭缝，并且形成了突出部43a 保持构件42也嵌合在狭缝中。 此外，将保持构件42装配到狭缝46中使得其侧边缘43b抵靠在耳机插头插座44的后表面处的凹槽44a上。

公开(公告)号：US07884725B2

公开(公告)日：2011-02-08

申请号：US11766752

申请日：2007-06-21

Applicant: James Robert Kruest ,  Gary Bann

Inventor： James Robert Kruest ,  Gary Bann

IPC: G08B13/14 ,  H04Q5/22

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: RFID tags are used for many purpose including tracking. RFID interrogators are used to retrieve information from tags. In many applications, RFID interrogators and RFID tags remain stationary during interrogation. Regions of low energy due to interference from either additional antenna or reflections from RFID tags and objects can impede or prohibit the reading of RFID tags residing in such regions. Stirring of the generated electromagnetic field is a method of moving around the regions of low energy, where tags can not be read, during the interrogation process. Mechanical stirring is accomplished by introducing a conductor into the electromagnetic field and moving it about in the field. Solid state stirring is accomplished by introducing a variable conductor into the field and varying the conductivity of the variable conductor. Mathematical stirring is accomplished by use of a plurality of antenna and controlling the phase difference between the antenna in a configuration known as phased antenna arrays.

Abstract translation: RFID标签用于许多目的，包括跟踪。 RFID询问器用于从标签中检索信息。 在许多应用中，RFID询问器和RFID标签在询问期间保持静止。 由于来自任何附加天线的干扰或来自RFID标签和物体的反射导致的低能量区域可能阻碍或禁止读取驻留在这些区域中的RFID标签。 所产生的电磁场的搅动是在询问过程期间围绕标签不能被读取的低能量区域移动的方法。 机械搅拌通过将导体引入电磁场并在现场移动来实现。 通过将可变导体引入到场中并改变可变导体的导电性来实现固态搅拌。 通过使用多个天线来实现数学搅拌，并且以称为相控天线阵列的配置来控制天线之间的相位差。

公开(公告)号：US07875969B2

公开(公告)日：2011-01-25

申请号：US12585467

申请日：2009-09-16

Applicant: Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H01L23/12 ,  H01L23/14

CPC classification number: H05K3/4691 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.

Abstract translation: 刚性柔性PCB包括至少一个刚性PCB（RPCB）和至少一个柔性PCB（FPCB）。 每个RPCB都有一个连接部分; 第一和第二部分分别从连接部分的两个侧边缘延伸并且每个具有至少一个FPCB接合侧; 以及沿着连接部分和第一和第二部分的每个接头形成的弱化结构。 每个FPCB具有对应于RPCB上的连接部分的弯曲部分; 第一和第二部分分别从弯曲部分的两个侧边缘延伸并且具有至少一个RPCB接合侧，每个RPCB接合侧对应于RPCB的第一和第二部分的FPCB接合侧。 当对弱化结构施加适当的压力时，RPCB可以容易地在弱化结构处弯曲断裂以从其中移除连接部分。