公开(公告)号：US5248852A

公开(公告)日：1993-09-28

申请号：US600803

申请日：1990-10-22

Applicant: Koichi Kumagai

Inventor： Koichi Kumagai

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28

CPC classification number: H01L24/96 ,  H01L24/24 ,  H05K1/185 ,  H05K3/284 ,  H01L2224/24195 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/095 ,  H05K2201/0209 ,  H05K2201/09118 ,  H05K2203/1316 ,  H05K2203/1469 ,  H05K3/28

Abstract: A resin circuit substrate includes: a plurality of electronic parts having electrodes to be electrically connected to each other, with surfaces of the electrodes being disposed flush with each other; a resin for integrally molding surfaces of the electronic parts other than the surfaces of the electrodes so that the electronic parts are retained with the resin; and a circuit pattern for electrically connecting the electrodes to each other, the circuit pattern being laminated on exposed surfaces of the electrodes. A method for manufacturing the resin circuit substrate includes the steps of: positioning the electronic parts on a base having a flat surface so that surfaces of the electrodes contact the flat surface of the base; molding the electronic parts so as to be integrated with the resin on the flat surface thereof to form a molded part; hardening, drying or aging the molded part integrated with the electronic parts; removing the base from the molded part; printing a conductive resin onto the molded part to form a circuit pattern in such a manner that the conductive resin is laminated on a surface, of the molded part, including the surfaces of the electrodes; and hardening or drying the conductive resin.

Abstract translation: 树脂电路基板包括：具有彼此电连接的电极的多个电子部件，电极的表面彼此齐平设置; 用于使电子部件的除电极表面之外的表面一体成形以使电子部件与树脂保持的树脂; 以及用于将电极彼此电连接的电路图案，电路图案层压在电极的暴露表面上。 制造树脂电路基板的方法包括以下步骤：将电子部件定位在具有平坦表面的基底上，使得电极的表面与基体的平坦表面接触; 将电子部件模制成与其平坦表面上的树脂一体化以形成模制部件; 硬化，干燥或老化与电子部件集成的模制零件; 从模制部件移除基部; 将导电树脂印刷到模制部件上以形成电路图案，使得导电树脂层压在包括电极表面的模制部件的表面上; 并硬化或干燥导电树脂。

公开(公告)号：US5179601A

公开(公告)日：1993-01-12

申请号：US785000

申请日：1991-10-30

Applicant: Masao Gotoh ,  Makoto Iida ,  Kenichi Waragai ,  Yonezo Yanokura ,  Masaki Sato

Inventor： Masao Gotoh ,  Makoto Iida ,  Kenichi Waragai ,  Yonezo Yanokura ,  Masaki Sato

IPC: B29C45/16 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/20

CPC classification number: B29C45/1671 ,  H05K1/0274 ,  H05K1/0284 ,  H05K3/202 ,  H05K1/0263 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/302 ,  H05K3/0014

Abstract: A method of manufacturing a circuit structure where the electric and/or optical transmission medium or media include at least one of an optical signal transmission medium, an electric signal transmission medium, and an electric power transmission medium. The transmission media are insert-molded in plastics which is a housing for electronic and electric devices and parts. The circuit structure serves both for conductive circuits and housing so that the electronic and electric devices and parts can be wired and mounted at high density.

Abstract translation: 一种制造电路结构的方法，其中电和/或光传输介质或介质包括光信号传输介质，电信号传输介质和电力传输介质中的至少一个。 传输介质被嵌入成型为塑料，其是用于电子和电气设备和部件的壳体。 电路结构既用于导电电路和壳体，使得电子和电气设备和部件可以以高密度布线和安装。

公开(公告)号：US5175668A

公开(公告)日：1992-12-29

申请号：US621135

申请日：1990-12-03

Applicant: Michael L. Kendel

Inventor： Michael L. Kendel

IPC: H01L23/40 ,  H05K1/00 ,  H05K1/02 ,  H05K3/30 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K2201/066 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10454 ,  H05K3/301

Abstract: A circuit board (2) for receiving a component (38) requiring heat sinkage. The circuit board has a base portion (4) and a heat sink form portion (6) integral with the base portion. The heat sink form portion has a heat sink form and a coating (58) of thermally conductive material thereon to produce a heat sink. The heat sink has an aperture (32, 34) between a front surface (10) for contacting the component and a back surface (12) remote from the component to allow heat to be conducted directly from the front surface to the back surface. An integral resilient clamp (46-52) holds the component in contact with the heat sink. The integral nature of the base portion, the heat sink and the clamp provides a simple one piece board and the aperture enhances the heat sink efficiency by providing a direct heat conduction path to the back surface.

Abstract translation: 一种用于接收需要散热的部件（38）的电路板（2）。 电路板具有与基部一体的基部（4）和散热片形成部分（6）。 散热器形式部分具有散热器形式和其上的导热材料的涂层（58）以产生散热器。 散热器在用于接触部件的前表面（10）和远离部件的后表面（12）之间具有开口（32,34），以允许热量从前表面直接传导到后表面。 一体的弹性夹具（46-52）使部件与散热器接触。 基座部分，散热器和夹具的整体性质提供了简单的单片板，并且孔径通过向后表面提供直接的热传导路径来增强散热器的效率。

公开(公告)号：US5147209A

公开(公告)日：1992-09-15

申请号：US798032

申请日：1991-11-20

Applicant: Stanley M. Litwin ,  Jeffrey L. Davis ,  Michael S. Scott

Inventor： Stanley M. Litwin ,  Jeffrey L. Davis ,  Michael S. Scott

IPC: H01R12/51 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10

CPC classification number: H05K1/141 ,  H05K7/1084 ,  H05K2201/049 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10333 ,  H05K2201/10704 ,  H05K2203/082 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/368 ,  Y10S439/931 ,  Y10S439/94

Abstract: An adapter is interposed between a device having a pattern of pins projecting therefrom and a PCB having contacts connected to various components. The body of the adapter is made of platable dielectric material and is formed with holes corresponding to the pattern of pins of the device and also along one or more edges with pads corresponding in number to the holes. The holes are plated with conductive material which may be used to establish electrical contact with the pins; however, preferably clips are installed in each hole and in electrical contact therewith, the clips having converging fingers which frictionally engage the pins and also electrically contact the same. Electrically conductive traces are located on the body, each having a first end connected to the plating of a hole and a second end leading to one of the pads. The traces may be formed by a plate and etch process similar to that used in PCB fabrication. The pads of the body are plated with a material such as solder and are electrically connected to the second ends of the traces opposite the holes. The pins of the device fit into the holes of the body and the plated pads on the body are soldered to contacts on the PCB.

Abstract translation: 在具有从其突出的销的图案的装置和具有连接到各种部件的触点的PCB之间插入适配器。 适配器的主体由可镀介电材料制成，并且形成有与装置的销的图案相对应的孔，并且还沿着一个或多个边缘具有与孔对应的垫。 这些孔镀有导电材料，导电材料可用于与销形成电接触; 然而，优选地，夹子安装在每个孔中并与其电接触，夹具具有会聚的指状物，其摩擦地接合销并且还与其电接触。 导电迹线位于主体上，每个具有连接到孔的电镀的第一端和通向其中一个焊盘的第二端。 迹线可以通过类似于PCB制造中使用的板和蚀刻工艺形成。 主体的焊盘镀有诸如焊料的材料，并且电连接到与孔相对的迹线的第二端。 该装置的针脚装配到主体的孔中，并将主体上的电镀垫焊接到PCB上的触点。

公开(公告)号：US5134056A

公开(公告)日：1992-07-28

申请号：US631944

申请日：1990-12-21

Applicant: Hans-Fr. Schmidt ,  Helmut Hadwiger ,  Milan Prochazka ,  Eddy Roelants

Inventor： Hans-Fr. Schmidt ,  Helmut Hadwiger ,  Milan Prochazka ,  Eddy Roelants

IPC: G03F7/00 ,  H05K3/28

CPC classification number: H05K3/28 ,  H05K2201/09118 ,  H05K2203/0585 ,  H05K2203/107 ,  H05K2203/1105

Abstract: A solder resist and a positively-acting photoresist are successively applied on a surface-wide basis onto a printed circuit board, whereupon the photoresist is selectively exposed and developed in the region of plated-through holes and/or solder pads of a printed conductor pattern carried on the printed circuit board, preferably with the assistance of laser beams. Subsequently, the solder resist is stripped in the regions not protected by the photoresist, i.e. in the regions of plated-through holes and/or solder pads and, as a last step, the remaining photoresist is likewise stripped. The method is particularly suited for the application of a solder resist layer onto three-dimensional printed circuit boards since traditional mask techniques for structuring the solder resist cannot be employed with respect to three-dimensional printed circuit boards.

Abstract translation: 在表面宽度的基础上连续地施加阻焊剂和正性光致抗蚀剂到印刷电路板上，于是在印刷导体图案的电镀通孔和/或焊盘的区域中选择性地暴露和显影光致抗蚀剂 最好在激光束的帮助下携带在印刷电路板上。 随后，在未被光致抗蚀剂保护的区域，即在通孔和/或焊盘的区域中剥离阻焊剂，并且作为最后一步，同样剥离剩余的光致抗蚀剂。 该方法特别适用于在三维印刷电路板上应用阻焊层，因为用于构造阻焊剂的传统掩模技术不能用于三维印刷电路板。

公开(公告)号：US5127158A

公开(公告)日：1992-07-07

申请号：US575295

申请日：1990-08-30

Applicant: Akikazu Nakano

Inventor： Akikazu Nakano

IPC: H05K1/03 ,  H05K3/02

CPC classification number: H05K1/0373 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K3/022 ,  Y10T29/4916

Abstract: A process for producing a printed circuit board includes steps, sequentially conducted of dispersing in water or organic solvent:(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of the components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l; separating the solids from the slurry and drying and molding them. Thereafter the solids are either subjected to melting with heating and pressure forming into the molded article, or they are impregnated with a thermoplastic resin which is then cured. Finally, a metal layer is provided on the molded article.

公开(公告)号：US5090122A

公开(公告)日：1992-02-25

申请号：US651277

申请日：1991-02-05

Applicant: Hiroji Kitagawa

Inventor： Hiroji Kitagawa

IPC: B29C49/24 ,  B29C51/10 ,  B29C51/14 ,  B29L9/00 ,  B32B37/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28

CPC classification number: H05K3/0014 ,  H05K1/095 ,  H05K3/207 ,  H05K1/0284 ,  H05K1/0393 ,  H05K1/167 ,  H05K2201/0129 ,  H05K2201/09118 ,  H05K2203/085 ,  H05K3/0064 ,  H05K3/281 ,  Y10T29/49158 ,  Y10T29/49165

Abstract: This invention provides a method for manufacturing a three-dimensional circuit substrate. In the method, a conducting portion comprising a circuit pattern is formed on the surface of a film. The film is placed over a resin board in a mold in which the conducting portion of the film is opposed to the resin board. Subsequently, blow molding or vacuum forming is applied to the mold. The film and the resin board are thus closely overlapped, heat-bonded, and formed into the three-dimensional circuit substrate having a desired configuration. Through such minimum process steps, the three-dimensional circuit substrate with the complicated configuration can be manufactured easily with reduced cost.

Abstract translation: 本发明提供一种制造三维电路基板的方法。 在该方法中，在膜的表面上形成包括电路图案的导电部分。 将薄膜放置在树脂板上的薄膜的导电部分与树脂板相对的模具中。 随后，对模具施加吹塑或真空成型。 因此膜和树脂板紧密地重叠，热粘合，并形成具有所需构造的三维电路基板。 通过这样的最小工艺步骤，可以容易地制造具有复杂结构的三维电路基板，从而降低成本。

公开(公告)号：US5089355A

公开(公告)日：1992-02-18

申请号：US360909

申请日：1989-05-03

Applicant: Moritsugu Morita ,  Takushi Sato ,  Shusuke Yamanaka ,  Shunji Yoshida ,  Kenji Tanabe ,  Mitsuyuki Naito ,  Shigeyuki Shishido

Inventor： Moritsugu Morita ,  Takushi Sato ,  Shusuke Yamanaka ,  Shunji Yoshida ,  Kenji Tanabe ,  Mitsuyuki Naito ,  Shigeyuki Shishido

IPC: B32B15/08 ,  B32B43/00 ,  H05K1/00 ,  H05K3/06

CPC classification number: B32B43/00 ,  B32B15/08 ,  H05K1/028 ,  H05K2201/0129 ,  H05K2201/0311 ,  H05K2201/0355 ,  H05K2201/051 ,  H05K2201/09118 ,  H05K2203/0271 ,  H05K2203/0353 ,  H05K3/06 ,  Y10T428/12438 ,  Y10T428/12569 ,  Y10T428/31 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: An elongated flexible metal clad laminate formed of at least one metal layer and at least one plastic layer and having a smaller interlayer dimensional difference and excellent process-ability. A defect that a dimension of the metal layer is longer than a corresponding dimension of the plastic layer when they are compared to each other as discrete layers has been corrected by causing the metal layer to continually undergo compression plastic deformation in the form of the laminate and hence compressing the metal layer. A production method for the laminate and an apparatus for the method.

Abstract translation: PCT No.PCT / JP88 / 00958 Sec。 371日期：1989年5月3日 102（e）日期1989年5月3日PCT提交1988年9月22日PCT公布。 出版物WO89 / 0282200 日期：1989年4月6日。一种由至少一个金属层和至少一个塑料层形成并且具有较小层间尺寸差异和优异加工性能的细长柔性金属覆层层压板。 通过使金属层不断地以层叠体的形式进行压缩塑性变形，将金属层的尺寸相对于彼此作为离散层进行比较时的尺寸比塑料层的相应尺寸长的缺陷进行了校正 从而压缩金属层。 层压体的制造方法和该方法的装置。

公开(公告)号：US4997674A

公开(公告)日：1991-03-05

申请号：US204068

申请日：1988-06-06

Applicant: William J. E. Parr ,  Ronald E. Hutton ,  Paul Y. Y. Moy ,  Dieter Frank ,  David A. Strawser

Inventor： William J. E. Parr ,  Ronald E. Hutton ,  Paul Y. Y. Moy ,  Dieter Frank ,  David A. Strawser

IPC: B22F7/04 ,  B32B15/08 ,  C23C4/18 ,  C23C24/06 ,  C23C24/08 ,  H01B1/22 ,  H01B13/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/14 ,  H05K3/20 ,  H05K3/24

CPC classification number: C23C24/085 ,  C23C24/087 ,  C23C4/18 ,  H01B1/22 ,  H05K3/022 ,  H05K3/102 ,  H05K3/14 ,  H05K3/20 ,  H05K3/207 ,  H05K2201/0129 ,  H05K2201/09118 ,  H05K2203/0278 ,  H05K2203/122 ,  H05K3/244

Abstract: A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.

公开(公告)号：US4980016A

公开(公告)日：1990-12-25

申请号：US892086

申请日：1986-08-01

Applicant: Naoko Tada ,  Kunihiko Maeoka

Inventor： Naoko Tada ,  Kunihiko Maeoka

IPC: B29C45/14 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40

CPC classification number: B29C45/14827 ,  B29C45/14639 ,  H05K3/20 ,  B29K2995/0005 ,  H05K2201/09118 ,  H05K2203/0156 ,  H05K3/28 ,  H05K3/4007

Abstract: A process for producing an electric circuit board comprises utilizing a transfer sheet, bearing an electric circuit pattern composed of a metal foil adhered onto a sheet substrate by means of an adhesive material, and transferring said electric circuit pattern onto a surface of an insulating resin substrate simultaneously with the molding thereof.

Abstract translation: 一种电路板的制造方法，其特征在于，利用转印片，通过粘合剂材料承载由附着在片材基板上的金属箔构成的电路图案，并将所述电路图案转印到绝缘树脂基板的表面上 同时进行模制。