公开(公告)号：US09941567B2

公开(公告)日：2018-04-10

申请号：US14962783

申请日：2015-12-08

Applicant: L-3 Communications Corporation

Inventor： Brent A. Boudreaux

IPC: H05K1/11 ,  H01P3/00 ,  H05K3/36 ,  H05K1/14 ,  H05K7/14 ,  H01R13/66 ,  H01R13/648 ,  H05K5/02 ,  H01R12/73

CPC classification number: H01P3/003 ,  H01R12/737 ,  H05K1/117 ,  H05K1/14 ,  H05K1/141 ,  H05K3/366 ,  H05K5/0291 ,  H05K2201/0311 ,  H05K2201/1034

Abstract: An electronic assembly and device are provided. The electronic assembly includes a first circuit board, with PCB pads located adjacent to an edge of the circuit board, and a corresponding plurality of contacts, each contact soldered to one of the PCB pads. Each contact has a first portion, soldered to the PCB pad, and a second portion that extends past the edge of the circuit board and forms a leaf spring. The leaf spring compresses when placed in contact with a PCB pad of a second circuit board, where the PCB pad is substantially coplanar with a surface of the second circuit board. A restoring force of the second portion maintains contact between the second portion and the PCB pad of the second circuit board. The contact forms an electrical connection between the PCB pad of the first circuit board and the PCB pad of the second circuit board.

公开(公告)号：US20180063984A1

公开(公告)日：2018-03-01

申请号：US15244001

申请日：2016-08-23

Applicant: Microsoft Technology Licensing, LLC

Inventor： Bradley E. CLEMENTS ,  Gabriel J. PIRIE ,  Perry H. PIERCE

IPC: H05K7/14 ,  H05K3/30 ,  H05K1/18 ,  H01M2/10

CPC classification number: H01M2/1055 ,  H01M10/425 ,  H01M2220/30 ,  H05K1/181 ,  H05K3/303 ,  H05K3/32 ,  H05K2201/0311 ,  H05K2201/09063 ,  H05K2201/10037 ,  H05K2201/10227

Abstract: A device and a method for manufacturing of a printed circuit board for installing in a battery-powered device, the method including mounting on a printed circuit board (PCB) a PCB surface mount component comprising a planar mount configured to be mounted on the PCB and a kinetic energy absorption element with a battery contact on a distal end of the energy absorption element, and trimming the PCB out of a panel comprising the PCB and a border around the PCB, the border connected integrally with the PCB, wherein the border comprises supports configured to support corresponding ear extensions in the absorption element in order to align the battery contact with a PCB plane.

公开(公告)号：US20180063968A1

公开(公告)日：2018-03-01

申请号：US15675938

申请日：2017-08-14

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

IPC: H05K3/36 ,  H05K1/18 ,  B23K1/00 ,  B23K37/04 ,  H01R4/02 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H01R12/61

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K37/04 ,  B23K37/0435 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01R4/02 ,  H01R12/61 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/0311 ,  H05K2201/058 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2203/0195 ,  H05K2203/0228 ,  H05K2203/043 ,  H05K2203/16

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

公开(公告)号：US09867274B2

公开(公告)日：2018-01-09

申请号：US14804748

申请日：2015-07-21

Applicant: FUJITSU LIMITED

Inventor： Jun Taguchi

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

公开(公告)号：US20170332476A1

公开(公告)日：2017-11-16

申请号：US15150834

申请日：2016-05-10

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H05K1/02 ,  H01P3/08 ,  H01P3/06 ,  H05K1/14

CPC classification number: H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

Abstract: A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

公开(公告)号：US09799975B2

公开(公告)日：2017-10-24

申请号：US15164198

申请日：2016-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juneseok Park

IPC: H01R13/60 ,  H01R12/79 ,  H05K3/32 ,  H01R12/77 ,  H01R12/71 ,  H01R13/24 ,  H01R13/62

CPC classification number: H01R12/79 ,  H01R12/714 ,  H01R12/771 ,  H01R13/24 ,  H01R13/6205 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2203/104 ,  Y02P70/611

Abstract: An electronic device may include: a printed circuit board (PCB); a plurality of electronic components electrically connected to the PCB; and a connection member comprising a first portion fixed to one of the PCB and an electronic component and a second portion magnetically connected to the other one of the PCB and the electronic component. The second portion of the connection member may be moveably connected to the first portion. The connection member may further include a stopper, and may be designed to minimize the repulsive force provided by the connection member when excessive pressure is applied to the electronic device.

公开(公告)号：US09414490B2

公开(公告)日：2016-08-09

申请号：US14206750

申请日：2014-03-12

Applicant: HIQ SOLAR, INC.

Inventor： Andre P. Willis

IPC: H05K7/10 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H05K2201/0311 ,  H05K2201/0394 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A printed wiring board with a component connection pad, such as a solder pad, providing thermal stress compensation for a surface mount circuit component and method for making such a pad. The component connection pad includes opposed groups of multiple conductive fingers that are mutually connected at their far ends and separated at their near ends where they have surfaces for mounting a single surface mount circuit component.

Abstract translation: 具有诸如焊盘的部件连接焊盘的印刷线路板，为表面安装电路部件提供热应力补偿以及制造这种焊盘的方法。 部件连接焊盘包括相对的多个导电指状物组，它们在其远端相互连接并且在它们的近端分开，在它们的近端具有用于安装单个表面安装电路部件的表面。

公开(公告)号：US09402306B2

公开(公告)日：2016-07-26

申请号：US13574630

申请日：2011-01-31

Applicant: Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

Inventor： Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

IPC: H05K1/00 ,  H05K1/02 ,  H01L27/32 ,  H01L51/52 ,  H01R4/70 ,  H05K3/36 ,  H05B33/08 ,  H05B33/10 ,  H05K13/04 ,  H01L31/0392 ,  H01L31/042 ,  G09F9/00 ,  G09F19/22 ,  H01R4/04 ,  H01R12/70 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件。 瓦片（1）包括具有电物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 所述瓦片在所述瓦片的连接部分（1c）中机械地和电耦合到所述载体。

公开(公告)号：US09357658B2

公开(公告)日：2016-05-31

申请号：US14634269

申请日：2015-02-27

Applicant: Super Talent Technology, Corp.

Inventor： Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma

IPC: H05K3/34 ,  H01R12/71 ,  H05K3/36 ,  G06F1/16 ,  H01L23/00 ,  H01R12/57 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K5/02 ,  H05K3/00 ,  H01L23/31

CPC classification number: H05K3/3484 ,  G06F1/1632 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01R12/57 ,  H01R12/71 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/326 ,  H05K3/361 ,  H05K3/4007 ,  H05K3/4046 ,  H05K5/0278 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/49128 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB devices using an extended 9-pin EUSB socket. Each EUSB device includes a PCBA having four standard USB metal contact pads, and several extended purpose contact springs disposed on an upper side of a PCB. A single-shot molding process is used to form a molded housing over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The EUSB device is optionally used as a modular insert that is mounted onto a metal or plastic case to provide a EUSB assembly having a plug shell similar to a standard USB male connector.

公开(公告)号：US09155200B2

公开(公告)日：2015-10-06

申请号：US13926069

申请日：2013-06-25

Applicant: Interplex Industries, Inc.

Inventor： Jack Seidler

IPC: H01R9/00 ,  H05K3/00 ,  B23K35/02 ,  H01R43/02 ,  H05K3/34 ,  H01R12/57 ,  H01R12/70

CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长的可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。