Vacuum processing apparatus and operating method therefor

    公开(公告)号:US20040187338A1

    公开(公告)日:2004-09-30

    申请号:US10796207

    申请日:2004-03-10

    Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple. Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

    Process chamber with downstream getter plate
    166.
    发明授权
    Process chamber with downstream getter plate 失效
    具有下游吸气板的处理室

    公开(公告)号:US06464792B1

    公开(公告)日:2002-10-15

    申请号:US09613437

    申请日:2000-07-11

    Abstract: An improved chemical vapor deposition reaction chamber having an internal support plate to enable reduced pressure processing. The chamber has a vertical-lateral lenticular cross-section with a wide horizontal dimension and a shorter vertical dimension between bi-convex upper and lower walls. A central horizontal support plate is provided between two lateral side rails of the chamber. A large rounded rectangular aperture is formed in the support plate for positioning a rotatable susceptor on which a wafer is placed. The shaft of the susceptor extends downward through the aperture and through a lower tube depending from the chamber. The support plate segregates the reaction chamber into an upper region and a lower region, with purge gas being introduced through the lower tube into the lower region to prevent unwanted deposition therein. A temperature compensation ring is provided surrounding the susceptor and supported by fingers connected to the support plate. The temperature compensation ring may be circular or may be built out to conform to the rounded rectangular shape of the support plate aperture. The ring may extend farther downstream from the susceptor than upstream. A separate sacrificial quartz plate may be provided between the circular temperature compensation ring and the rounded rectangular aperture. The quartz plate may have a horizontal portion and a vertical lip in close abutment with the aperture to prevent devitrification of the support plate. A gas injector abuts an inlet flange of the chamber and injects process gas into the upper region and purge gas into the lower region. The gas injector includes a plurality of independently controlled channels disposed laterally across the chamber, the channels merging at an outlet of the injector to allow mixing of the adjacent longitudinal edges of the separate flows well before reaching the wafer.

    Abstract translation: 改进的化学气相沉积反应室具有内部支撑板以实现减压处理。 该腔室具有垂直横向的透镜状横截面,在双凸上壁和下壁之间具有宽的水平尺寸和较短的垂直尺寸。 中央水平支撑板设置在腔室的两个侧向侧轨之间。 在支撑板中形成大的圆形矩形孔,用于定位其上放置晶片的可旋转基座。 基座的轴向下延伸穿过孔,并通过从腔室垂下的下管。 支撑板将反应室分离成上部区域和下部区域,其中吹扫气体通过下部管道被引入下部区域,以防止其中不希望的沉积。 温度补偿环设置在基座周围并由连接到支撑板的手指支撑。 温度补偿环可以是圆形的,或者可以被构造成符合支撑板孔的圆形矩形形状。 环可以比上游更远离基座延伸下游。 可以在环形温度补偿环和圆形矩形孔之间设置单独的牺牲石英板。 石英板可以具有与孔紧密邻接的水平部分和垂直唇缘,以防止支撑板的失透。 气体喷射器邻接室的入口凸缘并将工艺气体注入上部区域并将气体吹入下部区域。 气体喷射器包括跨过室横向设置的多个独立控制的通道,通道在喷射器的出口处汇合,以允许在到达晶片之前将分离的流的相邻纵向边缘混合。

    Substrate changing-over mechanism in vacuum tank
    168.
    发明申请
    Substrate changing-over mechanism in vacuum tank 失效
    真空罐中底物转换机理

    公开(公告)号:US20020032972A1

    公开(公告)日:2002-03-21

    申请号:US09782195

    申请日:2001-02-14

    Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple. Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

    Abstract translation: 本发明涉及一种具有真空处理室的真空处理装置,其内部必须是干式清洁的,以及一种操作这种装置的方法。 当真空处理室被干洗时,虚设基板通过基板传送装置从设置在空气气氛中的虚设基板存储装置与用于存储待处理基板的存储装置一起转移到真空处理室中, 通过产生等离子体对真空处理室进行干洗。 在完成干洗之后,虚拟衬底返回到虚设衬底存储装置。 因此,仅用于清洁目的的特定机构是不必要的,并且可以使装置的结构简单。 此外,用于干洗的虚拟基板和待加工的基板不共存,可以防止由于灰尘和剩余气体而被处理的基板的污染,并且生产率可以高。

    Vacuum apparatus and driving mechanism therefor
    169.
    发明授权
    Vacuum apparatus and driving mechanism therefor 失效
    真空装置及其驱动机构

    公开(公告)号:US06337003B1

    公开(公告)日:2002-01-08

    申请号:US09529664

    申请日:2000-08-18

    CPC classification number: G11B7/26 B01J3/006 B01J3/02 C23C14/50 C23C14/56

    Abstract: The invention provides a vacuum apparatus, which is equipped with a drive mechanism of small size and does not need a special mechanism for vacuum seals. This drive mechanism includes an air bag container 41 which is provided fixedly in an airtight vessel with one end open, an air bag 42 stored in the container, and a source for supplying high pressure gas penetrating through the air bag container 41. A part of the air bag 42 is projected from the open end of the air bag container 41 by supplying air bag 42 with a high pressure gas with a high pressure gas supply source 43, thereby moving objects in the vacuum vessel.

    Abstract translation: 本发明提供了一种真空装置,其具有小尺寸的驱动机构,并且不需要用于真空密封的特殊机构。 该驱动机构包括:气囊容器41,其固定地设置在一端敞开的气密容器中,存储在容器中的气囊42和用于供给穿过气囊容器41的高压气体的源。一部分 气囊42从气囊容器41的开口端部向气囊42供给高气压气体供给源43,从而使真空容器内的物体移动。

    Vacuum processing apparatus and operating method therefor
    170.
    发明申请
    Vacuum processing apparatus and operating method therefor 失效
    真空处理装置及其操作方法

    公开(公告)号:US20010016990A1

    公开(公告)日:2001-08-30

    申请号:US09782192

    申请日:2001-02-14

    Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed, Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple. Furthermore, the dummy substrates used for dry cleaning and the substrates to be processed do not coexist, contamination of the substrates to be processed due to dust and remaining gas can be prevented and the production yield can be high.

    Abstract translation: 本发明涉及一种具有真空处理室的真空处理装置,其内部必须是干式清洁的,以及一种操作这种装置的方法。 当真空处理室被干洗时,虚设基板通过基板传送装置从设置在空气气氛中的虚设基板存储装置与用于存储待处理基板的存储装置一起转移到真空处理室中, 通过产生等离子体对真空处理室进行干洗。 在完成干洗之后,虚拟衬底返回到虚设衬底存储装置,因此,不需要用于清洁目的的任何具体机构,并且可以使装置的结构简单。 此外,用于干洗的虚拟基板和待加工的基板不共存,可以防止由于灰尘和剩余气体而被处理的基板的污染,并且生产率可以高。

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