Abstract:
The present invention provides a surface-protection tape for semiconductor wafers having an even thickness accuracy, excellent surface smoothness, and excellent surface sliding properties such as freedom from blocking, etc., and a substrate film for the surface-protection tape. The substrate film for the surface-protection tape for semiconductor wafers has at least one layer containing a polyethylene-based resin and satisfies the following requirements:(1) the back and front surfaces of the substrate film have a surface roughness Ra measured based on JIS B0601 of not more than 0.8 μm, and at least one surface thereof has a surface roughness Ra of not less than 0.05 μm; and(2) the difference between the maximum and minimum thicknesses of the substrate film is not more than 4 μm.The present invention also provides a surface-protection tape for semiconductor wafers comprising the substrate film and an adhesive layer.
Abstract:
Disclosed is a label 1 for battery packaging, which includes a heat shrinkable film 2, and a printed layer 3 and an adhesive layer 4 each arranged on or above the heat shrinkable film 2. The adhesive layer 4 includes an emulsive heat-sensitive adhesive containing an ethylene polymer and 10 to 30 percent by weight of a tackifier based on the total solid content. The ethylene copolymer has an ethylene content of 66 to 84 percent by weight and a melting point of 60° C. to 90° C. The heat shrinkable film 2 is preferably a film having a percentage of heat shrinkage in a main stretching direction of 10% or more after being immersed in a glycerol bath at 100° C. for five seconds. The label 1 for battery packaging excels in low-temperature tack and blocking resistance and is less likely to deteriorate with time.
Abstract:
A label for application to a surface having at least one compound curve is provided. The label comprises a heat shrinkable film having an inner surface and outer surface and a layer of pressure sensitive adhesive on the inner surface of the heat shrinkable film.
Abstract:
Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
Abstract translation:公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。 为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片,并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲,压敏粘合剂 片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜,包含不同于复合膜的材料的第一膜和压敏粘合剂层。 优选的是,压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量 宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。
Abstract:
A membrane for application to a surface of a structure to provide waterproofing protection to the structure, the membrane including a surface layer of thermoplastic or elastomeric material, a layer of cushion material sealed to the layer of thermoplastic or elastomeric material, a pressure sensitive adhesive bound to a side of the cushion material remote from the thermoplastic or elastomeric material, and a release liner removably mounted on the pressure sensitive adhesive.
Abstract:
A decorative dry color laminate includes a dry color layer, a pressure-sensitive adhesive layer on one side of the dry color layer, and a carrier in releasable contact with the dry color layer on a side opposite from the pressure-sensitive adhesive (PSA). In use, the adhesive layer adheres the dry color laminate to the surface under application of pressure, and the carrier is peeled away to expose the dry color layer. Methods for providing a substantially permanent color effect on an architectural surface comprise delivering such an article to the architectural surface.
Abstract:
A pressure sensitive adhesive sheet to be used in producing an extremely thin semiconductor chip which is free of breakage and discoloration by a predicing process and a method of use thereof are provided. The pressure sensitive adhesive sheet is used in a method for producing a semiconductor chip, in which the method involves the steps of: forming a groove having depth smaller than thickness of a wafer on a surface of the wafer on which a semiconductor circuit is formed; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer. The pressure sensitive adhesive sheet contains a rigid substrate, a vibration relaxation layer provided on one face of the rigid substrate and a pressure sensitive adhesive layer provided on the other face of the rigid substrate, in which thickness of the rigid substrate is 10 to 150 μm and Young's modulus thereof is 1000 to 30000 MPa, and thickness of the vibration relaxation layer is 5 to 80 μm and a maximum value of tan δ of dynamic viscoelasticity thereof at −5° C. to 120° C. is 0.5 or more.
Abstract:
An adhesive for an at least one-layer pressure sensitive adhesive sheet strip which is residuelessly and nondestructively redetachable by extensive stretching substantially in the bond plane, said adhesive being composed of at least one block copolymer having one or two end blocks composed of vinylaromatics, and a block composed of a conjugated diene, wherein the fraction of 1,2-linked diene is selectively hydrogenated.
Abstract:
The base material for a pressure-sensitive adhesive tape or sheet of the present invention is a different-colored laminated base material having a layered structure in which a plurality of film layers having different colors are laminated adjacently, and is used as a base material in a pressure-sensitive adhesive tape or sheet having a base material and a pressure-sensitive adhesive layer disposed on at least one surface of the base material. The base material for a pressure-sensitive adhesive tape or sheet is capable of providing the pressure-sensitive adhesive tape or sheet with a light-reflective property and/or a light-shielding property without requiring the formation of an ink layer and with an excellent tear resistance.
Abstract:
In one embodiment, a nonmetallic, tamper-indicating, multi-layer label with a metallic appearance is described. The label comprises a pearlescent layer, a film layer, a patterned release layer, and a pigmented adhesive layer with the provisos that (i) the pigmented adhesive layer is an exterior layer of the label and is substantially free of pearlescent pigment, and (ii) the patterned release layer is an interior layer of the label. Each layer has first and second opposing planar surfaces, and each layer is in intimate contact with the layer or layers immediately adjacent to it. In another embodiment, two layers, one layer comprising a non-pearlescent pigment and the other layer comprising the adhesive, replace the pigmented adhesive layer.