公开(公告)号：US20180249576A1

公开(公告)日：2018-08-30

申请号：US15547851

申请日：2016-01-28

Applicant: FUJIKURA LTD.

Inventor： Shingo Ogura

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0283 ,  H01B5/14 ,  H05K1/02 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/1283 ,  H05K3/24 ,  H05K3/28 ,  H05K3/285 ,  H05K3/287 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/0187 ,  H05K2201/09227

Abstract: A stretchable wiring board includes: a stretchable base; at least one stretchable wiring provided on the stretchable base; and a poorly stretchable member provided so as to overlap at least part of the stretchable wiring in a thickness direction looking at the stretchable base in planar view. The poorly stretchable member suppresses change in a resistance value of the stretchable wiring associated with stretching deformation of the stretchable base. As a result, stable operability can be secured without affecting an operating voltage of an electronic component.

公开(公告)号：US20180190890A1

公开(公告)日：2018-07-05

申请号：US15907761

申请日：2018-02-28

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Shigeo YAMAGUCHI ,  Saiko AKAHANE ,  Toshio SHIOBARA

IPC: H01L33/62 ,  B32B15/20 ,  B32B15/14 ,  B32B7/12 ,  B32B5/02

CPC classification number: H01L33/62 ,  B32B5/022 ,  B32B5/024 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2307/4026 ,  B32B2457/14 ,  C08K2003/2241 ,  C09D183/04 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/029 ,  Y10T156/10 ,  Y10T442/3423 ,  H01L2924/00 ,  C08K3/36 ,  C08K5/56 ,  C08L83/00

Abstract: The invention provides a silicone-organic resin composite laminate comprising a laminate in which an organic resin layer containing an inorganic fiber cloth into which a thermosetting organic resin has been impregnated, and a silicone resin layer containing an inorganic fiber cloth into which a curable silicone resin has been impregnated, being laminated with each one or more layers, and metal foils laminated at an uppermost surface and a lowermost surface of the laminate. There can be provided a silicone-organic resin composite laminate which has low linear expansion, good thermal dimensional stability, excellent mechanical characteristics, and excellent heat resistance and light resistance, and is suitable as a mounting substrate for an LED which corresponds to increase in luminance of the LED mounted substrate.

公开(公告)号：US20180134909A1

公开(公告)日：2018-05-17

申请号：US15835688

申请日：2016-02-02

Applicant: National Research Council of Canada

Inventor： Chantal Paquet ,  Thomas Lacelle ,  Patrick R.L. Malenfant

IPC: C09D11/52 ,  H05K1/09 ,  C08J7/06 ,  B29C71/02 ,  H05K3/12

CPC classification number: C09D11/52 ,  C08J7/065 ,  C08J7/08 ,  C08J2379/08 ,  C09D11/033 ,  C09D11/037 ,  C09D11/32 ,  C09D11/36 ,  H05K1/0393 ,  H05K1/097 ,  H05K3/1283 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162

Abstract: A copper precursor composition contains: a first copper complex of an imine or a first cyclic amine coordinated to a first copper precursor compound; and, a second copper complex of a primary amine or a second cyclic amine coordinated to a second copper precursor compound. A copper precursor composition contains a copper complex of an imine coordinated to a copper precursor compound. The copper precursor composition is thermally degradable at a temperature lower than a comparable composition containing only primary amine copper complexes under otherwise the same conditions to produce a metallic copper film having a resistivity of about 200 μΩ-cm or less. Inks containing the copper precursor composition and a solvent may be deposited on a substrate and sintered to produce a metallic copper film. The substrate with the film thereon is useful in electronic devices.

公开(公告)号：US09942979B2

公开(公告)日：2018-04-10

申请号：US14930866

申请日：2015-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Kyung-wan Park ,  Shi-yun Cho ,  Hyo-young Lee ,  Hyun-jung Kim ,  Mee-ree Kim ,  Ik-joon Kim

IPC: H05K1/00 ,  H05K1/02 ,  B32B7/04 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B3/08 ,  H05K1/09 ,  H05K3/38

CPC classification number: H05K1/0283 ,  B32B3/08 ,  B32B7/045 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/24 ,  B32B2262/103 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/51 ,  B32B2307/546 ,  B32B2457/08 ,  H05K1/097 ,  H05K3/389 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/026

Abstract: A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates.

公开(公告)号：US20180096751A1

公开(公告)日：2018-04-05

申请号：US15788441

申请日：2017-10-19

Applicant: Oxford University Innovation Limited

Inventor： John Hagan Pryce Bayley ,  Kunwar Tanuj Sapra

IPC: H01B7/00 ,  C12M1/12 ,  B32B9/00 ,  H05K1/03 ,  B32B17/06 ,  C12M1/34 ,  G01N27/416 ,  G01N33/68 ,  H01H1/00 ,  H01H1/021 ,  H01L51/00 ,  H01B1/06 ,  H01B3/00 ,  C08J3/075

CPC classification number: H01B7/0027 ,  B32B9/00 ,  B32B17/06 ,  B32B2457/00 ,  C08J3/075 ,  C08J2305/12 ,  C12M1/34 ,  C12M1/3407 ,  C12M25/14 ,  G01N27/416 ,  G01N33/6872 ,  H01B1/06 ,  H01B3/00 ,  H01H1/0036 ,  H01H1/021 ,  H01L51/00 ,  H05K1/0306 ,  H05K1/0326 ,  H05K2201/0162 ,  Y10T156/10 ,  Y10T428/26 ,  Y10T428/31971

Abstract: The invention provides a hydrogel network comprising a plurality of hydrogel objects, wherein each of said hydrogel objects comprises: a hydrogel body, and an outer layer of amphipathic molecules, on at least part of the surface of the hydrogel body, wherein each of said hydrogel objects contacts another of said hydrogel objects to form an interface between the contacting hydrogel objects. A process for producing the hydrogel networks is also provided. The invention also provides an electrochemical circuit and a hydrogel component for mechanical devices comprising a hydrogel network. Various uses of the hydrogel network are also described, including their use in synthetic biology and as components in electrochemical circuits and mechanical devices.

公开(公告)号：US09910213B2

公开(公告)日：2018-03-06

申请号：US15472851

申请日：2017-03-29

Applicant: Funai Electric Co., Ltd.

Inventor： Akira Yokawa ,  Yuki Kita ,  Akihiro Fujikawa ,  Yasuyuki Fukumoto ,  Yasuhiro Mori ,  Yuto Suzuki ,  Hirofumi Horiuchi ,  Hirohiko Tsuji ,  Takahito Yamanaka ,  Hideo Yonezawa

IPC: F21V8/00

CPC classification number: G02B6/0088 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  G02F1/133615 ,  G02F2001/133314 ,  G02F2001/133317 ,  G02F2001/133328 ,  G02F2001/133628 ,  G06F1/20 ,  H05K1/0209 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/09909

Abstract: This display includes a light source portion, a first heat radiation member for radiating heat generated by the light source portion, a rear housing covering the first heat radiation member in a state in contact with the first heat radiation member, and a cover member covering a rear surface of the rear housing so that the rear surface of the rear housing is partially exposed outward. The first heat radiation member is arranged on a region corresponding to a region of the rear housing exposed outward from the cover member as viewed from the side of the rear surface.

公开(公告)号：US20170349750A1

公开(公告)日：2017-12-07

申请号：US15539467

申请日：2015-06-01

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Suwen YE ,  Guofang TANG

IPC: C08L83/06 ,  C08G77/08 ,  H05K1/03 ,  C08J5/24 ,  B32B38/08 ,  C08K3/00 ,  C08G77/00

CPC classification number: C08L83/06 ,  B32B27/04 ,  B32B38/08 ,  B32B2307/304 ,  B32B2307/3065 ,  C08G77/08 ,  C08G77/16 ,  C08G77/18 ,  C08G77/80 ,  C08J5/24 ,  C08K3/013 ,  C08K3/36 ,  C08K5/098 ,  C08L83/04 ,  C09D183/06 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0358 ,  H05K2201/068 ,  C08K5/5415

Abstract: The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.

公开(公告)号：US09736935B2

公开(公告)日：2017-08-15

申请号：US14446650

申请日：2014-07-30

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Shingo Yoshioka

IPC: B32B37/16 ,  B32B37/26 ,  C08L79/08 ,  H05K1/05 ,  H05K1/03 ,  C08L63/00 ,  C08J5/24 ,  C09D163/00 ,  C09D179/08 ,  C08G59/24 ,  C08G59/62

CPC classification number: H05K1/0373 ,  B32B2311/00 ,  B32B2457/08 ,  C08G59/245 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/08 ,  C08J2433/00 ,  C08L63/00 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/03 ,  C09D163/00 ,  C09D179/08 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/0162 ,  H05K2201/09136 ,  Y10T156/10 ,  Y10T428/31529 ,  C08L33/08

Abstract: The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

公开(公告)号：US20170196094A1

公开(公告)日：2017-07-06

申请号：US14984011

申请日：2015-12-30

Applicant: AT&S Austria

Inventor： Guenther MAYR

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02 ,  H01L23/00 ,  H05K3/32 ,  H01L23/538 ,  H05K1/09

CPC classification number: H05K1/185 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/838 ,  H01L2924/15153 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/09 ,  H05K1/115 ,  H05K3/32 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/05

Abstract: An electronic device comprising an electronic component with electric terminals, a component carrier in which the electronic component is packaged, wherein the component carrier comprises a flexible layer structure interposed between an upper rigid layer structure and a lower rigid layer structure, wherein the upper rigid layer structure comprises an upper cut-out portion and the lower rigid layer structure comprises a lower cut-out portion, and wherein the upper cut-out portion and the lower cut-out portion are formed at at least partially opposing positions relative to the flexible layer structure.

公开(公告)号：US09683132B2

公开(公告)日：2017-06-20

申请号：US15261624

申请日：2016-09-09

Applicant: Syed Taymur Ahmad ,  Bruce Acton

Inventor： Syed Taymur Ahmad ,  Bruce Acton

IPC: H05K1/00 ,  C09D183/04 ,  H05K3/28 ,  H05K7/14 ,  H05K1/03 ,  C09D133/16 ,  H01R12/71 ,  H05K3/40

CPC classification number: C09D183/04 ,  C09D133/16 ,  H01R12/716 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/284 ,  H05K3/285 ,  H05K3/40 ,  H05K7/1427 ,  H05K2201/0162 ,  H05K2201/0187 ,  H05K2203/1173 ,  H05K2203/121 ,  H05K2203/1322 ,  H05K2203/1338 ,  H05K2203/1361 ,  H05K2203/1366 ,  H05K2203/1572

Abstract: Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying a first polymer, such as an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a second polymer, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers, without the need for multilayer coatings on any component. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed. Non-limiting examples of such devices include smart phones, computers, and gaming devices.