公开(公告)号：US06485833B1

公开(公告)日：2002-11-26

申请号：US09692423

申请日：2000-10-20

Applicant: Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

Inventor： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

IPC: B32B2738

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/34 ,  B32B27/38 ,  B32B2363/00 ,  B32B2379/08 ,  B32B2457/08 ,  H05K3/4626 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: A resin-coated metal foil comprising: a metal foil, and a resin layer formed on the metal foil by coating and semi-curing, on the metal foil, a composition containing a polycarbodiimide resin having a number-average molecular weight of 3,000 to 50,000, an epoxy resin, the proportions of the polycarbodiimide resin and the epoxy resin being 100 parts by weight and 20 to 2000 parts by weight, respectively. In the resin-coated metal foil, the resin is superior in handleability and storage stability in a semi-cured state and, after complete cure, high in heat resistance and superior in dielectric properties.

Abstract translation: 1.一种树脂被覆金属箔，其特征在于，在金属箔上含有金属箔和在该金属箔上形成的树脂层，所述组合物含有数均分子量为3,000〜50,000的聚碳化二亚胺树脂， 环氧树脂，聚碳化二亚胺树脂和环氧树脂的比例分别为100重量份和20至2000重量份。 在树脂被覆金属箔中，树脂在半固化状态下的处理性和保存稳定性优异，完全固化后，耐热性高，介电性优异。

公开(公告)号：US20020130103A1

公开(公告)日：2002-09-19

申请号：US09808752

申请日：2001-03-15

Inventor： Scott M. Zimmerman ,  Edward C. Skorupski ,  Gordon C. Smith

IPC: H01B013/00 ,  G11B005/127 ,  G01D015/00

CPC classification number: H05K3/381 ,  B32B15/08 ,  H05K3/386 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0358

Abstract: The invention relates to the manufacture of printed circuit boards having improved interlayer adhesion. More particularly, the present invention pertains to adhesiveless printed circuit boards having excellent thermal performance and useful for producing high-density circuits. A metal foil coated with a polyimide film is laminated onto an etched surface of a polyimide substrate. Etching the substrate surface allows for strong adhesion of a pure polyimide film to the substrate.

Abstract translation: 本发明涉及具有改进的层间粘合性的印刷电路板的制造。 更具体地，本发明涉及具有优异的热性能并且可用于生产高密度电路的无粘合剂印刷电路板。 将涂覆有聚酰亚胺膜的金属箔层压到聚酰亚胺基板的蚀刻表面上。 蚀刻基板表面允许纯聚酰亚胺膜与基板的强粘附。

公开(公告)号：US06447915B1

公开(公告)日：2002-09-10

申请号：US09518250

申请日：2000-03-03

Applicant: Toshio Komiyatani ,  Masao Uesaka ,  Masataka Arai ,  Hitoshi Kawaguchi

Inventor： Toshio Komiyatani ,  Masao Uesaka ,  Masataka Arai ,  Hitoshi Kawaguchi

IPC: B32B1508

CPC classification number: H05K3/4655 ,  H05K1/0333 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0358 ,  Y10S525/936 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31533

Abstract: In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of components. Therefore, the present invention aims at providing a multilayer printed circuit board which uses an interlaminar insulating adhesive superior in heat resistance and low in thermal expansion coefficient and wherein the insulating adhesive layer has a small variation in thickness between circuit layers. That is, the present invention lies in an interlaminar insulating adhesive for multilayer printed circuit board containing the following components as essential components: (a) a sulfur-containing thermoplastic resin having a weight-average molecular weight of 103 to 105, (b) a sulfur-containing epoxy or phenoxy resin having a weight-average molecular weight of 103 to 105, (c) a multifunctional epoxy resin having an epoxy equivalent of 500 or less, and (d) an epoxy-curing agent.

Abstract translation: 为了提供具有细间距电路的多层印刷电路板，其中使用的层间绝缘粘合剂必须具有耐热性和低热膨胀系数，使得在电路形成和部件安装期间可以获得所需的精度。 因此，本发明的目的在于提供一种使用耐热性优异，热膨胀系数低的层间绝缘胶的多层印刷电路板，其中绝缘粘合剂层在电路层之间的厚度变化小。 也就是说，本发明在于用于多层印刷电路板的层间绝缘粘合剂，其包含以下成分作为必要成分：（a）重均分子量为103〜105的含硫热塑性树脂，（b） 含有重均分子量为103〜105的含硫环氧树脂或苯氧基树脂，（c）环氧当量为500以下的多官能环氧树脂，（d）环氧固化剂。

公开(公告)号：US06420093B1

公开(公告)日：2002-07-16

申请号：US09496495

申请日：2000-02-02

Applicant: Kaoru Ohba ,  Brian Martin ,  Hideki Akimoto ,  Albert Charles Marie Achen ,  Philip E. Garrou ,  Britton Lee Kaliszewski ,  Ying-Hung So

Inventor： Kaoru Ohba ,  Brian Martin ,  Hideki Akimoto ,  Albert Charles Marie Achen ,  Philip E. Garrou ,  Britton Lee Kaliszewski ,  Ying-Hung So

IPC: G03F700

CPC classification number: H05K3/4655 ,  C08G61/02 ,  H05K3/4652 ,  H05K2201/0158 ,  H05K2201/0358

Abstract: The invention is a process for building-up printed wiring boards using metal foil coated with toughened benzocyclobutene-based dielectric polymers. The invention is also a toughened dielectric polymer comprising benzocyclobutene-based monomers or oligomers, ethylenically unsaturated polymer additive, and, optionally, a photoactive compound.

Abstract translation: 本发明是使用镀有苯乙烯类韧性介电聚合物的金属箔来构建印刷线路板的方法。 本发明还是包含苯并环丁烯类单体或低聚物，烯属不饱和聚合物添加剂和任选的光活性化合物的增韧介电聚合物。

公开(公告)号：US20020061415A1

公开(公告)日：2002-05-23

申请号：US09132638

申请日：1998-08-11

Inventor： R. RICHARD STEINER ,  SHIUH-KAO CHIANG

IPC: B32B015/08 ,  B32B015/20 ,  B32B003/00

CPC classification number: B32B15/01 ,  B32B15/017 ,  B32B15/08 ,  B32B37/26 ,  B32B2038/0076 ,  B32B2305/74 ,  B32B2310/0812 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2457/08 ,  C09J7/28 ,  C09J7/29 ,  C09J2201/128 ,  C09J2400/163 ,  H05K3/025 ,  H05K3/386 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0358 ,  Y10S428/901 ,  Y10T156/1052 ,  Y10T428/12569 ,  Y10T428/1275 ,  Y10T428/12903 ,  Y10T428/14 ,  Y10T428/24777 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/28 ,  Y10T428/31678

Abstract: A laminate for use in production of printed circuit boards comprising a metal layer having a first side and a second side; a metallic substrate, one side of the metallic substrate being attached to the first side of the metal foil; an adhesive substrate formed of a polymeric material having a first surface and a second surface, the first surface being attached to the second side of the copper foil, the adhesive substrate being at least partially uncured; and a releasable protective film along the second surface of the adhesive substrate.

Abstract translation: 一种用于生产印刷电路板的层压板，包括具有第一面和第二面的金属层; 金属基板，金属基板的一侧附着在金属箔的第一面上; 由具有第一表面和第二表面的聚合物材料形成的粘合剂基底，所述第一表面附着到所述铜箔的第二侧，所述粘合剂基底至少部分未固化; 以及沿着粘合剂基底的第二表面的可释放的保护膜。

公开(公告)号：US06376008B1

公开(公告)日：2002-04-23

申请号：US09400392

申请日：1999-09-21

Applicant: R. Richard Steiner ,  Shiuh-Kao Chiang

Inventor： R. Richard Steiner ,  Shiuh-Kao Chiang

IPC: B05D302

CPC classification number: B32B15/01 ,  B32B15/017 ,  B32B15/08 ,  B32B37/26 ,  B32B2038/0076 ,  B32B2305/74 ,  B32B2310/0812 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2457/08 ,  C09J7/28 ,  C09J7/29 ,  C09J2201/128 ,  C09J2400/163 ,  H05K3/025 ,  H05K3/386 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0358 ,  Y10S428/901 ,  Y10T156/1052 ,  Y10T428/12569 ,  Y10T428/1275 ,  Y10T428/12903 ,  Y10T428/14 ,  Y10T428/24777 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/28 ,  Y10T428/31678

Abstract: A method of forming a laminate for use in the production of printed circuit boards, comprising the steps of: a) forming a component comprised of a sheet of copper foil and a sheet of metal, the sheet of copper foil having an essentially uncontaminated surface facing an essentially uncontaminated surface of the sheet of metal, the surfaces of the sheets being in unattached contact with each other in an area that defines a substantially uncontaminated zone; b) applying a preformed adhesive film formed of a substantially uncured polymeric material onto an exposed surface of the copper foil, the adhesive film having a first surface and a second surface, the film being attached to the component with the first surface in contact with an exposed surface of the copper foil; and c) curing the adhesive film, wherein the second surface of the adhesive film is at least partially uncured.

Abstract translation: 一种形成用于制造印刷电路板的层压体的方法，包括以下步骤：a）形成由铜箔片和金属片构成的部件，所述铜箔片基本上未被污染的表面面对 金属板的基本上未被污染的表面，片材的表面在限定基本上未受污染的区域的区域中彼此不相关接触; b）将由基本上未固化的聚合物材料形成的预成型粘合剂膜施加到暴露表面 所述粘合膜具有第一表面和第二表面，所述膜附着到所述部件上，所述第一表面与所述铜箔的暴露表面接触; 和c）固化所述粘合剂膜，其中所述粘合剂膜的第二表面至少部分未固化。

公开(公告)号：US06354000B1

公开(公告)日：2002-03-12

申请号：US09310873

申请日：1999-05-12

Applicant: Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole

Inventor： Benjamin B. Ross ,  Phillip L. Jordan ,  Jeffery A. Strole

IPC: H01K310

CPC classification number: H01L23/49838 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/0269 ,  H05K1/112 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2201/09227 ,  H05K2201/09918 ,  H05K2201/10734 ,  H05K2203/107 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49213 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of constructing a planar array of electrical contact pads is disclosed, comprising the following steps. First, providing a set of dielectric layers each having two major surfaces and forming a set of first conductive paths on a first major surface, the paths terminating at or before an interior perimeter, to leave an interior area within the interior perimeter free of conductive paths and an exterior area outside of the interior perimeter having the first conductive paths. Second, forming a set of second conductive paths on a second major surface, the second conductive paths terminating generally inside the interior perimeter. Third, joining the sets of dielectric layers to form a depthwise stack of layers, the stack of layers having a top surface and the first major surface being interposed depthwise between the top surface and the second major surface. Forth, forming an array of first and second electrical contact pads on the top surface, each first electrical contact pad overlaying a portion of the exterior area and each second electrical contact pad overlaying a portion of the interior area. Fifth and finally, forming a set of plated vias to connect each first electrical contact pad to a first conductive path and each second electrical contact pad to a second conductive path.

Abstract translation: 公开了一种构成电接触焊盘的平面阵列的方法，包括以下步骤。 首先，提供一组各自具有两个主表面并且在第一主表面上形成一组第一导电路径的电介质层，所述路径终止于内部周边之间或之前，以在内部周边内部离开导电路径 以及具有第一导电路径的内部周边外部的外部区域。 第二，在第二主表面上形成一组第二导电路径，第二导电路径通常在内部周边内部终止。 第三，连接这些电介质层以形成层的深度叠层，所述层的堆叠具有顶表面，并且第一主表面在顶表面和第二主表面之间深深地插入。 其中，在顶表面上形成第一和第二电接触焊盘的阵列，每个第一电接触焊盘覆盖外部区域的一部分和覆盖内部区域的一部分的每个第二电接触焊盘。 第五，最后，形成一组电镀通孔，以将每个第一电接触焊盘连接到第一导电路径，将每个第二电接触焊盘连接到第二导电路径。

公开(公告)号：US20020005249A1

公开(公告)日：2002-01-17

申请号：US09904386

申请日：2001-07-12

Inventor： Fujio Kuwako ,  Tomohiro Ishino

IPC: B32B031/00

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B37/0023 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/09 ,  H05K3/025 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09509 ,  Y10S428/914 ,  Y10T428/1438 ,  Y10T428/24843 ,  Y10T428/24917 ,  Y10T428/2804

Abstract: An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH). In order to attain the object, there is provided a method for producing a copper-clad laminate employing the following copper foil serving as an outer layer: (1) a resin-coated copper foil being formed of copper foil having a thickness of 15 nullm or more and a rupture strength of 275 kN/m2 or more as measured through a bulge test performed after the foil is heated, wherein the resin-coated copper foil has a resin layer on one side of the copper foil; (2) a copper foil with etchable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 nullm or more; or (3) a copper foil with peelable carrier, wherein the total thickness of the carrier layer and the copper foil layer is 20 nullm or more, the releasing layer formed between the carrier layer and the copper foil layer having a peel strength of 5 gf/cm to 300 gf/cm as measured after heating.

Abstract translation: 本发明的目的是防止外部铜箔层在具有通孔或空洞的内层基板上产生的凹陷缺陷，所述内壁基板具有间隙通孔（IVH）或盲孔 通孔（BVH）。 为了实现该目的，提供了一种使用以下铜箔作为外层的覆铜层压板的制造方法：（1）由厚度为15μm的铜箔形成的树脂被覆铜箔 通过在箔加热后进行的隆起试验测定的破裂强度为275kN / m 2以上，其中，树脂被覆铜箔在铜箔的一侧具有树脂层; （2）具有可蚀刻载体的铜箔，其中载体层和铜箔层的总厚度为20μm以上; 或（3）具有可剥离载体的铜箔，其中载体层和铜箔层的总厚度为20μm以上，剥离强度为5gf的载体层与铜箔层之间形成的剥离层 / cm至300gf / cm。

公开(公告)号：US06254971B1

公开(公告)日：2001-07-03

申请号：US09202078

申请日：1999-04-23

Applicant: Teruo Katayose ,  Shozo Kinoshita ,  Takeshi Arai

Inventor： Teruo Katayose ,  Shozo Kinoshita ,  Takeshi Arai

IPC: B32B300

CPC classification number: H05K3/4655 ,  H01L23/142 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/024 ,  H05K1/0326 ,  H05K3/4652 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249999 ,  Y10T428/25 ,  Y10T428/31529 ,  H01L2924/00

Abstract: The invention provides resin-having metal foil for a multilayered wiring board which comprises metal foil having provided on one side thereof a film of a thermosetting resin having a relative dielectric constant of not higher than 3.3 at a frequency range of not lower than 1 MHz and having a resin flow of from 1 to 50% or from 5 to 50%, and a process for producing the same. The invention also provides a (sequentially) multilayered wiring board produced by using the resin-having metal foil and an electronic device comprising the multilayered wiring board and an electronic element connected thereto with a wiring means.

Abstract translation: 本发明提供了一种用于多层布线板的树脂用金属箔，该金属箔包括金属箔，该金属箔的一面在不低于1MHz的频率范围内设置相对介电常数不高于3.3的热固性树脂的膜，以及 树脂流动率为1〜50％或5〜50％，及其制造方法。 本发明还提供了一种通过使用具有树脂的金属箔制造的（顺序）多层布线板和包括多层布线板的电子器件和与布线装置连接的电子元件。

公开(公告)号：US06197149B1

公开(公告)日：2001-03-06

申请号：US09057522

申请日：1998-04-09

Applicant: Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

Inventor： Kazuhito Kobayashi ,  Yasushi Kumashiro ,  Atsushi Takahashi ,  Koji Morita ,  Takahiro Tanabe ,  Kazunori Yamamoto ,  Akishi Nakaso ,  Shigeharu Arike ,  Kazuhisa Otsuka ,  Naoyuki Urasaki ,  Daisuke Fujimoto ,  Nozomu Takano

IPC: C09J500

CPC classification number: H05K3/4655 ,  C09D5/00 ,  H05K1/0373 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0248 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10T428/24994 ,  Y10T428/249944 ,  Y10T428/249946 ,  Y10T428/249952

Abstract: An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Abstract translation: 一种绝缘漆，其包括树脂组分，电绝缘晶须，并且如果需要，可以使用一种或多种添加剂，例如离子吸附剂和/或用于防止铜损伤的有机试剂，其通过将添加剂添加到树脂组分和晶须 或过滤晶须，或通过使用珠磨机或三辊研磨机等进行研磨，对于制造具有高布线密度，高可靠性和优异的其它电性能的多层印刷电路板是优异的。