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公开(公告)号:US20240213643A1
公开(公告)日:2024-06-27
申请号:US18169211
申请日:2023-02-15
Applicant: Waseda University
Inventor: Seiji NISHI , Takuro SATO , Kazuhiko TAMESUE , Tetsuya KAWANISHI
Abstract: The first conductor plate has a groove portion that has a rectangular cross section and is formed in parallel with a first main surface such that the longitudinal direction becomes a first direction, and a first vertical tube portion formed in a direction away from the second conductor plate in a second direction orthogonal to the first direction and the first main surface, with a branch position in the groove as a starting point. The second conductor plate includes a reflection portion that is inserted into the groove portion in a manner protruding from a second main surface, which is a flat surface of the second conductor plate in contact with the first main surface, and has a reflection surface that reflects the radio wave, propagated along the groove portion, toward the first vertical tube portion.
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公开(公告)号:US11676935B2
公开(公告)日:2023-06-13
申请号:US17612445
申请日:2020-04-03
Applicant: WASEDA UNIVERSITY , HARIMA CHEMICALS, INC.
Inventor: Jun Mizuno , Hiroyuki Kuwae , Kosuke Yamada , Masami Aihara , Takayuki Ogawa
CPC classification number: H01L24/80 , H01L24/08 , H01L2224/08145 , H01L2224/80895
Abstract: A bonding method is capable of realizing high bonding strength and connection reliability even at a connection part in a high temperature area by means of simple operation low temperature bonding. The method includes a first step wherein, on at least one of the bonded surfaces of two materials to be bonded having a smooth surface, a thin film of noble metal with a volume diffusion coefficient greater than that of the base metal of the material to be bonded is formed using an atomic layer deposition method at a vacuum of 1.0 Pa or higher, a second step wherein a laminate is formed by overlapping the two materials to be bonded so that the bonded surfaces of the two materials are connected through the thin film, and a third step wherein the two materials to be bonded are bonded by holding the laminate at a predetermined temperature.
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公开(公告)号:US11639403B2
公开(公告)日:2023-05-02
申请号:US16679540
申请日:2019-11-11
Applicant: Samsung Electronics Co., Ltd. , Waseda University
Inventor: Wonsung Choi , Hiroyuki Nishide , Seokgwang Doo , Kenichi Oyaizu
Abstract: A polymer includes a repeating unit represented by at least one of Formula 1a or Formula 1b: wherein, in Formulae 1a or 1b, CY1 is a group represented by at least one of Formula 1-2 or Formula 1-4, CY2 is a group represented by Formula 1-3, and L1, L2, a1, and a2 are defined the same as in the specification, and in Formulae 1-2, Formula 1-3, or 1-4, X, Y, R1, R2, R11 to R14, b1, b2, R21, R22, b21, b22, Z1, Z2, c1, and c2 are defined the same as in the specification.
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公开(公告)号:US20230100804A1
公开(公告)日:2023-03-30
申请号:US17909384
申请日:2020-07-09
Applicant: Waseda University
Inventor: Suguru Noda , Rongbin Xie
Abstract: Provided is a conductive material that is capable of achieving a high-electric conductivity, long-term stability under an atmospheric environment, heat and high humidity stabilities, as well as a conductive film and a solar cell using the same. The conductive material includes a mixture of carbon nanotubes (CNTs) and polystyrene sulfonic acid (PSS acid). The element ratio (S/C ratio) of sulfur (S) to carbon (C) in the mixture may be from 0.001 to 0.1 in terms of the number of atoms. CNTs and PSS acid may make up a content percentage of 10 wt % or more in the mixture. These conductive films comprised of the conductive material 6 may have a weight per unit area of the CNTs in the range from 1 mg/m2 to 10000 mg/m2. The solar cell may include the conductive film 7, wherein the film is on the surface of a semiconductor.
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公开(公告)号:US11597943B2
公开(公告)日:2023-03-07
申请号:US16828146
申请日:2020-03-24
Inventor: Motoki Tominaga , Kohji Ito
IPC: C12N15/82
Abstract: A transgenic plant which exhibits a growth capacity which is enhanced compared to that of a host plant, and has a chimeric protein of a peptide containing an amino acid sequence derived from a motor domain of myosin XI of a donor plant 1, which is a plant species other than the host plant, and a peptide containing an amino acid sequence derived from a domain other than the motor domain of myosin XI of a donor plant 2, which is the host plant or a plant species other than the host plant, the transgenic plant being characterized in that the motor domain loop 2 region has EEPKQGGKGGGKSSFSSIG or EEPKQGGGKGGSKSSFSSIG, and in addition to these sequences, has an amino acid sequence in which one to six amino acids have been deleted, replaced or added.
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公开(公告)号:US20220397501A1
公开(公告)日:2022-12-15
申请号:US17774728
申请日:2020-11-13
Applicant: WASEDA UNIVERSITY , KANAGAWA INSTITUTE OF INDUSTIAL SCIENCE AND TECHNOLOGY , JP STEEL PLANTECH CO.
Inventor: Atsushi Hosoi , Hiroyuki Kawada , Kazuki Harada , Kristine Munk Jespersen
IPC: G01N3/08
Abstract: A fracture toughness testing machine of the invention makes it possible to evaluate fracture toughness of a specimen in pure mode such that the effect of thermal residual stresses is removed, when the stresses are present in the specimen obtained by bonding dissimilar materials. The testing machine includes: testing-load applying means for applying a predetermined testing load to the specimen, in which the stresses are present; and cancelling-load applying means for applying a cancelling load to the specimen to cancel the stresses therein. The cancelling-load applying means includes: a pressing-force applying portion that applies a pressing force to the specimen as the canceling load; and a pressing-force determining portion that determines magnitude of the force. The pressing-force determining portion calculates the magnitude of the force using pre-stored equations so that an energy release rate related to in-plane shear mode crack deformation becomes zero.
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公开(公告)号:US11492884B2
公开(公告)日:2022-11-08
申请号:US17256014
申请日:2018-09-11
Applicant: Japan E&P International Corporation , Waseda University
Inventor: Yuchen Liu , Masanori Kurihara
IPC: E21B43/26 , C10L3/10 , E21B43/16 , E21B33/138
Abstract: A methane hydrate production method comprising a step of performing a reservoir grouting process. The reservoir grouting process comprises: injecting a grouting agent into a frozen soil reservoir on the land or a seabed reservoir for targeting methane hydrate existing within sand particles of the target reservoirs; or injecting a filling material into cavities naturally or artificially occurred in a frozen soil reservoir on the land or a seabed reservoir for targeting methane hydrate existing within sand particles of the target reservoirs, and enabling a grouting body being constructed.
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公开(公告)号:US20220233638A1
公开(公告)日:2022-07-28
申请号:US17598996
申请日:2020-03-30
Applicant: Waseda University
Inventor: Takeshi Maruyama
Abstract: A cell competition regulator containing a protein containing α3 domain of MHC class Ia or an agonist antibody against LILRB3, or a substance that inhibits binding between MHC class Ia and LILRB3 is provided.
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公开(公告)号:US20220014279A1
公开(公告)日:2022-01-13
申请号:US17272597
申请日:2019-08-30
Applicant: WASEDA UNIVERSITY
Inventor: Hiroshi Kawarada , Yutaro Iyama , Miki Kajiya , Kaito Tadenuma , Yukihiro Shintani
Abstract: The invention is to provide an underwater communication device and an underwater communication method that can be applied to mobile communication in water. An underwater communication device 10 includes: a transmitter 12 configured to transmit an electric signal; and a receiver 14 arranged away from the transmitter 12 via water and configured to receive the electric signal, in which the receiver 14 includes an field effect transistor 23 having a channel region 39 provided at a position in contact with the water, and a drive circuit 26 configured to generate a potential difference between a source region 31 and a drain region 33 of the field effect transistor 23.
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公开(公告)号:US20210375572A1
公开(公告)日:2021-12-02
申请号:US17288084
申请日:2019-10-21
Applicant: WASEDA UNIVERSITY , MEIDENSHA CORPORATION
Inventor: Suguru NODA , Sae KITAGAWA , Kotaro YASUI , Hisashi SUGIME , Daizo TAKAHASHI , Yuichi NISHIKIORI , Hayato OCHI , Rena TAKAHASHI , Toshimasa FUKAI
Abstract: It is a CNT device (1) (carbon-metal structure) equipped with a carbon nanotube layer (2) (CNT layer 2; same hereafter) on a metal pedestal (4). The metal pedestal (4) is brazed to the CNT layer (2) with a brazing material layer (3) interposed therebetween. When manufacturing the CNT device (1), firstly, the CNT layer (2) is formed on a heat-resistant textured substrate (6). Next, the metal pedestal (4) is brazed to the CNT layer (2) that is on the heat-resistant textured substrate (6) with the brazing material layer (3) interposed therebetween. Then, the metal pedestal (4) (and the CNT layer 2) is peeled off the heat-resistant textured substrate (6) to transfer the CNT layer (2) from the heat-resistant textured substrate (6) to the metal pedestal (4).
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