公开(公告)号：US06801436B2

公开(公告)日：2004-10-05

申请号：US09964747

申请日：2001-09-28

Applicant: Tom E. Pearson ,  George Arrigotti ,  Christopher D. Combs ,  Raiyomand F. Aspandiar

Inventor： Tom E. Pearson ,  George Arrigotti ,  Christopher D. Combs ,  Raiyomand F. Aspandiar

IPC: H05K712

CPC classification number: H05K3/3405 ,  H05K1/142 ,  H05K2201/09127 ,  H05K2201/10204 ,  H05K2201/10446 ,  H05K2201/209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53252

Abstract: A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

Abstract translation: 提供了用于组装具有第一表面，第二表面和边缘的印刷电路板的机构和方法。 印刷电路板可以包括至少一个阴构件以接收相应的阳构件。 该机构可以包括具有连接到印刷电路板的边缘的边缘的延伸板。 延伸板可以包括从延伸板的边缘延伸并连接到至少一个阳构件的阳构件，以便将延伸板耦合到印刷电路板。

公开(公告)号：US06796027B2

公开(公告)日：2004-09-28

申请号：US10146800

申请日：2002-05-17

Applicant: Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Eiji Shiohama ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Takuma Hashimoto

Inventor： Toshiyuki Suzuki ,  Kazuya Nakagawa ,  Mitsuru Kobayashi ,  Eiji Shiohama ,  Masaru Sugimoto ,  Hideyoshi Kimura ,  Takuma Hashimoto

IPC: H05K310

CPC classification number: H05K3/242 ,  H05K1/0284 ,  H05K1/0293 ,  H05K3/045 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09127 ,  H05K2203/175 ,  H05K2203/308 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.

Abstract translation: 提供一种有效地制造印刷电路板的方法。 在该方法中，在具有突起的基板上形成金属薄膜。 然后，通过图案化金属薄膜，在基板上形成初始电路图案。 初始电路图案包括彼此隔离的第一和第二电路图案，以及形成在突起上的导电层，以在第一和第二电路图案之间进行临时电连接。 通过电流通过初始电路图案进行电镀，以在初始电路图案上形成附加的金属膜。 在电镀之后，去除突起上的导电层以在第一和第二电路图案之间提供电绝缘。

公开(公告)号：US20040032562A1

公开(公告)日：2004-02-19

申请号：US09846582

申请日：2001-05-01

Applicant: Three-Five Systems, Inc.

Inventor： Edward William Lindblad ,  Randall Jay Glinski

IPC: G02F001/13

CPC classification number: G02F1/1309 ,  G02F1/13452 ,  H05K1/0268 ,  H05K1/0293 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10022 ,  H05K2203/175

Abstract: An apparatus and method for altering a contrast of an as-manufactured LCD device is described. The LCD device includes a contrast-setting circuit and a printed circuit flex. During the assembly process, a shunt around a resistor in a voltage divider subcircuit of the contrast-setting circuit extends onto a portion of the printed circuit flex. Due to the shunt, the resistor is initially in a shorted state such that the resistor does not influence the contrast-setting circuit. During a stage of the assembly process, a current contrast of the liquid crystal display device is determined. If the current contrast deviates from an intended contrast, the portion of the printed circuit flex is severed from the rest of the printed circuit flex such that the resistor becomes unshorted and thereby influences the contrast-setting circuit to provide a contrast closer to the intended contrast.

Abstract translation: 描述了用于改变制造的LCD装置的对比度的装置和方法。 LCD装置包括对比度设定电路和印刷电路弯曲部。 在组装过程中，对比度设置电路的分压器子电路中的电阻器周围的分路延伸到印刷电路弯曲部分上。 由于分流，电阻器最初处于短路状态，使得电阻器不影响对比度设置电路。 在组装过程的阶段，确定液晶显示装置的当前对比度。 如果当前的对比度偏离预期的对比度，则打印电路的柔性部分与印刷电路的其余部分断裂，使得电阻器变得不顺序，从而影响对比度设置电路，以提供更接近目标对比度的对比度 。

公开(公告)号：US20030116344A1

公开(公告)日：2003-06-26

申请号：US10315878

申请日：2002-12-10

Inventor： Richard Gueckel

IPC: H05K001/02

CPC classification number: F16H61/0006 ,  H05K3/0064 ,  H05K3/202 ,  H05K2201/09127 ,  H05K2201/10598

Abstract: A built-in unit (10) for a transmission control of a motor vehicle has a substrate plate (11), on which stamped grids (21, 22) are secured. The stamped grids electrically connect sensors and regulating elements with a control apparatus, which likewise is secured to the substrate plate (11). The individual conductor tracks (23, 24) of the stamped grids (21, 22) are fixed to one another by means of reinforcing elements, or injection-molded parts (25 through 28). Additional expanding mandrels (30) and expanding dowels (36) are provided on the reinforcing elements (25 through 28), whereby the expanding dowels project into openings (42) in the substrate plate (11). By means of the inventive construction of the reinforcing elements (25 through 28), a secure attachment of the stamped grids (21, 22) to the substrate plate (11) is made possible.

Abstract translation: 用于机动车辆的变速器控制的内置单元（10）具有衬垫板（11），冲压网格（21,22）被固定在其上。 冲压网格用传感器和调节元件与控制装置电连接，控制装置同样固定到基板（11）上。 冲压网格（21,22）的单个导体轨道（23,24）通过增强元件或注模部件（25至28）彼此固定。 在加强元件（25至28）上设置有另外的扩展型心轴（30）和扩展销（36），由此扩展的销钉突出到基板（11）中的开口（42）中。 通过本发明的加强元件（25至28）的结构，可以将冲压的格栅（21,22）牢固地连接到基板（11）上。

公开(公告)号：US20030043552A1

公开(公告)日：2003-03-06

申请号：US10231322

申请日：2002-08-30

Applicant: NEC CORPORATION

Inventor： Takashi Abe

IPC: H05K001/00 ,  H05K001/18 ,  H05K007/02 ,  H05K007/06 ,  H05K007/08

CPC classification number: H05K1/0266 ,  H05K1/029 ,  H05K1/18 ,  H05K2201/09127 ,  H05K2201/09927 ,  H05K2201/10204

Abstract: A circuit board permits common use of the same circuit board without separately manufacturing the circuit board per providing destinations when similar circuit boards are manufactured for a plurality of providing destinations in the same factory. The circuit board has at least a first providing destination indicating region on which a first providing destination is indicated and a second providing destination indicating region located adjacent the first providing destination indicating region, on which second providing destination region, a second providing destination is indicated, the providing destination indicating regions other than that indicating an intended providing destination being hidden by mounting parts thereon.

Abstract translation: 电路板允许在同一工厂中为多个提供目的地制造类似的电路板时，不需要在提供目的地的情况下单独制造电路板，因此可以通用同一电路板。 电路板至少具有指示第一提供目的地的第一提供目的地指示区域和位于第一提供目的地指示区域附近的第二提供目的地指示区域，第二提供目的地区域指示第二提供目的地区域， 提供目的地指示除了通过在其上安装部件来指示预期提供目的地被隐藏的区域之外的区域。

公开(公告)号：US20030037435A1

公开(公告)日：2003-02-27

申请号：US10215953

申请日：2002-08-08

Applicant: Power Integrations, Inc.

Inventor： Balu Balakrishnan

IPC: H05K003/02 ,  G01R001/00

CPC classification number: H05K3/225 ,  H02M3/00 ,  H05K1/0262 ,  H05K1/0293 ,  H05K3/0047 ,  H05K3/005 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10689 ,  H05K2203/0228 ,  H05K2203/171 ,  H05K2203/175 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49787 ,  Y10T29/49789 ,  Y10T29/4979 ,  Y10T29/49798 ,  Y10T29/5149 ,  Y10T29/515

Abstract: Electrical circuit trimming methods. In one aspect of the invention, a trimming method includes assembling one or more components of an electrical circuit onto a printed circuit board having one or more electrical connections coupled to the said one or more components. An electrical parameter of the electrical circuit is then trimmed. The trimming of the electrical parameter of the electrical circuit includes removing a portion of the printed circuit board to break the electrical connection on the printed circuit board. In another aspect of the invention, the trimming the electrical parameter of the electrical circuit includes electrical programming of the electrical circuit.

公开(公告)号：US20020112347A1

公开(公告)日：2002-08-22

申请号：US09789370

申请日：2001-02-20

Inventor： Balu Balakrishnan

IPC: H05K003/30 ,  G05F001/00

CPC classification number: H05K3/225 ,  H02M3/00 ,  H05K1/0262 ,  H05K1/0293 ,  H05K3/0047 ,  H05K3/005 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10689 ,  H05K2203/0228 ,  H05K2203/171 ,  H05K2203/175 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49787 ,  Y10T29/49789 ,  Y10T29/4979 ,  Y10T29/49798 ,  Y10T29/5149 ,  Y10T29/515

Abstract: Electrical circuit trimming methods. In one aspect of the invention, a trimming method includes assembling one or more components of an electrical circuit onto a printed circuit board having one or more electrical connections coupled to the said one or more components. An electrical parameter of the electrical circuit is then trimmed. The trimming of the electrical parameter of the electrical circuit includes removing a portion of the printed circuit board to break the electrical connection on the printed circuit board. In another aspect of the invention, the trimming the electrical parameter of the electrical circuit includes electrical programming of the electrical circuit.

Abstract translation: 电路修整方法。 在本发明的一个方面，修整方法包括将电路的一个或多个部件组装到具有耦合到所述一个或多个部件的一个或多个电连接的印刷电路板上。 然后对电路的电气参数进行修整。 修整电路的电气参数包括去除印刷电路板的一部分以破坏印刷电路板上的电连接。 在本发明的另一方面，修整电路的电气参数包括电路的电气编程。

公开(公告)号：US06373709B1

公开(公告)日：2002-04-16

申请号：US09556123

申请日：2000-04-20

Applicant: Atsushi Hino ,  Hitoshi Ishizaka

Inventor： Atsushi Hino ,  Hitoshi Ishizaka

IPC: H05K100

CPC classification number: B82Y25/00 ,  B82Y10/00 ,  G11B5/3903 ,  G11B5/40 ,  G11B5/455 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/486 ,  G11B2005/3996 ,  H05K1/0256 ,  H05K1/0259 ,  H05K1/0268 ,  H05K1/0293 ,  H05K1/118 ,  H05K3/28 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09972 ,  H05K2203/175

Abstract: A flexible wiring board that can bridge wires and also can prevent production of conductive foreign materials in use, to secure good performance of a magnetic head. The flexible wiring board for connecting therethrough a suspension substrate having mounted thereon a magnetic head of a hard disk drive and a control circuit substrate for actuating the magnetic head includes a short-circuit forming portion for forming a shorting portion for bridging wires to prevent electrostatic destruction of the magnetic head; and a cut for removing the shorting portion. When the flexible wiring board is cut along the cut, the shorting portion can be removed without producing conductive foreign material resulting from the cutting off of the shorting portion.

Abstract translation: 可以桥接电线的柔性布线板，也可以防止使用中导电异物的生产，以确保磁头的良好性能。 用于通过其安装有硬盘驱动器的磁头和用于致动磁头的控制电路基板的悬置基板的柔性布线板包括短路形成部分，用于形成用于桥接电线的短路部分以防止静电破坏 的磁头; 以及用于去除短路部的切口。 当沿着切口切割柔性布线板时，可以去除短路部分而不会由于短路部分的切断而产生导电异物。

公开(公告)号：US06344974B1

公开(公告)日：2002-02-05

申请号：US09394686

申请日：1999-09-13

Applicant: Minoru Hirata ,  Masakazu Hijikata ,  Hirokazu Takase

Inventor： Minoru Hirata ,  Masakazu Hijikata ,  Hirokazu Takase

IPC: H05K702

CPC classification number: H05K3/0052 ,  H05K1/0266 ,  H05K3/0008 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/167

Abstract: A printed circuit board has a product board region where electronic components are mounted. The printed circuit board further has a positioning region where an element contour representing a certain mechanism element, an insulated substrate or the like is formed by a perforation line, a V-cut line or the like so as to be separated from the other portion of the positioning region along the line for another use. Instead of the foregoing element contour, a small printed circuit pattern with or without a small electronic component may be separably formed in the positioning region.

Abstract translation: 印刷电路板具有安装电子部件的产品板区域。 印刷电路板还具有定位区域，其中通过穿孔线，V切割线等形成表示特定机构元件，绝缘基板等的元件轮廓，以便与其他部分分离 沿线的定位区域用于另一种使用。 代替上述元件轮廓，具有或不具有小电子部件的小的印刷电路图案可以在定位区域中可分离地形成。

公开(公告)号：US6121553A

公开(公告)日：2000-09-19

申请号：US957011

申请日：1997-10-23

Applicant: Eiichi Shinada ,  Masao Kanno ,  Yuuichi Shimayama ,  Yoshiyuki Tsuru ,  Takeshi Horiuchi

Inventor： Eiichi Shinada ,  Masao Kanno ,  Yuuichi Shimayama ,  Yoshiyuki Tsuru ,  Takeshi Horiuchi

IPC: H01L23/498 ,  H05K3/00 ,  H05K3/10 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K3/4697 ,  H01L23/49894 ,  H05K3/103 ,  H05K3/386 ,  H05K3/4626 ,  H05K3/4655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09127 ,  H05K2201/10287 ,  H05K2203/063 ,  H05K3/0035 ,  H05K3/0094 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917

Abstract: An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300.degree. C. of 30 MPa or more and a glass transition temperature of 180.degree. C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.

Abstract translation: 一种粘合剂组合物，其包含（a）优选分子量为80,000以上的聚酰胺 - 酰亚胺树脂和（b）优选包含环氧树脂和固化剂的热固性组分和/或其固化促进剂，用于提供绝缘 在300℃下的储能弹性模量为30MPa以上，玻璃化转变温度为180℃以上的粘合剂层。 绝缘粘合剂适用于线切割电路板，多层印刷电路板和芯片载体的电路板。