公开(公告)号：US20240260197A1

公开(公告)日：2024-08-01

申请号：US18428062

申请日：2024-01-31

Applicant: IBIDEN CO., LTD.

Inventor： Nobuhisa KURODA ,  Tomoya DAIZO

IPC: H05K1/18 ,  H01L23/498 ,  H01L25/16 ,  H01L23/00

CPC classification number: H05K1/186 ,  H01L23/49838 ,  H01L25/16 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10159 ,  H05K2201/10977

Abstract: A wiring substrate includes a first insulating layer, a first conductive layer laminated on a surface of the first insulating layer and including pads, a second insulating layer laminated on the first insulating layer such that the second insulating layer is covering the first conductive layer and has a cavity exposing the pads of the first conductive layer, an electronic component accommodated in the cavity of the second insulating layer such that the electronic component has electrodes formed on a surface of the electronic component, and a conductive connecting part formed between the electrodes of the electronic components and the pads of the first conductive layer in the cavity of the second insulating layer such that the conductive connecting part electrically connects the electrodes of the electronic components and the pads of the first conductive layer.

公开(公告)号：US20240260167A1

公开(公告)日：2024-08-01

申请号：US18415119

申请日：2024-01-17

Applicant: CANON KABUSHIKI KAISHA

Inventor： KOJI NOGUCHI ,  MITSUTOSHI HASEGAWA ,  SATORU HIGUCHI

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/498 ,  H01R12/62 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H05K1/18

CPC classification number: H05K1/0201 ,  H01L23/49838 ,  H01R12/62 ,  H04N23/51 ,  H04N23/52 ,  H04N23/54 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/181 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10068

Abstract: A printed wiring board has a first conductive layer including a second electrode group bonded to a first electrode group of a flexible printed circuit board, and a second conductive layer, and a plane including the second conductive layer includes a first region including a reference region set in a bonded portion, a second region via a first boundary, and a third region via a second boundary, and a first boundary portion is positioned within a range of 0.5 times or more and 5 times or less a length of a short side of four sides in a prescribed direction, and a second boundary portion is positioned within a range of 0.5 times or more and 5 times or less the length of the short in a prescribed direction, and a density of the second conductive layer in the first region is higher than that in the second region.

公开(公告)号：US20240260140A1

公开(公告)日：2024-08-01

申请号：US18425937

申请日：2024-01-29

Applicant: XOTHRM LLC

Inventor： JoHan Wang ,  Sean T. Whalen

IPC: H05B1/02 ,  A47G9/02 ,  G01K1/02 ,  G01K3/00 ,  G05D23/19 ,  H05B3/34 ,  H05K1/18

CPC classification number: H05B1/0272 ,  A47G9/0215 ,  G01K1/026 ,  G01K3/005 ,  G05D23/1931 ,  H05K1/18 ,  H05B3/342 ,  H05K2201/10022 ,  H05K2201/10037

Abstract: In one instance, a heating pad is disclosed that is flexible, battery-power, and weighted. The heating pad includes a sleeve formed with a top layer and a bottom layer and having an interior. A weighted segment layer is disposed within the interior of the sleeve. The weighted segment layer may include a plurality of pockets each having a plurality of weights. A conductive layer or sheet is disposed within the interior of the sleeve closer to the user than the weighted segment layer when in the deployed position. A battery and control unit is electrically coupled to the conductive layer for selectively providing power to the conductive layer. At least one temperature sensor is coupled to the conductive layer and electrically coupled to the control unit and provides safety features. Other heating pads are presented.

公开(公告)号：US20240251502A1

公开(公告)日：2024-07-25

申请号：US18622921

申请日：2024-03-30

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Kazuma TANIMUKAI ,  Masaki KONO ,  Hirotaka DOI ,  Reiji KAWASHIMA ,  Yuki NAKAJIMA

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/0277 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/2009

Abstract: A substrate structure includes a first substrate with a plurality of chip parts including a first chip part mounted, and a second substrate connected to the first substrate. The first chip part has a strain equal to or more than a predetermined value, which is from 500 μST to 4000 μST, in a non-connected state in which the second substrate is not connected to the first substrate and the first substrate is supported at two predetermined points. The strain of the first chip part is equal to or less than the predetermined value in a connected state in which the second substrate is connected to the first substrate and the first substrate is supported at the two predetermined points.

公开(公告)号：US12022604B2

公开(公告)日：2024-06-25

申请号：US17442404

申请日：2020-03-26

Applicant: NexFi Technology Inc. ,  OSAKA UNIVERSITY

Inventor： Kei Nishioka ,  Toshio Hanada ,  Takashi Nakamura ,  Tsuyoshi Funaki

IPC: H05K1/02 ,  H01L25/16 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L25/16 ,  H05K1/181 ,  H05K2201/10022 ,  H05K2201/10166

Abstract: A power substrate (101) of the present invention includes a plurality of insulating substrates (106) arranged side by side along a plurality of current paths (P) extending in the same direction, a plurality of MOS transistors (108) mounted on one major surface of each of the plurality of insulating substrates (106) with a first conductive layer (107) and a first solder bonding layer (109) in between, and a heat dissipation member (110) in contact with other major surfaces of all of the insulating substrates with a second conductive layer (107) and a second solder bonding layer (109) in between, and each of the current paths (P) is formed by connecting one or more of the MOS transistors (108) mounted on one of the insulating substrates (106) with one or more of the MOS transistors (108) mounted on a different one of the insulating substrates (106) in series with each other.

公开(公告)号：US11871519B2

公开(公告)日：2024-01-09

申请号：US17081467

申请日：2020-10-27

Applicant: Samsung Display Co., Ltd.

Inventor： Taejin Kim

IPC: H05K1/18 ,  H05K1/11 ,  G09G3/20

CPC classification number: H05K1/189 ,  G09G3/20 ,  H05K1/111 ,  H05K1/118 ,  H05K2201/10022 ,  H05K2201/10128 ,  H05K2201/10189

Abstract: A display device includes a driver including flexible circuit boards connected to a display panel. The driver includes a first source circuit board, a second source circuit board, a main circuit board including a controller that generates a power source voltage and applying the power source voltage to each of the first source circuit board and the second source circuit board, and a connector connecting the first source circuit board and the second source circuit board. The connector is electrically connected to a first voltage line that is the most adjacent to the second source circuit board among the voltage lines of the first source circuit board and a second voltage line that is the most adjacent to the first source circuit board among the voltage lines of the second source circuit board.

公开(公告)号：US20230389188A1

公开(公告)日：2023-11-30

申请号：US18320961

申请日：2023-05-19

Applicant: YAZAKI CORPORATION

Inventor： Hidehiko Shimizu

IPC: H05K1/18 ,  H01M50/519 ,  H01M50/588

CPC classification number: H05K1/189 ,  H01M50/519 ,  H01M50/588 ,  H05K2201/10022 ,  H05K2201/2009 ,  H05K2201/10181 ,  H05K2201/10272 ,  H05K2201/2018 ,  H05K2201/10636 ,  H05K2201/10151

Abstract: A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board; and a second potting agent that overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component. The first potting agent has higher flexibility as compared with the second potting agent.

公开(公告)号：US20230276576A1

公开(公告)日：2023-08-31

申请号：US18174619

申请日：2023-02-25

Applicant: Zhuhai ACCESS Semiconductor Co., Ltd.

Inventor： Xianming CHEN ,  Wenjian LIN ,  Gao HUANG ,  Lei FENG ,  Jindong FENG ,  Benxia HUANG ,  Zhijun ZHANG

IPC: H05K1/18 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H05K1/11 ,  H05K3/42 ,  H05K3/10 ,  H05K3/30

CPC classification number: H05K1/186 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/20 ,  H05K1/113 ,  H05K3/423 ,  H05K3/108 ,  H05K3/305 ,  H01L2224/19 ,  H01L2224/2101 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K3/0023

Abstract: A package substrate and a manufacturing method thereof are disclosed. The method includes: providing an inner substrate; processing an adhesive photosensitive material on a surface of a first side of the inner substrate to obtain an adhesive first insulating dielectric layer; mounting a component on the first insulating dielectric layer; and processing a photosensitive packaging material on the first side of the inner substrate to obtain a second insulating dielectric layer, where the second insulating dielectric layer covers the component.

公开(公告)号：US20230200032A1

公开(公告)日：2023-06-22

申请号：US18166551

申请日：2023-02-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shota HAYASHI ,  Nobuaki OGAWA ,  Yuki ASANO ,  Takanori UEJIMA ,  Hiromichi KITAJIMA ,  Takahiro EGUCHI

IPC: H05K9/00 ,  H01L25/065 ,  H01L25/16 ,  H01L23/552 ,  H01L21/56 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K9/0022 ,  H01L21/56 ,  H01L23/552 ,  H01L25/165 ,  H01L25/0655 ,  H05K1/181 ,  H05K3/284 ,  H05K9/0039 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10371 ,  H05K2203/025 ,  H05K2203/1316

Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The metal member further includes one or more foot portions extending forward or backward from the lower side.

公开(公告)号：US20230160946A1

公开(公告)日：2023-05-25

申请号：US17982266

申请日：2022-11-07

Applicant: Newpowerplasma Co., Ltd.

Inventor： Jinjoong KIM ,  Donggeun NOH

IPC: G01R31/28 ,  H05K1/02

CPC classification number: G01R31/2818 ,  H05K1/0237 ,  H05K2201/1003 ,  H05K2201/10022 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: A module type sensor includes a casing including a casing upper surface, a first casing side surface which is bent downward from the casing upper surface and has a lower end upwardly separated from a path through which a transmission line passes, and a second casing side surface which is bent downward from the casing upper surface and has a fixing bracket extending by being outwardly bent; a body unit fixedly installed inside the casing, formed of an insulator, supported by the printed circuit board at a lower end, and having, at a center, an opening which is open toward the transmission line; and a sensing substrate unit fixedly installed on an upper portion of the body unit, and including a voltage sensing circuit which is capacitively coupled to the transmission line exposed through the opening and a current sensing circuit which is inductively coupled to the transmission line.