Electronic device
    181.
    发明授权

    公开(公告)号:US12078882B2

    公开(公告)日:2024-09-03

    申请号:US18186298

    申请日:2023-03-20

    CPC classification number: G02F1/13336 G02F1/133308 G02F1/1337

    Abstract: An electronic device is provided. The electronic device includes a first electronic device unit. The first electronic device unit includes a first substrate and a second substrate disposed opposite to the first substrate. The first substrate includes a protruding part which protrudes outward a boundary of the second substrate along a protruding direction perpendicular to a normal direction of the first substrate. The protruding part includes a first side surface having a portion that has been grinded and a portion that has been ungrinded, and a surface roughness of the portion that has been grinded is different from a surface roughness of the portion that has been ungrinded.

    DISPLAY DEVICE
    182.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20240201743A1

    公开(公告)日:2024-06-20

    申请号:US18590976

    申请日:2024-02-29

    Abstract: A display device is provided by the present disclosure and includes a display panel, a cover, and a second adhesive. The cover includes an inner substrate, an outer substrate, and a first adhesive disposed between the inner substrate and the outer substrate. The second adhesive is disposed between the display panel and the cover. The display panel includes a flexible substrate and a display layer disposed between the flexible substrate and the cover. The display layer includes a self-emissive display element or a non-self-emissive display element. The flexible substrate includes a first substrate, a second substrate, and a third adhesive disposed between the first substrate and the second substrate. The first substrate is disposed between the third adhesive and the display layer. A distance is between an edge of the first adhesive and an edge of the inner substrate. The distance is greater than zero.

    ELECTRONIC DEVICE
    184.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240055571A1

    公开(公告)日:2024-02-15

    申请号:US18347583

    申请日:2023-07-06

    CPC classification number: H01L33/62 H01L33/58 B32B2457/20

    Abstract: An electronic device is disclosed. The electronic device includes a first substrate, a circuit assembly, a second substrate, a first adhesive layer, and a second adhesive layer. The circuit assembly is disposed on the first substrate. The second substrate is disposed on the circuit assembly. The first adhesive layer is disposed between the circuit assembly and the first substrate. The first adhesive layer has a first outer profile. The second adhesive layer is disposed between the circuit assembly and the second substrate. The second adhesive layer has a second outer profile. The first outer profile and the second outer profile correspond to a same side of the electronic device. At least a portion of the first outer profile and at least a portion of the second outer profile are non-overlapped.

    ELECTRONIC DEVICE
    189.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20230393687A1

    公开(公告)日:2023-12-07

    申请号:US18234391

    申请日:2023-08-16

    Abstract: An electronic device includes a substrate, a sensing unit overlapped with the substrate and including a first sub-unit and a second sub-unit, a first signal input electrically connected to the first sub-unit, a second signal input electrically connected to the second sub-unit, and a driving unit. The first sub-unit is driven by the driving unit through the first signal input, and the second sub-unit is driven by the driving unit through the second signal input. The first sub-unit has a first edge, the second sub-unit has a second edge, the first sub-unit and the second sub-unit are separated from each other by a spacing, and the spacing is located between the first edge and the second edge.

    ELECTRONIC DEVICE
    190.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20230389186A1

    公开(公告)日:2023-11-30

    申请号:US18136303

    申请日:2023-04-18

    Abstract: An electronic device is provided by the present disclosure. The electronic device includes a first main structure, a second main structure adjacent to the first main structure, a connecting structure connecting the first main structure and the second main structure, a first semiconductor disposed on the first main structure and a first insulating structure disposed between the first semiconductor and the first main structure, wherein the first insulating structure has a first groove.

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