公开(公告)号：US20050200136A1

公开(公告)日：2005-09-15

申请号：US11121377

申请日：2005-05-04

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  E05C19/00

CPC classification number: B29C45/0013 ,  B29C45/0001 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T292/03

Abstract: Hardware fastener devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

公开(公告)号：US20050172950A1

公开(公告)日：2005-08-11

申请号：US11096176

申请日：2005-03-31

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  A61F7/00

CPC classification number: B29C45/0013 ,  A61N1/0484 ,  A61N1/403 ,  A61N2/06 ,  B29C45/0001 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Heated clothing devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 加热衣服装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US20050139812A1

公开(公告)日：2005-06-30

申请号：US11060364

申请日：2005-02-17

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  H01C1/00

CPC classification number: B29C45/0013 ,  B29C45/0001 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: A molded conductive loaded resin-based product is processed to reduce surface resistivity. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 处理模制的导电负载树脂基产品以降低表面电阻率。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US20050136326A1

公开(公告)日：2005-06-23

申请号：US11053562

申请日：2005-02-08

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  H01M2/30

CPC classification number: H01M2/30 ,  B29C45/0001 ,  B29C45/0013 ,  B29C47/0004 ,  B29K2995/0005 ,  B29K2995/0013 ,  B29L2031/3456 ,  B29L2031/3468 ,  B29L2031/36 ,  G06K19/07749 ,  H01B3/30 ,  H01B3/308 ,  H01B7/02 ,  H01B13/0036 ,  H01M2/00 ,  H01M10/6551 ,  H01Q1/1271 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T29/49108

Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 电端子由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US20050093115A1

公开(公告)日：2005-05-05

申请号：US11013286

申请日：2004-11-23

Applicant: Charles Eytcheson

Inventor： Charles Eytcheson

IPC: H01L23/373 ,  H05K3/34 ,  H01L23/495

CPC classification number: H01L24/46 ,  H01L23/3733 ,  H01L24/29 ,  H01L24/31 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29076 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/37026 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/77272 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/2076 ,  H01L2924/351 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0281 ,  H05K2201/10537 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/37099

Abstract: A joint structure and method for bonding together two components, such as when attaching an electrical circuit element to a conductor on a substrate. The joint structure comprises a mesh infiltrated by a solder material, in which the mesh is preferably formed of a material having a higher thermal conductivity than the solder material. The joint structure is able to offer improvements in thermal conductivity, electrical conductivity, reflow processing, and stress distribution between the structures it connects. Each of these attributes of the joint structure can be tailored to some degree by the choices of materials for the mesh and the solder material.

Abstract translation: 一种用于将两个部件接合在一起的接合结构和方法，例如当将电路元件附接到基板上的导体时。 接头结构包括由焊料材料渗透的网，其中网状物优选由具有比焊料材料更高的热导率的材料形成。 接头结构能够提供其连接的结构之间的导热性，导电性，回流加工和应力分布的改善。 关节结构的这些属性中的每一个可以通过网格和焊料材料的材料的选择在某种程度上被调整。

公开(公告)号：US20050025919A1

公开(公告)日：2005-02-03

申请号：US10929299

申请日：2004-08-30

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10 ,  B65D1/00

CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/1334

Abstract: Conductive containers useful for anti-static devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 用于防静电装置的导电容器由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：US20050024290A1

公开(公告)日：2005-02-03

申请号：US10933030

申请日：2004-09-02

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: B29C45/00 ,  G06K19/077 ,  H01Q1/12 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/32 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00 ,  H01Q9/04 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/00 ,  H05K1/09 ,  H05K3/10

CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  G08B21/0297 ,  H01Q1/22 ,  H01Q1/2225 ,  H01Q1/36 ,  H01Q1/364 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: RFID antennas are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: RFID天线由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：US20040239578A1

公开(公告)日：2004-12-02

申请号：US10863407

申请日：2004-06-08

Applicant: Integral Technologies, Inc.

Inventor： Thomas Aisenbrey

IPC: H01Q001/24 ,  H01Q001/42

CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29C70/58 ,  B29C70/882 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/243 ,  H01Q17/00 ,  H01R13/6599 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T428/1328 ,  Y10T428/249972

Abstract: Electromagnetic absorbing devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 电磁吸收装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：US20040233112A1

公开(公告)日：2004-11-25

申请号：US10877092

申请日：2004-06-25

Applicant: INTEGRAL TECHNOLOGIES, INC.

Inventor： Thomas Aisenbrey

IPC: H01Q001/36 ,  H01Q009/28

CPC classification number: B29C45/0013 ,  B29C45/0001 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Low cost antennas formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductor fibers or conductor particles in a resin or plastic host wherein the ratio of the weight of the conductor fibers or conductor particles to the weight of the resin or plastic host is between about 0.20 and 0.40. The conductive fibers can be stainless steel, nickel, copper, silver, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna fabricated by conventional means such as wire, strip-line, printed circuit boards, or the like can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements can be in the form of a thin flexible woven fabric which can readily cut to the desired shape.

Abstract translation: 由导电负载的树脂基材料形成的低成本天线。 导电负载的树脂基材料包括树脂或塑料主体中的导体纤维或导体颗粒，其中导体纤维或导体颗粒的重量与树脂或塑料主体的重量之比在约0.20至0.40之间。 导电纤维可以是不锈钢，镍，铜，银等。 可以使用诸如注射成型或挤出的方法来形成天线元件。 实际上，可以使用导电负载的树脂基材料制造通过常规方法制造的任何天线，例如线，带状线，印刷电路板等。 用于形成天线元件的导电负载树脂基材料可以是可以容易地切割成所需形状的薄柔性机织织物的形式。

公开(公告)号：US20040051666A1

公开(公告)日：2004-03-18

申请号：US10309429

申请日：2002-12-04

Applicant: Integral Technologies, Inc.

Inventor： Thomas Aisenbrey

IPC: H01Q001/32 ,  H01Q009/28

CPC classification number: B29C45/0013 ,  B29C45/0001 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

Abstract: Low cost antennas formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductor fibers or conductor particles in a resin or plastic host wherein the ratio of the weight of the conductor fibers or conductor particles to the weight of the resin or plastic host is between about 0.20 and 0.40. The conductive fibers can be stainless steel, nickel, copper, silver, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna fabricated by conventional means such as wire, strip-line, printed circuit boards, or the like can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements can be in the form of a thin flexible woven fabric which can readily cut to the desired shape.