公开(公告)号：US20030027423A1

公开(公告)日：2003-02-06

申请号：US10261734

申请日：2002-09-30

Applicant: Advantest Corp.

Inventor： Yu Zhou ,  David Yu ,  Robert Edward Aldaz ,  Theodore A. Khoury

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H01R13/2407 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06772 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07378 ,  G01R3/00 ,  H01L21/4885 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01056 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01R12/57 ,  H01R13/2428 ,  H01R2201/20 ,  H05K3/20 ,  H05K3/4015 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors. The contactor has a contact portion which is protruded in a vertical direction to form a contact point, an intermediate portion which is inserted in a through hole provided on the contact substrate, and a base portion having a base end which functions as a contact pad and a spring portion provided between the base end and the intermediate portion for producing a resilient contact force when the contactor is pressed against the contact target.

Abstract translation: 用于与接触目标建立电连接的接触结构。 接触结构由接触基板和多个接触器形成。 接触器具有在垂直方向上突出以形成接触点的接触部分，插入设置在接触基板上的通孔中的中间部分和具有作为接触焊盘的基端的基部， 设置在所述基端和所述中间部之间的弹簧部，用于当所述接触器压靠所述接触目标时产生弹性接触力。

公开(公告)号：US20020179904A1

公开(公告)日：2002-12-05

申请号：US10195673

申请日：2002-07-13

Applicant: Advantest Corp.

Inventor： Yu Zhou ,  David Yu ,  Robert Edward Aldaz ,  Theodore A. Khoury

IPC: H01L021/00 ,  G01R031/26 ,  H01L023/58

CPC classification number: H01R13/2428 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06772 ,  G01R1/07307 ,  G01R3/00 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01R11/18 ,  H01R12/57 ,  H01R13/2407 ,  H05K3/20 ,  H05K3/4015 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A contact structure for establishing electrical connection with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors. The contactor has a tip portion which is protruded in a vertical direction to form a contact point, a base portion which is inserted in a through hole provided on the contact substrate in such a way that an end of the contactor functions as a contact pad for electrical connection at a surface of the contact substrate, and a spring portion provided between the tip portion and the base portion which produces a contact force when the contactor is pressed against the contact target.

Abstract translation: 用于与接触目标建立电连接的接触结构。 接触结构由接触基板和多个接触器形成。 接触器具有在垂直方向上突出以形成接触点的尖端部，插入到设置在接触基板上的通孔中的基部，使得接触器的一端用作接触垫， 在接触基板的表面处的电连接，以及设置在尖端部分和基部之间的弹簧部分，当接触器被压靠在接触靶上时产生接触力。

公开(公告)号：US20020089342A1

公开(公告)日：2002-07-11

申请号：US10058483

申请日：2002-01-28

Applicant: Advantest Corp.

Inventor： Theodore A. Khoury ,  Mark R. Jones ,  James W. Frame

IPC: G01R031/02

CPC classification number: G01R3/00 ,  G01R1/06711 ,  G01R1/07342

Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.

Abstract translation: 通过光刻技术在基板的平面上形成用于测试半导体晶片，封装LSI或印刷电路板的接触结构。 接触结构由具有通过各向异性蚀刻工艺形成的倾斜支撑部分的硅基底，形成在硅基底上并与倾斜支撑件抵接的绝缘层和由形成在绝缘层上的导电材料制成的导电层形成 梁部分由绝缘层和导电层产生，其中梁部分在梁部分的横向方向上呈现弹簧力，以在梁部分的尖端压靠接触目标时建立接触力。