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    Contact structure for electrical communication with contact targets
    1.
    发明申请
    Contact structure for electrical communication with contact targets 失效
    与接触目标电气通信的接触结构

    公开(公告)号：US20020089343A1

    公开(公告)日：2002-07-11

    申请号：US10058951

    申请日：2002-01-28

    Applicant: Advantest Corp.

    Inventor： Theodore A. Khoury ,  Mark R. Jones ,  James W. Frame

    IPC: G01R031/02

    CPC classification number: G01R3/00 ,  G01R1/06711 ,  G01R1/07342

    Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.

    Abstract translation: 通过光刻技术在基板的平面上形成用于测试半导体晶片，封装LSI或印刷电路板的接触结构。 接触结构由具有通过各向异性蚀刻工艺形成的倾斜支撑部分的硅基底，形成在硅基底上并与倾斜支撑件抵接的绝缘层和由形成在绝缘层上的导电材料制成的导电层形成 梁部分由绝缘层和导电层产生，其中梁部分在梁部分的横向方向上呈现弹簧力，以在梁部分的尖端压靠接触目标时建立接触力。

    Packaging and interconnection of contact structure
    2.
    发明申请
    Packaging and interconnection of contact structure 失效
    接触结构的包装和互连

    公开(公告)号：US20020027444A1

    公开(公告)日：2002-03-07

    申请号：US09929533

    申请日：2001-08-13

    Applicant: Advantest Corp.

    Inventor： Mark R. Jones ,  Theodore A. Khoury

    IPC: G01R031/02

    CPC classification number: G01R1/06744 ,  G01R3/00 ,  H01R4/04 ,  H01R13/2414

    Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a micro-fabrication process, a contact pad connected to contact substrate and provided at the bottom surface of the contact substrate, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, a conductive member for connecting the contact pad the PCB pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.

    Abstract translation: 由由导电材料制成的接触结构形成的接触结构和通过微加工工艺在接触基板上形成的接触结构的封装和互连，连接到接触基板并设置在接触基板的底表面处的接触焊盘，印刷 设置在与接触焊盘电连接的印刷电路板（PCB）基板上的电路板（PCB）焊盘，用于将接触焊盘连接到PCB焊盘的导电部件，设置在接触基板下方的弹性体，用于允许互连中的灵活性 和接触结构的包装，以及设置在弹性体和PCB基板之间的支撑结构，用于支撑接触结构，接触基底和弹性体。

    Contact structure and production method thereof
    3.
    发明申请
    Contact structure and production method thereof 有权
    接触结构及其制造方法

    公开(公告)号：US20020076971A1

    公开(公告)日：2002-06-20

    申请号：US10077223

    申请日：2002-02-16

    Applicant: Advantest Corp.

    Inventor： Theodore A. Khoury ,  Robert Edward Aldaz

    IPC: H01R004/24

    CPC classification number: G01R3/00 ,  G01R1/06733 ,  G01R1/07307 ,  H01R12/57 ,  H01R13/2407

    Abstract: A contact structure for establishing electrical contact with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors in which each of the contactors has a hook shape. The contactor has a tip portion which is protruded in a vertical direction to form a contact point, a base portion which is inserted in a through hole provided on the contact substrate in such a way that an end of the contactor functions as a contact pad for electrical connection at a bottom surface of the contact substrate, and a curved portion provided between the tip portion and the base portion which produces a contact force when the contactor is pressed against the contact target. A further aspect is a method for producing a large number of contactors on a wafer in a horizonal direction and removing the contactors from the wafer to be mounted on a substrate to form the contact structure such as a probe card, IC chip, or other contact mechanism in a vertical direction.

    Abstract translation: 用于与接触目标建立电接触的接触结构。 接触结构由接触基板和多个接触器形成，其中每个接触器具有钩形。 接触器具有在垂直方向上突出以形成接触点的尖端部，插入到设置在接触基板上的通孔中的基部，使得接触器的一端用作接触垫， 在接触基板的底表面处的电连接，以及设置在尖端部分和基部之间的弯曲部分，当接触器被压靠在接触靶上时产生接触力。 另一方面是一种用于在水平方向上在晶片上产生大量接触器的方法，并且将待接收器从待安装在基板上的晶片移除以形成接触结构，例如探针卡，IC芯片或其它接触 机构在垂直方向。

    Packaging and interconnection of contact structure
    4.
    发明申请
    Packaging and interconnection of contact structure 失效
    接触结构的包装和互连

    公开(公告)号：US20010023770A1

    公开(公告)日：2001-09-27

    申请号：US09765113

    申请日：2001-01-18

    Applicant: Advantest Corp.

    Inventor： Mark R. Jones ,  Theodore A. Khoury

    IPC: H02G003/08

    CPC classification number: G01R31/2808 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/07811 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a photolithography process, a contact trace formed on the contact substrate and electrically connected to the contact structure at one end, and the other end of the contact trace is provided with a contact pad for establishing packaging and interconnection from an upper surface thereof, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.

    Abstract translation: 由导电材料制成的接触结构形成并通过光刻工艺在接触基板上形成的接触结构的封装和互连，形成在接触基板上并且在一端电连接到接触结构的接触迹线 接触迹线的端部设置有用于从其上表面建立封装和互连的接触焊盘，设置在印刷电路板（PCB）基板上以与接触焊盘电连接的印刷电路板（PCB）焊盘， 设置在接触基板下方的弹性体，用于允许接触结构的互连和封装的灵活性，以及​​设置在弹性体和PCB基板之间的用于支撑接触结构，接触基板和弹性体的支撑结构。

    Packaging and interconnection of contact structure
    6.
    发明申请
    Packaging and interconnection of contact structure 失效

    公开(公告)号：US20020024348A1

    公开(公告)日：2002-02-28

    申请号：US09929532

    申请日：2001-08-13

    Applicant: Advantest Corp.

    Inventor： Mark R. Jones ,  Theodore A. Khoury

    IPC: G01R031/02

    CPC classification number: G01R1/06744 ,  G01R3/00 ,  H01R4/04 ,  H01R13/2414

    Abstract: A packaging and interconnection of a contact structure formed of a contact structure made of conductive material and formed on a contact substrate through a micro-fabrication process, a contact pad connected to contact substrate and provided at the bottom surface of the contact substrate, a printed circuit board (PCB) pad provided on a printed circuit board (PCB) substrate to be electrically connected with the contact pad, a conductive member for connecting the contact pad the PCB pad, an elastomer provided under the contact substrate for allowing flexibility in the interconnection and packaging of the contact structure, and a support structure provided between the elastomer and the PCB substrate for supporting the contact structure, contact substrate and elastomer.

    Method for producing a contact structure
    9.
    发明申请
    Method for producing a contact structure 失效
    接触结构的制造方法

    公开(公告)号：US20020089342A1

    公开(公告)日：2002-07-11

    申请号：US10058483

    申请日：2002-01-28

    Applicant: Advantest Corp.

    Inventor： Theodore A. Khoury ,  Mark R. Jones ,  James W. Frame

    IPC: G01R031/02

    CPC classification number: G01R3/00 ,  G01R1/06711 ,  G01R1/07342

    Abstract: A contact structure for testing a semiconductor wafer, a packaged LSI or a printed circuit board is formed on a planar surface of a substrate by a photolithography technology. The contact structure is formed of a silicon base having an inclined support portion created through an anisotropic etching process, an insulation layer formed on the silicon base and abutted from the inclined support, and a conductive layer made of conductive material formed on the insulation layer so that a beam portion is created by the insulation layer and the conductive layer, where wherein the beam portion exhibits a spring force in a transversal direction of the beam portion to establish a contact force when the tip of the beam portion pressed against a contact target.

    Abstract translation: 通过光刻技术在基板的平面上形成用于测试半导体晶片，封装LSI或印刷电路板的接触结构。 接触结构由具有通过各向异性蚀刻工艺形成的倾斜支撑部分的硅基底，形成在硅基底上并与倾斜支撑件抵接的绝缘层和由形成在绝缘层上的导电材料制成的导电层形成 梁部分由绝缘层和导电层产生，其中梁部分在梁部分的横向方向上呈现弹簧力，以在梁部分的尖端压靠接触目标时建立接触力。

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