公开(公告)号：US20110115762A1

公开(公告)日：2011-05-19

申请号：US13012538

申请日：2011-01-24

Applicant: Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

Inventor： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

IPC: G06F3/038 ,  H02N1/00 ,  G02B26/00 ,  H05K3/06

CPC classification number: G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

Abstract translation: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中，用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线，保护电引线免受损坏或其他干扰。

公开(公告)号：US07911677B2

公开(公告)日：2011-03-22

申请号：US12240931

申请日：2008-09-29

Applicant: Clarence Chui

Inventor： Clarence Chui

IPC: G02B26/00

CPC classification number: G09G3/3466 ,  G02B26/001 ,  G02B26/0841 ,  H04N5/7458 ,  Y10T29/49105

Abstract: A MEMS device is electrically actuated with a voltage placed across a first electrode and a moveable material. The device may be maintained in an actuated state by latch electrodes that are separate from the first electrode.

Abstract translation: MEMS器件通过放置在第一电极和可移动​​材料上的电压而被电致动。 可以通过与第一电极分离的闩锁电极将装置保持在致动状态。

公开(公告)号：USRE42119E1

公开(公告)日：2011-02-08

申请号：US11144210

申请日：2005-06-02

Applicant: Clarence Chui ,  Mark W. Miles

Inventor： Clarence Chui ,  Mark W. Miles

IPC: G02B26/00 ,  G02F1/07

CPC classification number: G02B26/001

Abstract: One aspect of the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating an array of first elements, each first element conforming to a first geometry; fabricating at least one array of second elements, each second element conforming to a second geometry; wherein fabricating the arrays comprises selecting a defining aspect of each of the first and second geometries based on a defining characteristic of each of the first and second elements; and normalizing differences in an actuation voltage required to actuate each of the first and second elements, wherein the differences are as a result of the selected defining aspect, the defining characteristic of each of the elements being unchanged.

Abstract translation: 本发明的一个方面提供一种用于制造微机电系统装置的方法。 该方法包括制造第一元件的阵列，每个第一元件符合第一几何形状; 制造至少一个第二元件阵列，每个第二元件符合第二几何形状; 其中制造所述阵列包括基于所述第一和第二元件中的每一个的限定特征来选择所述第一和第二几何形状中的每一个的限定方面; 以及归一化驱动所述第一和第二元件中的每一个所需的致动电压的差异，其中所述差异作为所选定义方面的结果，每个元件的限定特性不变。

公开(公告)号：US07875485B2

公开(公告)日：2011-01-25

申请号：US12510046

申请日：2009-07-27

Applicant: Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

Inventor： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

IPC: H01L21/00

CPC classification number: G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

Abstract translation: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中，用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线，保护电引线免受损坏或其他干扰。

公开(公告)号：US07863079B2

公开(公告)日：2011-01-04

申请号：US12026131

申请日：2008-02-05

Applicant: Manish Kothari ,  Clarence Chui ,  Sauri Gudlavalleti

Inventor： Manish Kothari ,  Clarence Chui ,  Sauri Gudlavalleti

IPC: H01L21/00

CPC classification number: G02B26/001

Abstract: Methods of fabricating an electromechanical systems device that minimize critical dimension (CD) loss in the device are described. The methods provide electromechanical systems devices with improved properties, including high reflectivity.

Abstract translation: 描述了使装置中的临界尺寸（CD）损耗最小化的机电系统装置的制造方法。 这些方法提供具有改进性能的机电系统装置，包括高反射率。

公开(公告)号：US07859739B2

公开(公告)日：2010-12-28

申请号：US12050094

申请日：2008-03-17

Applicant: Clarence Chui

Inventor： Clarence Chui

IPC: G02B26/00 ,  H03K19/20

CPC classification number: G09G3/3466 ,  G02B26/001 ,  G09G2300/0473 ,  G09G2300/06 ,  G09G2310/0267 ,  G09G2310/0275 ,  G09G2330/021 ,  Y10T29/49002 ,  Y10T29/49105

Abstract: An interferometric modulator array is integrated with collapsible cavity MEMS electrical switches. The electrical switches may have similar physical geometry as the display elements. The switches may form row or column select functions for the display.

Abstract translation: 干涉式调制器阵列与可折叠空腔MEMS电气开关集成。 电气开关可以具有与显示元件相似的物理几何形状。 开关可以形成用于显示的行或列选择功能。

公开(公告)号：US20100320555A1

公开(公告)日：2010-12-23

申请号：US12861778

申请日：2010-08-23

Applicant: Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

Inventor： Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

IPC: H01L31/0224 ,  H01L31/18

CPC classification number: B81B3/0086 ,  B81C2201/0109 ,  B81C2201/014 ,  B81C2201/053 ,  G02B26/001

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

Abstract translation: 在一个实施例中，本发明提供一种用于制造微机电系统装置的方法。 该方法包括制造包括具有特征机电响应的膜的第一层和特征光学响应，其中特征光学响应是期望的，并且特征机电响应是不期望的; 以及通过在所述微机电系统装置的启动期间至少减少其上的电荷积累来修改所述第一层的特征机电响应。

公开(公告)号：US07826127B2

公开(公告)日：2010-11-02

申请号：US11765981

申请日：2007-06-20

Applicant: Nassim Khonsari ,  Clarence Chui

Inventor： Nassim Khonsari ,  Clarence Chui

IPC: G02B26/00 ,  G02F1/03 ,  H01L23/20

CPC classification number: B81C1/00269 ,  B81B2201/047 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/032

Abstract: A microelectromechanical systems device having a transparent substrate joined to a planar backplate with a raised perimeter structure forming a recessed cavity or cell. The raised perimeter structure is formed by applying a first layer around the peripheral area of the backplate to form a recessed cell. A second layer is applied over the first layer. The first layer is thicker than the second layer. The thicker layer comprises a viscous material. A second layer is a thinner adhesive layer, and is applied over the thicker layer to join the backplate to the transparent substrate to encapsulate the microelectromechanical systems device formed on the transparent substrate.

Abstract translation: 一种具有连接到平面背板的透明基板的微机电系统装置，其具有形成凹腔或电池的凸起周边结构。 凸起的周边结构通过在背板的周边区域附近施加第一层而形成凹形单元。 在第一层上施加第二层。 第一层比第二层厚。 较厚的层包括粘性材料。 第二层是更薄的粘合剂层，并且被涂覆在较厚层上以将背板连接到透明基板以封装形成在透明基板上的微机电系统装置。

公开(公告)号：US07816710B2

公开(公告)日：2010-10-19

申请号：US12019590

申请日：2008-01-24

Applicant: Lauren Palmateer ,  Brian J. Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

Inventor： Lauren Palmateer ,  Brian J. Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

IPC: H01L29/80

CPC classification number: G02B26/001

Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

Abstract translation: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 背板包括相对于基板的弯曲部分。 弯曲部分基本上遍及后板。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

公开(公告)号：US20100245313A1

公开(公告)日：2010-09-30

申请号：US12413336

申请日：2009-03-27

Applicant: Alan G. Lewis ,  Marc M. Mignard ,  Clarence Chui ,  Wilhelmus Johannes Robertus Van Lier ,  Mark M. Todorovich ,  William Cummings

Inventor： Alan G. Lewis ,  Marc M. Mignard ,  Clarence Chui ,  Wilhelmus Johannes Robertus Van Lier ,  Mark M. Todorovich ,  William Cummings

IPC: G09G5/00 ,  H01L41/09

CPC classification number: G09G3/3466 ,  G09G2300/06 ,  G09G2310/0251 ,  G09G2310/0254 ,  H01L41/042

Abstract: A method of driving electromechanical devices such as interferometric modulators includes applying a voltage along a common line to release the electromechanical devices along the common line, followed by applying an address voltage along the common line to actuate selected electromechanical devices along the common line based on voltages applied along segment lines. Hold voltages may be applied along common lines between applications of release and address voltages, and the segment voltages may be selected to be sufficiently small that the segment voltages will not affect the state of the electromechanical devices along other common lines not being written to.

Abstract translation: 驱动诸如干涉式调制器的机电装置的方法包括沿公共线施加电压以沿着公共线释放机电装置，随后沿着公共线施加寻址电压以基于电压来驱动沿着公共线的选定的机电装置 沿线段应用。 可以在释放和寻址电压的应用之间沿着公共线施加保持电压，并且可以选择段电压足够小，使得分段电压不会影响沿着不被写入的其它公共线路的机电装置的状态。