公开(公告)号：US08614502B2

公开(公告)日：2013-12-24

申请号：US13456293

申请日：2012-04-26

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/12

CPC classification number: H01L23/3121 ,  H01L21/56 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A semiconductor assembly board includes a supporting board, a coreless build-up circuitry and a built-in electronic device. The supporting board includes a bump, a flange and a via hole in the bump. The built-in electronic device extends into the via hole and is electrically connected to the build-up circuitry. The build-up circuitry extends from the flange and the built-in electronic device and provides signal routing for the built-in electronic device. The supporting board provides mechanical support, ground/power plane and heat sink for the coreless build-up circuitry.

Abstract translation: 半导体组装板包括支撑板，无芯堆积电路和内置电子设备。 支撑板包括凸块，凸缘和凸块中的通孔。 内置的电子设备延伸到通孔中并电连接到积聚电路。 积聚电路从凸缘和内置电子设备延伸，并为内置电子设备提供信号路由。 支持板为无芯层积木电路提供机械支撑，接地/电源平面和散热器。

公开(公告)号：US20130032938A1

公开(公告)日：2013-02-07

申请号：US13456293

申请日：2012-04-26

Applicant: Charles W.C. LIN ,  Chia-Chung Wang

Inventor： Charles W.C. LIN ,  Chia-Chung Wang

IPC: H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/56 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A semiconductor assembly board includes a supporting board, a coreless build-up circuitry and a built-in electronic device. The supporting board includes a bump, a flange and a via hole in the bump. The built-in electronic device extends into the via hole and is electrically connected to the build-up circuitry. The build-up circuitry extends from the flange and the built-in electronic device and provides signal routing for the built-in electronic device. The supporting board provides mechanical support, ground/power plane and heat sink for the coreless build-up circuitry.

Abstract translation: 半导体组装板包括支撑板，无芯堆积电路和内置电子设备。 支撑板包括凸块，凸缘和凸块中的通孔。 内置的电子设备延伸到通孔中并电连接到积聚电路。 积聚电路从凸缘和内置电子设备延伸，并为内置电子设备提供信号路由。 支撑板为无芯堆积电路提供机械支撑，接地/电源平面和散热器。

公开(公告)号：US20120129300A1

公开(公告)日：2012-05-24

申请号：US13299495

申请日：2011-11-18

Applicant: Charles W.C. LIN ,  Chia-Chung Wang

Inventor： Charles W.C. LIN ,  Chia-Chung Wang

IPC: H01L21/58

CPC classification number: H01L24/82 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/221 ,  H01L2224/24101 ,  H01L2224/24221 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/82106 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making a stackable semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device.

Abstract translation: 公开了一种制造包括半导体器件，散热器，粘合剂，端子，电镀通孔和积聚电路的可堆叠半导体组件的方法。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路为半导体器件提供信号路由。 电镀通孔在积聚电路和终端之间提供信号路由。 散热器为半导体器件提供散热。

公开(公告)号：US20120129299A1

公开(公告)日：2012-05-24

申请号：US13299472

申请日：2011-11-18

Applicant: Charles W.C. LIN ,  Chia-Chung WANG

Inventor： Charles W.C. LIN ,  Chia-Chung WANG

IPC: H01L21/60

CPC classification number: H01L24/19 ,  H01L21/4878 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15321 ,  H01L2924/15323 ,  H01L2924/181 ,  H01L2924/00

Abstract: A method of making a semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive and a build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry includes a dielectric layer and conductive traces on the semiconductor device and the flange. The conductive traces provide signal routing for the semiconductor device.

Abstract translation: 公开了制造包括半导体器件，散热器，粘合剂和积聚电路的半导体组件的方法。 散热器包括凸块，底座和凸缘。 凸块限定一个空腔。 半导体器件安装在空腔处的凸块上，电连接到积聚电路并热连接到凸块。 凸起从基部延伸到粘合剂中的开口中，基部从与腔相对的凸起垂直延伸，并且凸缘从腔入口处的凸起横向延伸。 积聚电路包括介电层和半导体器件上的导电迹线和凸缘。 导电迹线为半导体器件提供信号路由。

公开(公告)号：US20110275180A1

公开(公告)日：2011-11-10

申请号：US13113051

申请日：2011-05-22

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Ming Yu Shih

IPC: H01L21/60

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the underlayer and a thermal via that extends from the base through the support layer to the underlayer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供柱，基底，支撑层和底层，其中柱延伸到基底之上，并且支撑层夹在基底和底层之间，将粘合剂安装在基底上，包括 将所述柱插入所述粘合剂的开口中，将导电层安装在所述粘合剂上，包括使所述柱与所述导电层中的孔对准，然后使所述粘合剂在所述柱和所述导电层之间向上流动，使所述粘合剂固化， 轨迹，其包括衬垫，端子和导电层的选定部分，提供包括柱，基底，底层的散热器和从基底穿过支撑层延伸到底层的热通孔，然后安装 在该柱上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到第二半导体器件 e散热器。

公开(公告)号：US20110183472A1

公开(公告)日：2011-07-28

申请号：US13079044

申请日：2011-04-04

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L21/58

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a plated through-hole and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上，包括使导柱与导电 然后使粘合剂在柱和导电层之间向上流动，固化粘合剂，然后提供包括衬垫，端子，电镀通孔和导电层的选定部分的导电迹线，安装半导体器件 在支柱上，其中散热器包括柱和基座，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20110101410A1

公开(公告)日：2011-05-05

申请号：US12987166

申请日：2011-01-10

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/64

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32013 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85205 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/063 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线以及第一和第二粘合剂。 散热器包括第一柱，第二柱和基部。 导电迹线包括焊盘和端子。 半导体器件电连接到导电迹线并热连接到散热器。 第一柱从第一垂直方向的基部延伸到第一粘合剂中的第一开口中，第二柱从第二垂直方向的基部延伸到第二粘合剂中的第二开口中，并且基部夹在两侧之间并且横向延伸 从帖子。 导电迹线提供焊盘和端子之间的信号路由。

公开(公告)号：US20110049558A1

公开(公告)日：2011-03-03

申请号：US12833947

申请日：2010-07-10

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L33/64

CPC classification number: H01L33/486 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5389 ,  H01L33/642 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a thermal post and a base. The conductive trace includes a pad, a terminal and a signal post. The semiconductor device extends into a cavity in the thermal post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The thermal post extends upwardly from the base into a first opening in the adhesive, and the signal post extends upwardly from the terminal into a second opening in the adhesive. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线和粘合剂。 散热器包括热柱和基座。 导电迹线包括垫，端子和信号柱。 半导体器件延伸到热柱中的空腔中，电连接到导电迹线并且热连接到散热器。 热柱从基部向上延伸到粘合剂中的第一开口中，并且信号柱从端子向上延伸到粘合剂中的第二开口中。 导电迹线位于腔体外部，并在焊盘和端子之间提供信号路由。

公开(公告)号：US20100190300A1

公开(公告)日：2010-07-29

申请号：US12714497

申请日：2010-02-28

Applicant: Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W.C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L21/60

CPC classification number: H01L21/486 ,  H01L21/4882 ,  H01L23/3677 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post and the base to form a cavity that extends through the adhesive into the base, then mounting a semiconductor device on the base, wherein a heat spreader includes the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将粘合剂安装在基座上，包括将柱插入粘合剂中的开口中，将基底安装在粘合剂上，包括使柱与基底中的孔对准， 然后将粘合剂在位于柱和基底之间的孔隙中的间隙中向上流动，固化粘合剂，然后蚀刻柱和基底以形成延伸穿过粘合剂进入基底的空腔，然后安装半导体器件 在基座上，其中散热器包括基座，并且半导体器件延伸到空腔中，将半导体器件电连接到衬底并将半导体器件热连接到散热器。

公开(公告)号：US20100087020A1

公开(公告)日：2010-04-08

申请号：US12626941

申请日：2009-11-30

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/00 ,  H01L21/50

CPC classification number: H05K1/0204 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base that include a copper surface layer and an aluminum core, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供包括铜表面层和铝芯的柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上 包括使该柱与导电层中的孔对准，然后将粘合剂流入并位于位于柱和导电层之间的孔中的间隙中，固化粘合剂，然后提供导电迹线，其包括垫，端子 以及导电层的选定部分，将半导体器件安装在包括柱和基座的散热器上，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。