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公开(公告)号：US10528094B2
公开(公告)日：2020-01-07
申请号：US15773146
申请日：2015-11-16
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in each of housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface, and a plurality of slots disposed above the one or more substrate groups, and arranged onto the metal board in parallel, each of which allows a power unit to be housed. The third circuit board is disposed so that the slots are interposed between the third circuit board and the metal board, and the network cable sockets are arranged in parallel on one side of the third circuit board, located at an opening side of the slots.
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公开(公告)号：US10481650B2
公开(公告)日：2019-11-19
申请号：US15773151
申请日：2015-11-16
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: A cooling system is configured to directly cool electronic devices of different types immersed in a coolant filled in a cooling apparatus having a cooling tank with an open space defined by a bottom wall and side walls, arranged housing parts formed by dividing the open space using internal partition walls in the cooling tank, an inflow opening formed in a bottom part or a side surface of each of the housing parts, and an outflow opening formed around a surface of the coolant circulating in the respective housing parts. Electronic devices of different types include first electronic devices configured to execute arithmetic operations through processors, and second electronic devices configured to execute storage through storage units. The arbitrary numbers of the first and second electronic devices are separately housed in the housing parts of the cooling apparatus to form a computer with a calculation capacity and a storage capacity.
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公开(公告)号：US20180356866A1
公开(公告)日：2018-12-13
申请号：US15773128
申请日：2015-11-11
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: G06F1/206 , G05B15/02 , G06F1/20 , H05K7/20 , H05K7/20236 , H05K7/20272 , H05K7/20763
Abstract: A cooling system 300 configured to directly cool an electronic device immersed in a coolant includes a cooling tank 11 containing the coolant C, and a leakage receiving portion 41 disposed between the cooling tank 11 and a floor surface so as to receive the coolant C leaked from the cooling tank 11. The leakage receiving portion 41 includes a distribution plate 40 for distributing a load applied from the cooling tank 11, a closed side wall disposed on the distribution plate to enclose the cooling tank 11, and a lid member 42 for covering an upper opening between the closed side wall and the cooling tank 11. The system facilitates collection of the accidentally leaked coolant, and ensures to keep the low height of the device for temporarily accumulating the leaked coolant L until it is collected.
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公开(公告)号：US20180246550A1
公开(公告)日：2018-08-30
申请号：US15756538
申请日：2015-08-31
Applicant: ExaScaler Inc.
Inventor： Kenichi INABA , Motoaki SAITO
CPC classification number: G06F1/206 , G06F1/20 , G06F2200/201 , H01L23/473 , H05K7/20 , H05K7/20236 , H05K7/20254 , H05K7/20263 , H05K7/20272 , H05K7/203 , H05K7/20327 , H05K7/20381 , H05K7/20763 , H05K7/20781 , H05K7/208 , H05K7/20818
Abstract: A cooling system has a cooling bath. The open space of the cooling bath contains a second coolant having a boiling point, and having an electronic device that has a processor that is a heat generating component mounted on a board, and is immersed in the second coolant. A boiling cooling device is thermally connected to the processor, and encloses a first coolant having a boiling point. A first heat exchanger has a high-temperature side passage formed of a group of narrow gaps or a group of micro passages, through which the second coolant is passed, and a low-temperature side passage formed of a group of narrow gaps or a group of micro passages, through which a third cooling medium having a boiling point is passed. A pump is configured to pressurize and deliver the second coolant warmed in the cooling bath toward the inlet of the high-temperature side passage.
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公开(公告)号：US20180092243A1
公开(公告)日：2018-03-29
申请号：US15563428
申请日：2015-03-30
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20236 , G06F1/20 , G06F1/206 , H01L23/473 , H05K7/20 , H05K7/20263
Abstract: Provided is a cooling system capable of improving the cooling performance of an electronic device and being simple and efficient. The cooling system has a cooling tank, and the cooling tank contains in its open space a second cooling liquid having a boiling point T2. An electronic device mounting a processor as a heating element on a board is stored within the open space of the cooling tank and is immersed in the second cooling liquid. A boiling cooling device is a cooling device thermally connected to the processor and encloses a first cooling liquid having a boiling point T1 (provided T1=T2 or T1 T3).
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Patent Agency Ranking
公开(公告)号：US20170273223A1
公开(公告)日：2017-09-21
申请号：US15506707
申请日：2015-08-04
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
CPC classification number: H05K7/20772 , C09K5/10 , G06F1/20 , G06F2200/201 , H01L23/44 , H01L23/473 , H01L2924/0002 , H05K7/20236 , H05K7/20272 , H05K7/20836 , H01L2924/00
Abstract: A cooling system is adapted for reduction of evaporative loss of a liquid coolant and for efficient cooling of plural electronic devices densely accommodated in a cooling bath of a small volume. A cooling system accommodates plural electronic devices in an open space of a cooling bath provided with an inlet port and an outlet port for a liquid coolant. The cooling system is configured to directly cool the electronic devices by immersion of the electronic devices in the liquid coolant circulated in the open space. The liquid coolant contains a perfluorinated compound as a main component. The liquid coolant is adapted to exhibit a liquid weight loss percentage of 1.5% or less as determined by allowing 10 ml of the liquid coolant in a 10-ml measuring cylinder (opening diameter: 11.5 mm) to spontaneously evaporate under normal environment at a room temperature of 25° C. for 100 hours.
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公开(公告)号：US11058029B2
公开(公告)日：2021-07-06
申请号：US16612705
申请日：2017-05-11
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.
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公开(公告)号：US20210103320A1
公开(公告)日：2021-04-08
申请号：US16097168
申请日：2016-04-28
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO , Sunao TORII
Abstract: Provided is a cooling system capable of effectively avoiding generation of bubbles in the flow passage including the piping unit that climbs over the barrier upon start of the pump that has been in the stopped state. The cooling system 100 includes a cooling tank 11 filled with a coolant C, flow passages 15, 16 through which the coolant discharged from an outlet of the cooling tank 11 returns to an inlet of the cooling tank 11, an inverted U-like piping unit 16a disposed in the middle of the flow passage 16, a main pump 31, an auxiliary pump 33 disposed opposite the main pump 31 while interposing the inverted U-like piping unit 16a with the main pump 31, and a controller 35 which controls driving operations of the main pump 31 and the auxiliary pump 33. The controller 35 drives the auxiliary pump 33 for a predetermined time period before starting the main pump 31. The predetermined time period for driving the auxiliary pump 33 may be arbitrarily set so long as the preliminary flow of the coolant C is generated. As the auxiliary pump 33 may be driven for only a short time period, silence in the room is hardly deteriorated even in the case that the pump is disposed inside the building.
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公开(公告)号：US10606326B2
公开(公告)日：2020-03-31
申请号：US16302596
申请日：2016-05-16
Applicant: ExaScaler Inc.
Inventor： Motoaki Saito
Abstract: An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in a housing part of the cooling apparatus, and includes a pair of substrate groups that includes a first circuit board having at least one processor and main memories mounted onto one surface of the board, coprocessors, each having a housing with a rectangular cross-section, and an electric connection terminal, and a connector for electric connection between the first circuit board and the coprocessors. When each of the electric connection terminals of the coprocessors is inserted into the connector, a distance between the one surface of the first circuit board and a housing bottom surface of each of the coprocessors is longer than a height of the processor and each height of the main memories. The pair of substrate groups is combined while having the first circuit boards arranged at a rear surface side in a direction for reducing a distance between the one surface of the first circuit board of one of the substrate groups and a housing upper surface of each of the coprocessors of the other of the substrate groups.
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公开(公告)号：US20190294220A1
公开(公告)日：2019-09-26
申请号：US16302588
申请日：2016-05-16
Applicant: ExaScaler Inc.
Inventor： Motoaki SAITO
IPC: G06F1/20 , G06F1/18 , H05K7/02 , H05K7/20 , H01L23/473
Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device includes a first circuit board having one surface on which processors and main memories are mounted. The processors are arranged on the one surface of the first circuit board in a substrate length direction of the main memory. A length of each of the processors in the substrate length direction of the main memory may be equal to or less than ½ of the substrate length of the main memory. The processor may be a semiconductor device of system on-chip type design, and a main memory may be an ultra-low memory module. It is possible to mount four or more processors and four or more main memories on the first circuit board of the electronic device. The four or more main memories are arranged to divide the one surface of the first circuit board into at least two or more regions in a width direction. At least the two or more processors are arranged in the substrate length direction of the main memory in each of the two or more regions.
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