公开(公告)号：US10403650B2

公开(公告)日：2019-09-03

申请号：US15973854

申请日：2018-05-08

Applicant: GIO Optoelectronics Corp.

Inventor： Wu-Chang Yang

IPC: H01L27/12 ,  H01L51/00 ,  H01L27/30 ,  H01L27/32 ,  H01L23/00 ,  H01L25/16 ,  H01L21/3213 ,  H01L33/62

Abstract: An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of an electronic device includes following steps: forming a flexible substrate on a rigid carrier plate; forming at least a thin-film device on the flexible substrate; forming a conductive line on the flexible substrate, wherein the conductive line is electrically connected with the thin-film device; forming at least an electrical connection pad on the flexible substrate, wherein the electrical connection pad is electrically connected with the conductive line, and the thickness of the electrical connection pad is between 2 and 20 microns; disposing at least a surface-mount device (SMD) on the flexible substrate, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line; and removing the rigid carrier plate.

公开(公告)号：US08749140B2

公开(公告)日：2014-06-10

申请号：US13708910

申请日：2012-12-07

Applicant: GIO Optoelectronics Corp.

Inventor： Wu-Chang Yang

IPC: H01J7/44

CPC classification number: F21V25/00 ,  F21K9/27 ,  F21V25/04 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05B33/0809 ,  H05B33/0812 ,  H05B33/0815 ,  H05B33/0884 ,  Y02B20/343 ,  Y02B20/346 ,  Y02B20/383

Abstract: A light emitting apparatus receives an external power. A switching unit is electrically connected with a light emitting unit to form a serial circuit. A first electrical connection element is electrically connected with the external power and the light emitting unit. A second electrical connection element is electrically connected with the external power and the switching unit. A sensing unit is electrically connected with the first electrical connection element, the second electrical connection element and the switching unit. When filament currents flow between two electrical input terminals of the first electrical connection element and between two electrical input terminals of the second electrical connection element, the sensing unit controls the switching unit to turn on to enable the light emitting unit to receive the external power and start to emit light. Thus, users can avoid the risk of electric shock when installing the light emitting apparatus.

Abstract translation: 发光装置接收外部电力。 开关单元与发光单元电连接以形成串行电路。 第一电连接元件与外部电源和发光单元电连接。 第二电连接元件与外部电源和开关单元电连接。 感测单元与第一电连接元件，第二电连接元件和开关单元电连接。 当灯丝电流在第一电连接元件的两个电输入端之间和第二电连接元件的两个电输入端之间流动时，感测单元控制开关单元导通以使得发光单元能够接收外部电力， 开始发光。 因此，用户在安装发光装置时可以避免触电的风险。

公开(公告)号：US20140111559A1

公开(公告)日：2014-04-24

申请号：US14058149

申请日：2013-10-18

Applicant: VTRON Technologies LTD. ,  GIO Optoelectronics Corp.

Inventor： Wu-Chang YANG ,  Chin-Cheng TSAI ,  Chia-Ho YANG

IPC: G09G5/10

CPC classification number: G09G5/10 ,  G09G3/2011 ,  G09G3/2014 ,  G09G3/2088 ,  G09G3/32 ,  G09G2300/0408 ,  G09G2300/0804 ,  G09G2310/0262 ,  G09G2360/14 ,  G09G2360/141

Abstract: A display apparatus comprises a substrate, a plurality of scan lines, a plurality of data lines crossing the scan lines on the substrate, a plurality of light emitting units disposed in a display area of the substrate and at least a control integrated circuit (IC) chip. The control IC chip is disposed within the display area of the substrate and electrically connected to at least one of the scan lines and at least one of the data lines. The light emitting units are electrically connected to at least one of the control IC chip, which is controlled by at least one of the scan lines and receives a data signal from at least one of the data lines to control the luminous states of the light emitting units according to the data signal.

Abstract translation: 显示装置包括基板，多条扫描线，与基板上的扫描线交叉的多条数据线，设置在基板的显示区域中的至少一个控制集成电路（IC）的多个发光单元， 芯片。 控制IC芯片设置在基板的显示区域内，并与至少一条扫描线和至少一条数据线电连接。 发光单元电连接至由至少一个扫描线控制的控制IC芯片中的至少一个，并从至少一个数据线接收数据信号，以控制发光的发光状态 单位根据数据信号。

公开(公告)号：US20140035469A1

公开(公告)日：2014-02-06

申请号：US13951456

申请日：2013-07-25

Applicant: GIO Optoelectronics Corp.

Inventor： WU-CHANG YANG

IPC: H05B33/08

CPC classification number: H05B33/0809 ,  H05B33/083

Abstract: A light emitting device is electrically connected to a three-phase AC power source and comprises three light emitting modules. The light emitting modules respectively receives three phase power sources of the three-phase AC power source. Each of the light emitting modules includes a light emitting unit and a control circuit electrically connected to the light emitting unit. Each of the control circuits controls the light output power of the corresponding light emitting unit according to the voltage variation or phase variation of the received phase power source, and the three light emitting modules are collectively kept a stable gross light output power.

Abstract translation: 发光器件电连接到三相交流电源并且包括三个发光模块。 发光模块分别接收三相交流电源的三相电源。 每个发光模块包括电连接到发光单元的发光单元和控制电路。 每个控制电路根据接收相电源的电压变化或相位变化来控制相应发光单元的光输出功率，并且三个发光模块集中地保持稳定的总光输出功率。

公开(公告)号：US20130147350A1

公开(公告)日：2013-06-13

申请号：US13708910

申请日：2012-12-07

Applicant: GIO OPTOELECTRONICS CORP.

Inventor： WU-CHANG YANG

IPC: F21V25/00

CPC classification number: F21V25/00 ,  F21K9/27 ,  F21V25/04 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05B33/0809 ,  H05B33/0812 ,  H05B33/0815 ,  H05B33/0884 ,  Y02B20/343 ,  Y02B20/346 ,  Y02B20/383

Abstract: A light emitting apparatus receives an external power. A switching unit is electrically connected with a light emitting unit to form a serial circuit. A first electrical connection element is electrically connected with the external power and the light emitting unit. A second electrical connection element is electrically connected with the external power and the switching unit. A sensing unit is electrically connected with the first electrical connection element, the second electrical connection element and the switching unit. When filament currents flow between two electrical input terminals of the first electrical connection element and between two electrical input terminals of the second electrical connection element, the sensing unit controls the switching unit to turn on to enable the light emitting unit to receive the external power and start to emit light. Thus, users can avoid the risk of electric shock when installing the light emitting apparatus.

Abstract translation: 发光装置接收外部电力。 开关单元与发光单元电连接以形成串行电路。 第一电连接元件与外部电源和发光单元电连接。 第二电连接元件与外部电源和开关单元电连接。 感测单元与第一电连接元件，第二电连接元件和开关单元电连接。 当灯丝电流在第一电连接元件的两个电输入端之间和第二电连接元件的两个电输入端之间流动时，感测单元控制开关单元导通以使发光单元能够接收外部电力， 开始发光。 因此，用户在安装发光装置时可以避免触电的风险。

公开(公告)号：US20220149081A1

公开(公告)日：2022-05-12

申请号：US17522156

申请日：2021-11-09

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang Li

IPC: H01L27/12 ,  G09G3/20 ,  H01L23/528 ,  H05K1/11

Abstract: An electronic device includes a sustaining layer, multiple substrates, multiple photoelectric units, multiple signal layers, multiple driving structures, and a constraining structure. The substrates are arranged on a contact surface of the sustaining layer. A first end edge of at least one substrate approaches a first end edge of the sustaining layer, and a first side edge of one substrate is adjacent to a second side edge of another substrate. The photoelectric units are arranged on the first or/and second surfaces of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units. The driving structures are electrically connected to the substrates and disposed close to the first or second end edge of the sustaining layer. The constraining structure constrains the first or second end edge of the sustaining layer, and at least one driving structure is accommodated in the constraining structure.

公开(公告)号：US11158612B2

公开(公告)日：2021-10-26

申请号：US16830859

申请日：2020-03-26

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang Li

IPC: H01L25/075 ,  H01L27/12 ,  H01L33/62

Abstract: An electronic device comprises at least one sub matrix unit, a driving circuit board, and at least one surface mount device. The sub matrix unit comprises a substrate, thin-film circuits and first connecting pads. The thin-film circuits and the first connecting pads are disposed on the operation face of the substrate. The sub matrix unit defines a loading face and comprises second connecting pads, at least one first conductive line, and at least one second conductive line all together arranged on the loading face. A second height defined between a top of the surface mount device and the loading face of the driving circuit board is no less than a first height defined between an uppermost face of the sub matrix unit and the loading face of the driving circuit board.

公开(公告)号：US20210175381A1

公开(公告)日：2021-06-10

申请号：US17067368

申请日：2020-10-09

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang LI

IPC: H01L31/0392 ,  H01L31/0224

Abstract: An electronic device comprises plural first substrates, plural photoelectric structures, a third substrate, plural driving units, plural conductive layers and plural first conductive structures. The first substrates are arranged in coplanar in a first direction. The photoelectric structures are arranged in coplanar in the first direction and disposed on the first substrate. Each photoelectric structure has a second substrate, a signal layer and a photoelectric component. The photoelectric component is electrically connected to the signal line of the signal layer. One of the photoelectric structures straddles two adjacent first substrates. The third substrate is connected to the first substrate or the photoelectric structure. The driving units are distributed on the first substrate or the photoelectric structure, and the driving units correspondingly drive the photoelectric components of the photoelectric structures. The optoelectronic structures are electrically connected to the conductive layers via the first conductive structures, respectively.

公开(公告)号：US10797034B2

公开(公告)日：2020-10-06

申请号：US16220610

申请日：2018-12-14

Applicant: GIO Optoelectronics Corp

Inventor： Chin-Tang Li

IPC: H01L25/18 ,  H01L23/31 ,  H01L25/00 ,  H01L27/12 ,  H01L33/52 ,  H01L33/62 ,  H01L21/48 ,  H01L33/00 ,  H01L25/16 ,  H01L23/00

Abstract: An electronic package unit, a manufacturing method thereof and an electronic device are disclosed. The manufacturing method includes: providing an insulation substrate, wherein the insulation substrate has a first surface and a second surface opposite to the first surface; forming a plurality of sub-matrix circuits on the insulation substrate, wherein each sub-matrix circuit comprises at least one thin film transistor; disposing at least one functional chip on the first surface, wherein the functional chip is electrically connected with the sub-matrix circuit; forming a plurality of through-holes on the insulation substrate and disposing a conductive material in the through-holes, so that the functional chip is electrically connected to the second surface through the sub-matrix circuits and the conductive material; forming a protection layer on the first surface to cover the functional chips; and cutting the insulation substrate and the protection layer to form a plurality of electronic package units.

公开(公告)号：US20200006404A1

公开(公告)日：2020-01-02

申请号：US16449929

申请日：2019-06-24

Applicant: GIO Optoelectronics Corp.

Inventor： Chin-Tang LI

IPC: H01L27/12

Abstract: An electronic device and manufacturing method of the electronic device are disclosed. The manufacturing method includes: providing a substrate; forming a thin film circuit on the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive trace; forming at least one first connection pad on the substrate, wherein the first connection pad is electrically connected with the thin film transistor through the conductive trace; disposing the substrate on a driving circuit board, wherein the driving circuit board comprises at least one second connection pad adjacent to and corresponding to the first connection pad; and forming a conductive member covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member.