公开(公告)号：US20060275705A1

公开(公告)日：2006-12-07

申请号：US11142699

申请日：2005-06-01

Applicant: William Dorogy ,  Sterling Chaffins ,  Michael Day ,  John deVos ,  Makarand Gore ,  Andrew Van Brocklin ,  Douglas Houck

Inventor： William Dorogy ,  Sterling Chaffins ,  Michael Day ,  John deVos ,  Makarand Gore ,  Andrew Van Brocklin ,  Douglas Houck

IPC: G03F7/26

CPC classification number: H01B1/16 ,  H05K3/105 ,  H05K2201/0112 ,  H05K2203/107 ,  H05K2203/121 ,  Y10S430/146 ,  Y10S430/165

Abstract: Various embodiments of a method, coating and system for conductive patterning are disclosed.

公开(公告)号：US20050093768A1

公开(公告)日：2005-05-05

申请号：US10698750

申请日：2003-10-31

Applicant: John Devos ,  P. Howard ,  Richard Aufranc

Inventor： John Devos ,  P. Howard ,  Richard Aufranc

IPC: G09G5/00

CPC classification number: G06F3/1446

Abstract: A display of an embodiment of the invention includes a number of display modules that are interlockable to form the display. Each display module includes at least one user-viewable display element, at least one connector, and at least one receptor, which are disposed in the display module. Each of a number of pixels of the display corresponds to at least one of the display elements of each display module. The connectors of each display module at least receive power from and/or provide power to adjacent display modules. The receptors of each display module are receptive to connectors of other adjacent display modules.

Abstract translation: 本发明的实施例的显示器包括可互锁以形成显示器的多个显示模块。 每个显示模块包括设置在显示模块中的至少一个用户可观看显示元件，至少一个连接器和至少一个接收器。 显示器的多个像素中的每一个对应于每个显示模块的至少一个显示元件。 每个显示模块的连接器至少从相邻显示模块接收电力和/或向相邻显示模块提供电力。 每个显示模块的受体都接受其他相邻显示模块的连接器。

公开(公告)号：US20070026102A1

公开(公告)日：2007-02-01

申请号：US11191797

申请日：2005-07-28

Applicant: John Devos ,  Terry Lambright ,  Isaac Farr ,  Jeffrey Nielsen ,  Tony Cruz-Uribe ,  David Collins

Inventor： John Devos ,  Terry Lambright ,  Isaac Farr ,  Jeffrey Nielsen ,  Tony Cruz-Uribe ,  David Collins

IPC: B28B21/42

CPC classification number: B28B1/00 ,  B28B1/001 ,  B28B7/465 ,  B29C64/00

Abstract: Solid freeform fabrication systems, powder supply bins for solid freeform fabrication systems, and methods of solid freeform fabrication are disclosed. One exemplary solid freeform fabrication system includes a removable powder supply bin, a build bin, a roller, and a print head disposed above the build bin that deposits a binder onto the powder in the build bin in a preselected pattern.

Abstract translation: 公开了固体自由形成制造系统，用于固体自由形成制造系统的粉末供应箱和固体自由形成制造的方法。 一个示例性的固体自由形成制造系统包括可移除的粉末供应箱，构建仓，辊和设置在堆放仓上方的打印头，其以预选图案将粘合剂沉积在建筑垃圾箱中的粉末上。

公开(公告)号：US20070024821A1

公开(公告)日：2007-02-01

申请号：US11193046

申请日：2005-07-28

Applicant: John Devos ,  Gregory May ,  Rachel Smythe

Inventor： John Devos ,  Gregory May ,  Rachel Smythe

IPC: G03B21/00

CPC classification number: G03B21/10 ,  G02B17/08 ,  G02B17/0816 ,  G03B21/28 ,  G03B29/00 ,  H04N9/3141

Abstract: A projection system includes a cabinet having a surface with an aperture therein, a projector disposed within the cabinet, adapted to project light through the aperture in the surface of the cabinet, and a lens disposed in the aperture to project the light onto a screen disposed generally non-parallel to the cabinet surface having the aperture.

Abstract translation: 投影系统包括具有其中具有孔的表面的机柜，设置在机柜内的投影仪，适于将光投射穿过机壳表面中的孔，以及设置在孔中的透镜，以将光投射到设置的屏幕上 通常不平行于具有孔的机壳表面。

公开(公告)号：US20060214907A1

公开(公告)日：2006-09-28

申请号：US11088317

申请日：2005-03-23

Applicant: John Devos ,  Michael Blythe ,  Kenneth Anthony ,  Quinn Jemmott

Inventor： John Devos ,  Michael Blythe ,  Kenneth Anthony ,  Quinn Jemmott

IPC: G09G3/34

CPC classification number: G02B26/0833

Abstract: Embodiments of a token configured to interact are disclosed.

Abstract translation: 公开了配置为进行交互的令牌的实施例。

公开(公告)号：US20050266154A1

公开(公告)日：2005-12-01

申请号：US10854450

申请日：2004-05-26

Applicant: John Devos ,  Daniel Blakley ,  Ravi Prasad ,  Olan Way ,  Jian-Gang Weng ,  Jeffrey Nielsen ,  Tony Cruz-Uribe

Inventor： John Devos ,  Daniel Blakley ,  Ravi Prasad ,  Olan Way ,  Jian-Gang Weng ,  Jeffrey Nielsen ,  Tony Cruz-Uribe

IPC: B05C5/00 ,  B05D5/12 ,  H05K1/00 ,  H05K1/16 ,  H05K3/12

CPC classification number: H05K3/1283 ,  H05K1/0393 ,  H05K1/162 ,  H05K1/167 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1545

Abstract: Methods and apparatuses for forming components or circuits by ejecting a fluid including materials in a single ligament are disclosed.

Abstract translation: 公开了通过将包括材料的流体喷射在单个韧带中来形成部件或电路的方法和装置。