公开(公告)号：US20050101161A1

公开(公告)日：2005-05-12

申请号：US10982982

申请日：2004-11-04

Applicant: Kurt Weiblen ,  Franz Schmich ,  Harald Emmerich ,  Klaus Offterdinger ,  Hansjoerg Beutel ,  Johann Wehrmann ,  Florian Grabmaier

Inventor： Kurt Weiblen ,  Franz Schmich ,  Harald Emmerich ,  Klaus Offterdinger ,  Hansjoerg Beutel ,  Johann Wehrmann ,  Florian Grabmaier

IPC: H01L27/14 ,  B81B7/00 ,  G01P1/02 ,  H01L23/02 ,  H01L31/14 ,  H01R13/658 ,  H01R33/00

CPC classification number: B81B7/0064 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P1/023 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/3025 ,  H01R13/6594 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.

Abstract translation: 传感器模块，特别是用于测量加速度或转速，具有由塑料材料制成的壳体基体;延伸穿过壳体基体的引线框架，以及具有用于连接到电路板的连接器引脚的引线;传感器 系统具有至少一个传感器芯片，所述传感器系统通过导体接合与所述引线框架接触;盖，其连接到所述基体和至少一个连接器引脚并且由导电材料制成。 由于导电盖连接到连接器针的事实，实现了具有高屏蔽效果的简单结构。 当组件安装在电路板上时，盖子（例如盖子）可以通过连接器销与其它连接器引脚直接接触。 传感器模块可以被模制或者可以具有预成型的壳体。 盖的边缘或接触件可以被焊接，焊接，胶合或压到引线框架的接地引线。