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公开(公告)号：US08276446B2
公开(公告)日：2012-10-02
申请号：US12657751
申请日：2010-01-26
Applicant: Markus Ulm , Michael Struchholz , Tristan Jobert , Klaus Offterdinger , Thomas Klaus , Christian Gerhardt , Florian Grabmaier , Dirk Dittmann
Inventor： Markus Ulm , Michael Struchholz , Tristan Jobert , Klaus Offterdinger , Thomas Klaus , Christian Gerhardt , Florian Grabmaier , Dirk Dittmann
IPC: G01D11/10
CPC classification number: G01P1/023 , B81B7/0012 , B81B2201/025 , B81B2207/07 , G01C19/56 , H01L2224/48091 , H01L2924/00014
Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.
Abstract translation: 传感器装置包括壳体基部，承载部分，位于承载部分上的芯片结构，以及弹簧/阻尼器组合，壳体基部和承载部分经由该弹簧/阻尼器组合彼此弹性连接。 在传感器装置中，壳体基部，弹簧/阻尼器组合和承载部分彼此重叠。
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公开(公告)号：US07323766B2
公开(公告)日：2008-01-29
申请号：US10982982
申请日：2004-11-04
Applicant: Kurt Weiblen , Franz Schmich , Harald Emmerich , Klaus Offterdinger , Hansjoerg Beutel , Johann Wehrmann , Florian Grabmaier
Inventor： Kurt Weiblen , Franz Schmich , Harald Emmerich , Klaus Offterdinger , Hansjoerg Beutel , Johann Wehrmann , Florian Grabmaier
IPC: H01L23/495
CPC classification number: B81B7/0064 , B81B2201/0235 , B81B2201/0242 , G01P1/023 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/01068 , H01L2924/3025 , H01R13/6594 , H01L2924/00014 , H01L2924/00
Abstract: A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.
Abstract translation: 传感器模块，特别是用于测量加速度或转速，具有由塑料材料制成的壳体基体;延伸穿过壳体基体的引线框架，以及具有用于连接到电路板的连接器引脚的引线;传感器 系统具有至少一个传感器芯片，所述传感器系统通过导体接合与所述引线框架接触;盖，其连接到所述基体和至少一个连接器引脚并且由导电材料制成。 由于导电盖连接到连接器针的事实，实现了具有高屏蔽效果的简单结构。 当组件安装在电路板上时，盖子（例如盖子）可以通过连接器销与其它连接器引脚直接接触。 传感器模块可以被模制或者可以具有预成型的壳体。 盖的边缘或接触件可以被焊接，焊接，胶合或压到引线框架的接地引线。
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公开(公告)号：US09222955B2
公开(公告)日：2015-12-29
申请号：US13757082
申请日：2013-02-01
Applicant: Holger Hoefer , Ricardo Ehrenpfordt , Klaus Offterdinger , Christian Solf
Inventor： Holger Hoefer , Ricardo Ehrenpfordt , Klaus Offterdinger , Christian Solf
CPC classification number: G01P1/003 , G01P15/0802 , G01P2015/0882 , H01L2224/16225 , H01L2924/15311 , H05K1/0271 , H05K1/141 , H05K3/00 , H05K2201/049 , H05K2201/10151 , Y10T29/4913
Abstract: A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.
Abstract translation: 一种用于微机械传感器装置的阻尼装置，具有至少一个具有至少两个部分的第一中间层，第二部分围绕第一部分设置，横向距离设置在第一和第二部分之间，弹性装置为 设置在第一部分和第二部分之间，作为第一中间层的整体部分。
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公开(公告)号：US20100242605A1
公开(公告)日：2010-09-30
申请号：US12707896
申请日：2010-02-18
Applicant: Klaus Offterdinger
Inventor： Klaus Offterdinger
IPC: G01P15/02
CPC classification number: G01C19/5783 , B81B7/0058 , B81B2201/0235 , B81B2201/0242 , G01D11/10 , G01D11/245 , G01P1/023 , H01L2224/48091 , H01L2924/00014
Abstract: A sensor component having a housing and a sensor chip situated in it. The sensor chip is connected mechanically to the housing via at least one elastomer element. In addition, the sensor chip is also connected electrically to the housing via the at least one elastomer element.
Abstract translation: 传感器部件具有外壳和位于其中的传感器芯片。 传感器芯片经由至少一个弹性体元件机械连接到壳体。 此外，传感器芯片还通过至少一个弹性体元件与壳体电连接。
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公开(公告)号：US20110233907A1
公开(公告)日：2011-09-29
申请号：US13120294
申请日：2009-07-29
Applicant: Michael Struchholz , Tristan Jobert , Klaus Offterdinger , Thomas Klaus , Dirk Dittmann
Inventor： Michael Struchholz , Tristan Jobert , Klaus Offterdinger , Thomas Klaus , Dirk Dittmann
CPC classification number: H01L23/495 , G01L19/0084 , H01L23/49558 , H01L2924/0002 , H05K3/303 , H05K3/3426 , H05K2201/09781 , H05K2201/10151 , H05K2201/10689 , H05K2201/10893 , Y02P70/613 , H01L2924/00
Abstract: A housing for an electrical circuit, in particular for a sensor, pins projecting from the housing for the electrical contacting of the circuit, additional pins being provided which are not connected electrically to the circuit but instead are used as mechanical arrangement for fastening the housing to a printed circuit board in particular. The present invention further relates to a housing having an electrical circuit, in particular a sensor, pins projecting from the housing for the electrical contacting of the circuit, at least two pins being connected to one another mechanically via a connecting piece.
Abstract translation: 一种用于电路的壳体，特别是用于传感器的，用于电路接触的外壳突出的销，提供了未与电路电连接的另外的引脚，而是用作用于将壳体紧固到 特别是印刷电路板。 本发明还涉及一种具有电路的壳体，特别是传感器，用于电路的电接触从外壳突出的销，至少两个销通过连接件彼此机械连接。
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Patent Agency Ranking
公开(公告)号：US20100192689A1
公开(公告)日：2010-08-05
申请号：US12657751
申请日：2010-01-26
Applicant: Markus Ulm , Michael Struchholz , Tristan Jobert , Klaus Offterdinger , Thomas Klaus , Christian Gerhardt , Florian Grabmaier , Dirk Dittmann
Inventor： Markus Ulm , Michael Struchholz , Tristan Jobert , Klaus Offterdinger , Thomas Klaus , Christian Gerhardt , Florian Grabmaier , Dirk Dittmann
IPC: G01D11/10
CPC classification number: G01P1/023 , B81B7/0012 , B81B2201/025 , B81B2207/07 , G01C19/56 , H01L2224/48091 , H01L2924/00014
Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.
Abstract translation: 传感器装置包括壳体基部，承载部分，位于承载部分上的芯片结构，以及弹簧/阻尼器组合，壳体基部和承载部分经由该弹簧/阻尼器组合彼此弹性连接。 在传感器装置中，壳体基部，弹簧/阻尼器组合和承载部分彼此重叠。
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公开(公告)号：US20070037317A1
公开(公告)日：2007-02-15
申请号：US10574189
申请日：2004-09-15
Applicant: Klaus Offterdinger , Ronny Ludwig
Inventor： Klaus Offterdinger , Ronny Ludwig
IPC: H01L21/00
CPC classification number: H01L23/057 , H01L21/52 , H01L23/49861 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/8385 , H01L2224/83871 , H01L2224/83874 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01032 , H01L2924/01068 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00
Abstract: A method and the associated device for attaching at least one micromechanical chip in a housing which is optically transparent to radiation of at least one predefined transmission wavelength, in which an adhesive layer is applied between the chip and the housing and the adhesive layer is irradiated through the housing using radiation of the transmission wavelength for the purpose of curing.
Abstract translation: 一种用于将至少一个微机械芯片附接到壳体中的方法和相关联的装置，其对于至少一个预定透射波长的辐射是光学透明的，其中粘合剂层被施加在芯片和壳体之间，并且粘合剂层被照射通过 房屋使用辐射的透射波长为了固化的目的。
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公开(公告)号：US07004370B2
公开(公告)日：2006-02-28
申请号：US10363097
申请日：2001-08-31
Applicant: Volker Arndt , Klaus Offterdinger , Walter Pasdzior
Inventor： Volker Arndt , Klaus Offterdinger , Walter Pasdzior
CPC classification number: G01N29/4472 , B23K11/241 , B23K11/252 , G01N29/38 , G01N29/4427 , G01N2291/015 , G01N2291/048 , G01N2291/102 , G01N2291/2672
Abstract: The invention relates to a device and method for determining parameters of a welding system. According to the invention, a welding area (18, 21, 22) is subjected to the action of ultrasonic waves, preferably to the action of shear waves, by using an ultrasound source (14). During a first welding process (n1), a signal processing (30) determines a first ultrasonic permeability (Dn1) from a received ultrasonic signal (UE). During at least one subsequent welding process (n2), a second ultrasonic permeability (Dn2) is determined from an ultrasonic signal (UE) that is received during a renewed exposure of the welding area (18, 21, 22) to ultrasonic waves. A display (32) and/or a diagnostic function and/or a correction of control quantities of the welding system is/are carried out as a function of the at least two ultrasonic permeabilities (Dn1, Dn2).
Abstract translation: 本发明涉及一种用于确定焊接系统参数的装置和方法。 根据本发明，通过使用超声波源（14），焊接区域（18,21,22）受到超声波的作用，优选地受到剪切波的作用。 在第一焊接过程（n 1）期间，信号处理（30）从接收的超声波信号（UE）确定第一超声波透过率（Dn 1）。 在至少一个随后的焊接过程（n 2）期间，从在焊接区域（18,21,22）再次暴露于超声波期间接收的超声波信号（UE）确定第二超声波透过率（Dn 2） 。 作为至少两个超声波渗透性（Dn 1，Dn 2）的函数执行显示器（32）和/或诊断功能和/或焊接系统的控制量的校正。
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公开(公告)号：US08584525B2
公开(公告)日：2013-11-19
申请号：US12707896
申请日：2010-02-18
Applicant: Klaus Offterdinger
Inventor： Klaus Offterdinger
IPC: G01P15/00
CPC classification number: G01C19/5783 , B81B7/0058 , B81B2201/0235 , B81B2201/0242 , G01D11/10 , G01D11/245 , G01P1/023 , H01L2224/48091 , H01L2924/00014
Abstract: A sensor component having a housing and a sensor chip situated in it. The sensor chip is connected mechanically to the housing via at least one elastomer element. In addition, the sensor chip is also connected electrically to the housing via the at least one elastomer element.
Abstract translation: 传感器部件具有外壳和位于其中的传感器芯片。 传感器芯片经由至少一个弹性体元件机械连接到壳体。 此外，传感器芯片还通过至少一个弹性体元件与壳体电连接。
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公开(公告)号：US20130199295A1
公开(公告)日：2013-08-08
申请号：US13757082
申请日：2013-02-01
Applicant: Holger HOEFER , Ricardo EHRENPFORDT , Klaus OFFTERDINGER , Christian SOLF
Inventor： Holger HOEFER , Ricardo EHRENPFORDT , Klaus OFFTERDINGER , Christian SOLF
CPC classification number: G01P1/003 , G01P15/0802 , G01P2015/0882 , H01L2224/16225 , H01L2924/15311 , H05K1/0271 , H05K1/141 , H05K3/00 , H05K2201/049 , H05K2201/10151 , Y10T29/4913
Abstract: A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.
Abstract translation: 一种用于微机械传感器装置的阻尼装置，具有至少一个具有至少两个部分的第一中间层，第二部分围绕第一部分设置，横向距离设置在第一和第二部分之间，弹性装置为 设置在第一部分和第二部分之间，作为第一中间层的整体部分。
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