公开(公告)号：US20100237887A1

公开(公告)日：2010-09-23

申请号：US12709268

申请日：2010-02-19

Applicant: Yohannes Desta ,  Chang Huang ,  Lakshmikanth Namburi ,  Matthew Losey

Inventor： Yohannes Desta ,  Chang Huang ,  Lakshmikanth Namburi ,  Matthew Losey

IPC: G01R31/02

CPC classification number: G01R1/07378

Abstract: A plurality of inserts are anchored in holes or recesses in a probe head. Shafts are coupled to the inserts, and adjustable multi-part fasteners are attached to the shafts and to a stiffener. The multi-part fasteners are operated to move the shafts and couple the probe head, the stiffener, and other components of a microelectronic contactor assembly. In some embodiments, the inserts may be anchored in the probe head using an adhesive. In some embodiments, the probe head may comprise more than one major substrate, and the inserts may be anchored in either of the substrates.

Abstract translation: 多个插入件锚固在探针头中的孔或凹槽中。 轴联接到插入件，并且可调节的多部件紧固件附接到轴和加强件。 操作多部件紧固件以移动轴并耦合探针头，加强件和微电子接触器组件的其它部件。 在一些实施例中，插入件可以使用粘合剂锚定在探头中。 在一些实施例中，探针头可以包括多于一个主要基底，并且插入物可以锚固在任一基底中。

公开(公告)号：US07761966B2

公开(公告)日：2010-07-27

申请号：US11778207

申请日：2007-07-16

Applicant: Lakshmikanth Namburi ,  Raffi Garabedian

Inventor： Lakshmikanth Namburi ,  Raffi Garabedian

IPC: B23P19/04

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/07342 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49728 ,  Y10T29/4973 ,  Y10T29/49732 ,  Y10T29/53178 ,  Y10T29/53274

Abstract: A method for repairing a damaged probe from a probe card comprising the steps of removing the damaged probe from the probe card, separating one a plurality of replacement probes from a substrate and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed.

Abstract translation: 一种用于从探针卡修复损坏的探针的方法，包括以下步骤：从探针卡移除损坏的探针，将多个替换探针与基底分开一个，并将从多个替换探针分离的一个探针放置在损伤的探针 去掉了。

公开(公告)号：US20090237099A1

公开(公告)日：2009-09-24

申请号：US12077627

申请日：2008-03-20

Applicant: Raffi Garabedian ,  Salleh Ismail ,  Lakshmikanth Namburi

Inventor： Raffi Garabedian ,  Salleh Ismail ,  Lakshmikanth Namburi

IPC: G01R1/073 ,  H01B13/00

CPC classification number: G01R3/00 ,  G01R1/07378 ,  Y10T29/49147

Abstract: The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate.

Abstract translation: 本发明涉及一种探针头，其具有探针接触器基底，该探针接触器基底具有穿过该探针接触器基底的至少一个狭缝，至少一个探针接触器，其适用于测试被测器件，探针接触器与顶部 并且电连接到也设置在探针接触器基板顶部的端子，以及空间变压器，其具有耦合到空间变压器的顶侧的至少一个接合焊盘，以及电连接所述探针接触器基板 接合焊盘通过探头接触器基板中的插槽连接到端子。

公开(公告)号：US20090072851A1

公开(公告)日：2009-03-19

申请号：US12208223

申请日：2008-09-10

Applicant: Lakshmikanth Namburi ,  Salleh Ismail

Inventor： Lakshmikanth Namburi ,  Salleh Ismail

IPC: G01R1/067

CPC classification number: G01R1/06727 ,  G01R1/06733 ,  G01R1/07342

Abstract: A novel probe design is presented that comprises a plurality of pivots. These pivots allow the probe to store the displacement energy more efficiently. The novel probe comprises a substrate, and a probe connected to the substrate. The probe further comprises a base that is connected to the substrate, a bending element connected to the base and a probe tip connected to the bending element. In one embodiment, the plurality of pivots may be connected to the substrate such that a portion of the probe may contact the plurality of pivots while the probe tip contacts the device. In another embodiment, the plurality of pivots is connected to the bending element, such that the plurality of pivots may contact the substrate while the probe tip contacts the device. The bending element may also comprise a forked bending element connected to the base, such as the forked bending structure described in co-pending and related patent application Ser. No. 11/855,094. The forked bending structure may include at least a first prong connected to a second prong through a prong connecting structure and a handle connected to the prong connecting structure.

Abstract translation: 提出了一种包括多个枢轴的新型探针设计。 这些枢轴允许探头更有效地存储位移能量。 新型探针包括基底和连接到基底的探针。 探头还包括连接到基底的基座，连接到基座的弯曲元件和连接到弯曲元件的探针尖端。 在一个实施例中，多个枢轴可以连接到基板，使得当探针尖端接触装置时，探头的一部分可以接触多个枢轴。 在另一个实施例中，多个枢轴连接到弯曲元件，使得当探头尖端接触该装置时，多个枢轴可接触基板。 弯曲元件还可以包括连接到基座的叉形弯曲元件，例如共同未决的和相关的专利申请Ser中所述的叉形弯曲结构。 第11 / 855,094号。 叉形弯曲结构可以包括至少一个通过插脚连接结构连接到第二插脚的第一插脚和连接到插脚连接结构的手柄。

公开(公告)号：US20060134820A1

公开(公告)日：2006-06-22

申请号：US11102982

申请日：2005-04-11

Applicant: Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian ,  Lakshmikanth Namburi

Inventor： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Tea ,  Melvin Khoo ,  Raffi Garabedian ,  Lakshmikanth Namburi

IPC: H01L21/00 ,  H01L21/44

CPC classification number: B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。