METHOD OF MAKING DELAMINATED RESISTANT ASSEMBLIES
    17.
    发明申请
    METHOD OF MAKING DELAMINATED RESISTANT ASSEMBLIES 审中-公开
    制造耐磨组件的方法

    公开(公告)号:US20140246090A1

    公开(公告)日:2014-09-04

    申请号:US14236735

    申请日:2012-07-24

    Abstract: The present application is directed to a method of reducing delamination in an assembly. The method comprises providing an assembly and limiting visible light exposure to parts of the assembly to maintain a peel force of 20 grams/inch or greater where the light is limited. The assembly comprises an electronic device, a substrate having a first surface and a second surface opposite the first surface, wherein the second surface of the substrate is disposed on the electronic device, a barrier stack disposed on the first surface of the substrate, and a weatherable sheet adjacent the barrier film opposite the substrate. The assembly is transmissive to visible and infrared light.

    Abstract translation: 本申请涉及减少组装中分层的方法。 该方法包括提供组件并且限制可见光暴露于组件的部分以在光被限制的情况下保持20克/英寸或更大的剥离力。 组件包括电子器件,具有第一表面和与第一表面相对的第二表面的衬底,其中衬底的第二表面设置在电子器件上,设置在衬底的第一表面上的势垒堆叠,以及 与靠近基板的阻挡膜相邻的耐候片材。 组件对可见光和红外光透射。

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