BARRIER ASSEMBLIES
    6.
    发明申请
    BARRIER ASSEMBLIES 审中-公开
    障碍物组装

    公开(公告)号:US20140290736A1

    公开(公告)日:2014-10-02

    申请号:US14236697

    申请日:2012-07-24

    CPC classification number: H01L31/048 H01L31/0481 Y02E10/50

    Abstract: The present application is directed to an assembly comprising an electronic device and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device, and a weatherable sheet adjacent the barrier stack opposite the electronic device. The weatherable sheet is bonded to the electronic device.

    Abstract translation: 本申请涉及一种包括电子器件和多层膜的组件。 多层膜包括邻近电子器件的阻挡层叠层,以及与电子器件相对的阻挡层叠层的耐候性片。 耐候片粘合到电子装置上。

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