公开(公告)号：US08981238B2

公开(公告)日：2015-03-17

申请号：US13382698

申请日：2010-06-22

Applicant: Michael Zitzlsperger ,  Stefan Grötsch

Inventor： Michael Zitzlsperger ,  Stefan Grötsch

IPC: H01L23/48 ,  H05K9/00 ,  H05K3/34 ,  H01L33/48 ,  H01L33/62

CPC classification number: H05K1/181 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.

Abstract translation: 电子设备包括基体，该基体具有顶侧，并且还具有与顶侧相对的下侧。 基体在其下侧具有连接位置。 在基体的顶侧设置有电子部件。 基体具有至少一个具有至少一个检查点的侧面区域，具有第一区域和第二区域。 第二个地区体现为第一个地区的缩进。 第一和第二区域包含不同的材料。

公开(公告)号：US08946756B2

公开(公告)日：2015-02-03

申请号：US13256213

申请日：2009-12-23

Applicant: Michael Zitzlsperger

Inventor： Michael Zitzlsperger

IPC: H01L33/00 ,  H01L31/0203 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L31/0203 ,  H01L33/483 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component (100) is specified, with a support (1) which has a mounting surface (11) and at least one penetration (3), where the penetration (3) extends from the mounting surface (11) to a bottom surface (12) of the support (1) that lies opposite the mounting surface (11); at least one optoelectronic semiconductor chip (2), which is mounted on the mounting surface (11); a radiation-transparent casting body (5), which surrounds the at least one optoelectronic semiconductor chip (2) at least in places, where the casting body (5) is arranged at least in places in the penetration (3) of the support (1).

Abstract translation: 规定光电子半导体部件（100），其具有支撑件（1），所述支撑件（1）具有安装表面（11）和至少一个穿透部（3），其中穿透部件（3）从安装表面（11）延伸到底部 所述支撑件（1）的与安装表面（11）相对的表面（12）; 安装在所述安装面（11）上的至少一个光电半导体芯片（2）; 至少在至少一些地方围绕所述至少一个光电半导体芯片（2）的辐射透明铸造体（5），其中所述铸造体（5）至少布置在所述支撑件的穿透（3）中的位置（ 1）。

公开(公告)号：US08907369B2

公开(公告)日：2014-12-09

申请号：US13818021

申请日：2011-08-18

Applicant: Michael Zitzlsperger ,  Johann Ramchen

Inventor： Michael Zitzlsperger ,  Johann Ramchen

IPC: H01L33/00 ,  H01L33/64 ,  H01L33/48 ,  H01L33/62 ,  F21V29/00

CPC classification number: F21K9/00 ,  F21V29/85 ,  H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00 ,  H01L2224/48227

Abstract: An optoelectronic semiconductor component includes a substrate that has an upper side and an under side lying opposite the upper side. The substrate is formed with an electrically conductive mounting region, an electrically conductive connection region and an electrically isolating oxidation region. An optoelectronic part is arranged on the upper side of the substrate in the region of the mounting region. The oxidation region electrically isolates the mounting region from the connection region. The oxidation region extends, without interruption, from the upper side of the substrate to the underside of the substrate. The mounting region and the connection region are formed with aluminum and the oxidation region is formed with an oxide of the aluminum. The mounting region, the oxidation region and the connection region being are designed contiguously to form an entity.

Abstract translation: 光电子半导体部件包括具有与上侧相对的上侧和下侧的基板。 基板形成有导电安装区域，导电连接区域和电隔离氧化区域。 在安装区域的区域中，光电子部件布置在基板的上侧。 氧化区域将安装区域与连接区域电隔离。 氧化区域从衬底的上侧到衬底的下侧不间断地延伸。 安装区域和连接区域由铝形成，并且氧化区域由铝的氧化物形成。 安装区域，氧化区域和连接区域被连续设计以形成实体。

公开(公告)号：US08692275B2

公开(公告)日：2014-04-08

申请号：US13636678

申请日：2011-05-04

Applicant: Harald Jaeger ,  Michael Zitzlsperger ,  Albert Schneider

Inventor： Harald Jaeger ,  Michael Zitzlsperger ,  Albert Schneider

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic component includes a housing. At least one semiconductor chip is arranged in the housing. The semiconductor chip includes an active layer suitable for producing or detecting electromagnetic radiation. A casting compound at least partially surrounds the semiconductor chip. Reflective particles are embedded in the casting compound.

Abstract translation: 光电子部件包括壳体。 至少一个半导体芯片布置在壳体中。 半导体芯片包括适于产生或检测电磁辐射的有源层。 铸造化合物至少部分地围绕半导体芯片。 反射性颗粒嵌入铸塑料中。

公开(公告)号：US20110303945A1

公开(公告)日：2011-12-15

申请号：US13127623

申请日：2010-01-29

Applicant: Michael Zitzlsperger ,  Matthias Sperl

Inventor： Michael Zitzlsperger ,  Matthias Sperl

IPC: H01L33/62 ,  H01L21/56 ,  H01L31/0203

CPC classification number: H01L21/56 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49586 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor arrangement including at least one lead arrangement with a top and a bottom opposite the top; a least one solder resist layer which partially covers the top and the bottom, at least sub-zones of the top and the bottom, which are not covered by the solder resist layer, forming electrical base members; an optoelectronic semiconductor element, which is mounted on at least one of the base members on the top of the lead arrangement and is connected electrically conductively therewith, and an encapsulant applied at least to the top of the lead arrangement, the encapsulant covering up the semiconductor element and lying at least partially against the solder resist layer, wherein the base members are bordered all round by the solder resist layer.

Abstract translation: 一种半导体装置，包括至少一个引线装置，顶部和底部与顶部相对; 至少一个阻焊层，其部分地覆盖顶部和底部，至少未被阻焊层覆盖的顶部和底部的子区域，形成电气基底构件; 光电子半导体元件，其安装在引线装置的顶部上的至少一个基底构件上并与其导电连接，以及至少施加到引线装置的顶部的密封剂，所述密封剂覆盖半导体 并且至少部分地抵靠阻焊层，其中基底部件被阻焊层全部界定。

公开(公告)号：US20110266559A1

公开(公告)日：2011-11-03

申请号：US12994624

申请日：2009-04-17

Applicant: Michael Zitzlsperger ,  Thomas Zeiler

Inventor： Michael Zitzlsperger ,  Thomas Zeiler

IPC: H01L31/12 ,  H01L31/18

CPC classification number: H01L25/167 ,  G01V8/12 ,  H01L31/0203 ,  H01L31/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The application relates to a semiconductor component, a photo-reflective sensor, and also a method for producing a housing for a photo-reflective sensor, wherein the housing lower part is monolithic and has at least two cavities into which an emitter and a detector are introduced.

Abstract translation: 本申请涉及半导体部件，光反射传感器以及用于制造光反射传感器的壳体的方法，其中壳体下部​​是整体的并且具有至少两个空腔，发射器和检测器 介绍。

公开(公告)号：US09698282B2

公开(公告)日：2017-07-04

申请号：US12933510

申请日：2009-03-31

Applicant: Harald Jaeger ,  Michael Zitzlsperger

Inventor： Harald Jaeger ,  Michael Zitzlsperger

IPC: H01L21/60 ,  H01L23/48 ,  H01L31/0203 ,  H01L23/498 ,  H01L31/18 ,  H01L33/48 ,  H01L23/00 ,  H01L31/0232 ,  H01L33/62

CPC classification number: H01L31/0203 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/97 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0066 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An optoelectronic component including a connection carrier comprising a structured carrier strip in which interspaces are filled with an electrically insulating material and an optoelectronic semiconductor chip attached and electrically connected to a top portion of the connection carrier, wherein the electrically insulating material terminates substantially flush with the carrier strip in places or the carrier strip projects beyond the electrically insulating material, and the carrier strip is not covered by the electrically insulating material on the top portion and/or on a bottom portion of the connection carrier.

公开(公告)号：US08710609B2

公开(公告)日：2014-04-29

申请号：US13127623

申请日：2010-01-29

Applicant: Michael Zitzlsperger ,  Matthias Sperl

Inventor： Michael Zitzlsperger ,  Matthias Sperl

IPC: H01L31/0203 ,  H01L21/56

CPC classification number: H01L21/56 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49586 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor arrangement including at least one lead arrangement with a top and a bottom opposite the top; at least one solder resist layer which partially covers the top and the bottom, at least sub-zones of the top and the bottom, which are not covered by the solder resist layer, forming electrical base members; an optoelectronic semiconductor element, which is mounted on at least one of the base members on the top of the lead arrangement and is connected electrically conductively therewith, and an encapsulant applied at least to the top of the lead arrangement, the encapsulant covering up the semiconductor element and lying at least partially against the solder resist layer, wherein the base members are bordered all round by the solder resist layer.

Abstract translation: 一种半导体装置，包括至少一个引线装置，顶部和底部与顶部相对; 至少一个阻焊层，其部分地覆盖顶部和底部，至少在顶部和底部的子区域，其不被阻焊层覆盖，形成电气基底构件; 光电子半导体元件，其安装在引线装置的顶部上的至少一个基底构件上并与其导电连接，以及至少施加到引线装置的顶部的密封剂，所述密封剂覆盖半导体 并且至少部分地抵靠阻焊层，其中基底部件被阻焊层全部界定。

公开(公告)号：US20120299041A1

公开(公告)日：2012-11-29

申请号：US13515256

申请日：2010-11-17

Applicant: Gertrud Kräuter ,  Bernd Barchmann ,  Krister Bergenek ,  Michael Zitzlsperger ,  Johann Ramchen

Inventor： Gertrud Kräuter ,  Bernd Barchmann ,  Krister Bergenek ,  Michael Zitzlsperger ,  Johann Ramchen

IPC: H01L33/60

CPC classification number: H01L33/56 ,  H01L31/035281 ,  H01L33/505

Abstract: An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.

Abstract translation: 光电子半导体元件包括具有辐射耦合输出区域的辐射发射半导体芯片。 在半导体芯片中产生的电磁辐射通过辐射耦合输出区离开半导体芯片。 转换器元件设置在半导体芯片的辐射耦合输出区域的下游。 转换器元件被配置为转换由半导体芯片发射的电磁辐射。 转换器元件具有背离辐射耦合输出区域的第一表面。 反射封装以形状配合的方式将半导体芯片和转换器元件的部分封装在侧面区域。 转换器元件的第一表面没有反射封装。

公开(公告)号：US20120139003A1

公开(公告)日：2012-06-07

申请号：US13377910

申请日：2010-05-28

Applicant: Michael Zitzlsperger ,  Eckhard Ditzel ,  Jörg Erich Sorg

Inventor： Michael Zitzlsperger ,  Eckhard Ditzel ,  Jörg Erich Sorg

IPC: H01L33/48 ,  H01L31/0203

CPC classification number: H01L33/486 ,  H01L33/38 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.

Abstract translation: 一种光电子部件，包括在连接载体的顶侧包括电绝缘膜的连接载体，在连接载体的顶侧的光电半导体芯片，包围光电半导体芯片的电绝缘膜中的切口，以及 灌封体围绕光电子半导体芯片，其中，所述切口的底部区域至少由所述电绝缘膜区域形成，所述灌封体至少在区域上延伸至所述切口的面向所述光电半导体芯片的外边缘，并且 切口至少在区域上没有灌封体。