公开(公告)号：US10014111B2

公开(公告)日：2018-07-03

申请号：US14661018

申请日：2015-03-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo Hattori ,  Isamu Fujimoto

IPC: H01G4/30 ,  H01G4/228 ,  H01C1/14 ,  H01C7/18 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H05K1/14 ,  H01F27/29 ,  H05K1/18 ,  H05K1/11 ,  H05K3/00

CPC classification number: H01G4/30 ,  H01C1/14 ,  H01C7/18 ,  H01F27/292 ,  H01G2/065 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H05K1/113 ,  H05K1/141 ,  H05K1/181 ,  H05K3/0097 ,  H05K2201/049 ,  H05K2201/09181

Abstract: An electronic component includes an electronic element including external electrodes on a surface and a substrate terminal on which the electronic element is mounted. The substrate terminal includes a first main surface, a second main surface opposite the first main surface, and a peripheral surface joining the first main surface and the second main surface. The substrate terminal includes mounting electrodes provided on the second main surface and electrically connected to the external electrodes of the electronic element, and connection electrodes provided on the first main surface and electrically connected to lands of a circuit substrate. A maximum width of the connection electrodes is greater than a maximum width of the mounting electrodes.

公开(公告)号：US09992870B2

公开(公告)日：2018-06-05

申请号：US15009422

申请日：2016-01-28

Applicant: CASIO COMPUTER CO., LTD.

Inventor： Koji Namiki

IPC: G04G17/04 ,  G04G17/06 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/115 ,  G04G17/04 ,  G04G17/06 ,  H05K1/113 ,  H05K1/117 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/09027 ,  H05K2201/09181

Abstract: A substrate unit includes a first substrate and a second substrate, the second substrate including a superimposed portion superimposed on at least part of the first substrate, and bonding portions located in a plurality of positions at least defining a plane in the superimposed portion, the bonding portions bonded to the first substrate.

公开(公告)号：US09955587B2

公开(公告)日：2018-04-24

申请号：US14859370

申请日：2015-09-21

Applicant: JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD

Inventor： Tao Jiang

IPC: F21S4/00 ,  H05K3/36 ,  F21K9/272 ,  F21Y103/10 ,  F21Y115/10 ,  F21Y107/70 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/363 ,  F21K9/272 ,  F21Y2103/10 ,  F21Y2107/70 ,  F21Y2115/10 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/09181 ,  H05K2201/0969 ,  H05K2201/10106

Abstract: An LED tube lamp including a lamp tube, an end cap attached to an end of the lamp tube, a power supply disposed in the end cap, and an LED light bar disposed inside the lamp tube. The LED light bar is mounted with LED light sources which are electrically connected to the power supply by way of the LED light bar. The LED light bar includes a bendable circuit sheet which is longer than the lamp tube. A soldering pad is configured and disposed at an end of the bendable circuit sheet. The soldering pad is formed with a through-hole or a notch to allow tin solder to pass through when soldering such that the bendable circuit sheet can be directly soldered and electrically connected to the power supply.

公开(公告)号：US09947466B2

公开(公告)日：2018-04-17

申请号：US14663725

申请日：2015-03-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo Hattori ,  Isamu Fujimoto ,  Hirobumi Adachi

IPC: H05K1/03 ,  H01G2/06 ,  H01G4/30 ,  H01G4/232 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613

Abstract: An electronic component includes an electronic element including outer electrodes on a surface, a substrate terminal on which the electronic element is mounted, and a conductor that covers at least a portion of the substrate terminal. The substrate terminal includes a first main surface, a second main surface at a side opposite to the first main surface, and a side surface connecting the first main surface and the second main surface. The substrate terminal includes a mounting electrode that is provided on the first main surface and is electrically connected to the outer electrodes of the electronic element. The mounting electrode includes adjacent portions that are located to be adjacent to the side surface of the substrate terminal. The conductor covers at least a portion of the adjacent portion.

公开(公告)号：US20180024411A1

公开(公告)日：2018-01-25

申请号：US15657222

申请日：2017-07-24

Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

Inventor： Norikazu MIYAZAKI ,  Toru SUGAMATA

IPC: G02F1/225 ,  H05K1/11 ,  H05K1/02

CPC classification number: G02F1/2255 ,  G02F1/0121 ,  G02F2001/212 ,  H05K1/0206 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/113 ,  H05K1/118 ,  H05K3/306 ,  H05K3/363 ,  H05K2201/0338 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/09481 ,  H05K2201/10121

Abstract: An optical modulator including a flexible printed circuit performing an electrical connection with an external circuit substrate, in which the flexible printed circuit includes a plurality of first pads and the like provided on one surface of the flexible printed circuit along one side of the flexible printed circuit, a plurality of second pads and the like provided on the other surface of the flexible printed circuit at locations that respectively correspond to the plurality of first pads, and a plurality of metal films and the like provided at locations that respectively correspond to the first pads on a side surface of the flexible printed circuit along the one side of the flexible printed circuit.

公开(公告)号：US09844132B2

公开(公告)日：2017-12-12

申请号：US15142197

申请日：2016-04-29

Applicant: CANON KABUSHIKI KAISHA

Inventor： Shinsuke Serizawa

IPC: H05K1/02 ,  G03G15/00 ,  H05K1/11 ,  G03G21/16 ,  H05K3/40

CPC classification number: H05K1/0296 ,  G03G15/50 ,  G03G15/80 ,  G03G21/1652 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/4015 ,  H05K3/403 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10363

Abstract: The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

公开(公告)号：US09839135B2

公开(公告)日：2017-12-05

申请号：US14332652

申请日：2014-07-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuto Ogawa ,  Takashi Watanabe ,  Junya Shimakawa ,  Mitsuhide Kato

IPC: H05K3/00 ,  H01G2/06 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K3/0052 ,  H01G2/065 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1563 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

公开(公告)号：US09825588B2

公开(公告)日：2017-11-21

申请号：US15370245

申请日：2016-12-06

Applicant: Seiko Epson Corporation

Inventor： Yoshiaki Matsumoto

IPC: H03B5/36 ,  H05K1/02 ,  H05K3/40

CPC classification number: H03B5/368 ,  H03B5/36 ,  H03B2200/0026 ,  H05K1/0215 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10075

Abstract: An oscillator comprising a support substrate, at least one transducer mounted on a first surface of the support substrate, and an integrated circuit element mounted on a second surface of the support substrate. The integrated circuit element includes first and second frequency generating components integrated therein. The first frequency generating component generates a first output frequency, and the second frequency generating component generates a second output frequency that is higher than the first output frequency. The oscillator also includes a ground terminal to which the second frequency generating component is closer than the first frequency generating component.

公开(公告)号：US09787030B2

公开(公告)日：2017-10-10

申请号：US15398793

申请日：2017-01-05

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Amid I. Hashim ,  Brian J. Fitzpatrick ,  Bryan S. Moffitt ,  Wayne D. Larsen

IPC: H01R24/00 ,  H01R13/6469 ,  H01R24/64 ,  H01R13/6466 ,  H01R12/53 ,  H01R24/28 ,  H01R107/00

CPC classification number: H01R13/6469 ,  H01R12/53 ,  H01R13/6461 ,  H01R13/6466 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/162 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/1034 ,  H05K2201/10356

Abstract: Patch cords are provided that include a communications cable that has at least first through fourth conductors and a plug that is attached to the cable. The plug includes a housing that receives the cable, a printed circuit board, first through fourth plug contacts, and first through fourth conductive paths that connect the first through fourth conductors to the respective first through fourth plug contacts. The first and second conductors, conductive paths, and plug contacts form a first differential transmission line, and the third and fourth conductors, conductive paths, and plug contacts form a second differential transmission line. Each of the first through fourth plug contacts has a first segment that extends longitudinally along a first surface of the printed circuit board, and the signal current injection point into the first segment of at least some of the first through fourth plug contacts is into middle portions of their respective first segments.

公开(公告)号：US20170118839A1

公开(公告)日：2017-04-27

申请号：US14921749

申请日：2015-10-23

Applicant: International Business Machines Corporation

Inventor： Thomas Brunschwiler ,  Andreas Doering ,  Ronald P. Luijten ,  Stefano S. Oggioni ,  Joerg-Eric Sagmeister ,  Patricia Sagmeister ,  Martin Schmatz

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K7/20 ,  H05K3/30

CPC classification number: H05K3/403 ,  H05K1/141 ,  H05K1/145 ,  H05K3/366 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09181

Abstract: The present invention is notably directed to a printed circuit board, or PCB. This PCB has two main surfaces, each delimited by lateral edges, as well as lateral surfaces, each meeting each of the two main surfaces at one lateral edge. The present PCB further comprises a row of solder pads, which extends along a lateral edge of the PCB. Each solder pad is formed directly at the lateral edge and/or directly on a lateral surface (meeting one of the two main surfaces at said lateral edge). I.e., each pad interrupts a lateral edge and/or an adjoining lateral surface. One or more chips, e.g., memory chips, can be mounted on such a PCB to form an IC package. The above solder pad arrangement allows particularly dense arrangements of IC packages to be obtained. The present invention is further directed to related devices and methods of fabrication thereof.