Abstract:
Disclosed herein is copper paste for forming a conductive thick film, which contains 80 wt. % to 95 wt. % of spherical first copper powder of 1 .mu.m to 10 .mu.m in mean particle diameter, 0.5 wt. % to 15 wt. % of second copper powder of less than 1 .mu.m in mean particle diameter, and 1 wt. % to 15 wt. % of glass frit of 0.5 .mu.m to 2.0 .mu.m in mean particle diameter respectively as solid components. A conductive thick film obtained by applying the copper paste onto a substrate and baking the same exhibits excellent solderability as well as high adhesive strength to the substrate, and this adhesive strength is excellently maintained even if the thick film is exposed to a heat hysteresis.
Abstract:
An system comprises: a first storage that stores access destination information, characteristic information, and first identification information in a manner associated with one another; a transmitter that transmits a captured image of a medium; a first-acquiring-unit that extracts the characteristic information and acquires the access destination information and the first identification information associated with the characteristic information, access based on the access destination information being controlled by an authentication device comprising a second storage that stores second identification information allocated to each medium, third identification information corresponding to the first identification information, and collation information indicating an access source in a manner associated with one another; a second-acquiring-unit that acquires fourth identification information allocated to each medium from the captured image; and an access unit that transmits the first identification information, the fourth identification information, and the collation information when accessing an access destination indicated by the access destination information.
Abstract:
An ESD protection device includes a ceramic multilayer substrate including a plurality of laminated insulating layers, an external electrode, at least one of an in-plane connecting conductor and an interlayer connecting conductor, and a mixture portion. The mixture portion is provided along a principal surface of one of the insulating layers and includes a dispersed material including at least one of metal and semiconductor; metal and ceramic; metal, semiconductor, and ceramic; semiconductor and ceramic; semiconductor; metal coated with an inorganic material; metal coated with an inorganic material and semiconductor; metal coated with an inorganic material and ceramic; and metal coated with an inorganic material, semiconductor, and ceramic. The mixture portion is connected to the external electrode and at least one of the in-plane connecting conductor and the interlayer connecting conductor.
Abstract:
There is provided a device for monitoring a thickness reduction of an inner surface in a heat transfer tube or an inner surface in an evaporation tube, the device including: a movement unit which moves along a fin tube; a laser measurement unit which is provided in the movement unit and measures the thickness reduction of the inner surface by a laser; a cable which includes a light guiding path for introducing a laser into the laser measurement unit and a light deriving path for transmitting reflected light; and a thickness reduction determining unit which compares the laser measurement data with past data or standard data and determines the current thickness reduction.
Abstract:
In a method for producing a multilayer ceramic substrate, a green ceramic laminate includes green conductive patterns arranged on a plurality of ceramic green sheets and portions to be formed into a plurality of multilayer ceramic substrates. Boundary-defining conductive patterns are arranged on the ceramic green sheets and along boundaries of the multilayer ceramic substrates. The boundary-defining conductive patterns have firing shrinkage characteristics that are different from those of the ceramic green sheets. During firing of the green ceramic laminate, cavities adjacent to edges of the boundary-defining conductive patterns are formed. A sintered ceramic laminate is divided at edges passing through the cavities.
Abstract:
An apparatus and method of searching an electronic document are disclosed. A document that is assumed to contain a search symbol set is searched. The search symbol set is a symbol set being extracted from a plurality of symbols representing a search request when the symbol set being extracted satisfies a predetermined condition.
Abstract:
In a method for manufacturing a laminated ceramic electronic component, in order to form a green ceramic laminate to be fired, first ceramic green layers which include first conductor patterns including Ag as a main component and which include a first ceramic material including a first glass component are disposed in surface layer portions. Second ceramic green layers which include second conductor patterns including Ag as a main component, which include a second ceramic material containing a second glass component, and which include a composition in which Ag diffuses than more easily in the first ceramic green layer during firing are disposed in inner layer portions. The green ceramic laminate is fired to produce a multilayer ceramic substrate.
Abstract:
An information processing apparatus is disclosed which determines, based on fitness to a specified condition, an order of displaying multiple to-be-searched information items which are pre-stored. The apparatus includes a specifying-condition information obtaining unit, an index-information obtaining unit, a population-limiting information obtaining unit, an index-information modifying unit, and a fitness calculating unit.
Abstract:
A multilayer composite including a core made of a magnetic ceramic sintered compact disposed therein, and shrinkage restraining layers including an inorganic powder that is not substantially sintered at the sintering temperature of the green ceramic layers are sintered in order to reduce the difference in shrinkage behavior during firing between the core and the green ceramic layers.
Abstract:
An electronic component includes a wiring board having a wiring pattern, a surface mount device mounted on an upper surface of the wiring board, and a cap arranged to cover the wiring board. The cap includes a top portion made of a flat ceramic member, and a leg portion made of a columnar member having a height similar to a height of the surface mount devices.