Abstract:
An exposure apparatus includes a illumination optical system for illuminating a reticle with light from a light source, and a projection optical system for projecting a pattern of the reticle onto an object, said projection optical system includes a lens closest to the object, wherein a surface on the object side of the lens is smaller than an effective area of a surface on the reticle side of the lens, and wherein said exposure apparatus exposes the object via a liquid that is filled in a space between the lens and the object.
Abstract:
A projection exposure apparatus usable with a reticle having a pattern and a wafer onto which the pattern of the reticle is transferred. The apparatus includes an illumination system for illuminating the reticle, a projection optical system for projecting the pattern of the reticle onto the wafer, wherein the projection optical system includes two lens groups which are individually movable along an optical axis direction, but are not juxtaposed with each other, and a controller for simultaneously adjusting distortion and projection magnification of the pattern projected onto the wafer. The controller performs the adjustment such that the two lens groups of the projection optical system are moved separately along the optical axis direction.
Abstract:
A projection optical system of the present invention includes an optical element group that includes optical elements, and a controller that drives at least one of the first optical elements. The optical element group includes aspheric surfaces having a complementary relationship with each other and are arranged so that the aspheric surfaces face each other. The controller changes a relative position between the optical elements in a first direction and a second direction orthogonal to the first direction to control optical performances of the projection optical system corresponding to each of the first direction and the second direction.
Abstract:
An exposure apparatus includes a illumination optical system for illuminating a reticle with light from a light source, and a projection optical system for projecting a pattern of the reticle onto an object, said projection optical system includes a lens closest to the object, wherein a surface on the object side of the lens is smaller than an effective area of a surface on the reticle side of the lens, and wherein said exposure apparatus exposes the object via a liquid that is filled in a space between the lens and the object.
Abstract:
An exposure apparatus includes a illumination optical system for illuminating a reticle with light from a light source, and a projection optical system for projecting a pattern of the reticle onto an object, said projection optical system includes a lens closest to the object, wherein a surface on the object side of the lens is smaller than an effective area of a surface on the reticle side of the lens, and wherein said exposure apparatus exposes the object via a liquid that is filled in a space between the lens and the object.
Abstract:
A projection optical system is configured to project an image of an object plane onto an image plane, and includes a first optical element having an aspheric shape that is rotationally asymmetric with respect to an optical axis, a moving unit configured to move the first optical element in a direction perpendicular to the optical axis, and a second optical element fixed on the optical axis, and configured to reduce an optical path length difference caused by an aspheric surface of the first optical element, the second optical element having no aspheric shape complement to the aspheric shape of the first optical element.
Abstract:
A projection optical system includes an optical element that includes and locally uses a reflective or refractive area that is substantially axially symmetrical around an optical axis, the optical element being rotatable around the optical axis.