BACKING FOR ADHESIVE TAPE WITH THERMAL RESISTANCE

    公开(公告)号:US20220056318A1

    公开(公告)日:2022-02-24

    申请号:US17521324

    申请日:2021-11-08

    Abstract: Backing films for adhesive tapes are presented, as well as adhesive tapes comprising such backing films, which may include tapes used in construction such as seam sealing tapes, roofing tapes, and flashing tapes. The backing film comprises a core layer, a first skin layer, and optionally a second skin layer, where the backing film has a coefficient of thermal expansion of less than 90 ppm/° C. measured in at least one direction within the plane of the film, and, in some embodiments, a Young's modulus of less than 550 MPa as measured in at least one direction. In some embodiments, the backing film has a coefficient of thermal expansion of not more than 91.8 ppm/° C. and a Young's modulus of not more than 540 MPa as measured in any direction within the plane of the film. In some embodiments, the core layer comprises a polyolefin, and skin layers comprise a thermoplastic elastomer.

    PRIMER-INITIATED CURE OF STRUCTURAL ADHESIVE FILM

    公开(公告)号:US20210102097A1

    公开(公告)日:2021-04-08

    申请号:US15733470

    申请日:2019-02-08

    Abstract: Curable adhesive films, primers for adhesion of curable adhesive films, and adhesive systems comprising adhesive films and primers are provided. In some embodiments, an adhesive system comprises: I) a curable adhesive free-standing film comprising a blend of: a) a first film-forming polymer or oligomer; b) a first species comprising first unsaturated free-radically polymerizable groups, which may be a) or a species other than a); and c) a first transition metal cation; and II) a primer for adhesion of a curable adhesive free-standing film to a first substrate comprising an oxidizing agent. In some embodiments, an adhesive system comprises: I) a curable adhesive free-standing film comprising an outer surface bearing embossed air bleed channels capable of aiding in escape of air during application of the outer surface to a primed substrate; and II) a primer comprising components that initiate cure of the curable adhesive free-standing film.

    BACKING FOR ADHESIVE TAPE WITH THERMAL RESISTANCE

    公开(公告)号:US20190031923A1

    公开(公告)日:2019-01-31

    申请号:US16042192

    申请日:2018-07-23

    Abstract: Backing films for adhesive tapes are presented, as well as adhesive tapes comprising such backing films, which may include tapes used in construction such as seam sealing tapes, roofing tapes, and flashing tapes. The backing film comprises a core layer, a first skin layer, and optionally a second skin layer, where the backing film has a coefficient of thermal expansion of less than 90 ppm/° C. measured in at least one direction within the plane of the film, and, in some embodiments, a Young's modulus of less than 550 MPa as measured in at least one direction. In some embodiments, the backing film has a coefficient of thermal expansion of not more than 91.8 ppm/° C. and a Young's modulus of not more than 540 MPa as measured in any direction within the plane of the film. In some embodiments, the core layer comprises a polyolefin, and skin layers comprise a thermoplastic elastomer.

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