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公开(公告)号：US12207445B2
公开(公告)日：2025-01-21
申请号：US18154858
申请日：2023-01-16
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Chun-Te Wu , Ching-Ming Yang , Yu-Wei Chiu , Tze-Yang Yeh
IPC: H05K7/20
Abstract: A two-phase immersion-type composite heat dissipation device is provided, which includes a heat dissipation substrate, a plurality of fins, and a surface porous layer. The heat dissipation substrate has a first surface and a second surface. The first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source. A projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region. The fins are opposite to the heat source, and are disposed within the high-temperature region of the second surface of the heat dissipation substrate. The surface porous layer is disposed within a range of the low-temperature region of the heat dissipation substrate.
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公开(公告)号：US12120845B2
公开(公告)日：2024-10-15
申请号：US18147672
申请日：2022-12-28
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Yi-Hsin Huang , Chun-Lung Wu , Kuo-Wei Lee , Tze-Yang Yeh
IPC: H05K7/20
CPC classification number: H05K7/20263 , H05K7/20409
Abstract: A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.
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公开(公告)号：US11508642B2
公开(公告)日：2022-11-22
申请号：US17137363
申请日：2020-12-30
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Tze-Yang Yeh , Tzu-Hsuan Wang , Ching-Ming Yang
IPC: H01L23/373 , H01L23/367 , H01L23/427
Abstract: A power module package structure includes, from top to bottom, a layer of power chips, an upper bonding layer, a thermally-conductive and electrically-insulating composite layer, and a heat dissipation layer. The thermally-conductive and electrically-insulating composite layer contains an insulating layer and an upper copper layer that is formed on the insulating layer. One or more layers of upper packaging materials are covered over the layer of power chips and the upper bonding layer and are in contact with an upper surface of the upper copper layer. One or more layers of lower packaging materials are in contact with the insulating layer and are in contact with sidewalls of the upper copper layer. The lower packaging material has a higher rigidity than the upper packaging material.
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公开(公告)号：US11506458B2
公开(公告)日：2022-11-22
申请号：US17016378
申请日：2020-09-10
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Ching-Ming Yang , Reui-Jen Yang , Tze-Yang Yeh
Abstract: An enclosed heat sink with a side wall structure is provided. The side wall structure includes a welding body having a first welding plane and a side wall structure having a second welding plane. The first welding plane and the second welding plane are pressured and welded to each other, such that the welding body and the side wall structure encapsulate a cavity. A width of the second welding plane is smaller than a width between two side surfaces of the side wall structure.
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公开(公告)号：US11302601B1
公开(公告)日：2022-04-12
申请号：US17128204
申请日：2020-12-21
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Tzu-Hsuan Wang , Tze-Yang Yeh , Chih-Hung Shih
IPC: H01L23/373 , H01L23/367 , H01L23/00
Abstract: An IGBT module with a heat dissipation structure and a method for manufacturing the same are provided. The IGBT module with a heat dissipation structure includes a layer of IGBT chips, a bonding layer, a thick copper layer, a thermally-conductive and electrically-insulating layer, and a heat dissipation layer. A portion of the thermally-conductive and electrically-insulating layer is made of a polymer composite material, and a remaining portion of the thermally-conductive and electrically-insulating layer is made of a ceramic material. The thick copper layer is bonded onto the thermally-conductive and electrically-insulating layer by hot pressing. A fillet is formed at a bottom edge of the thick copper layer, and the bottom edge of the thick copper layer is embedded into the thermally-conductive and electrically-insulating layer.
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Patent Agency Ranking
公开(公告)号：US10861768B2
公开(公告)日：2020-12-08
申请号：US16442538
申请日：2019-06-16
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Tze-Yang Yeh , Chun-Lung Wu
IPC: H01L23/373 , H01L29/739 , H01L23/367
Abstract: An IGBT module with an improved heat dissipation structure includes a layer of IGBT chips, a bonding layer, a thick copper layer, a polymer composite layer, a thermal spray layer, and a heat dissipation layer. The thermal spray layer is disposed on the heat dissipation layer. The polymer composite layer is disposed on the thermal spray layer. The thick copper layer is disposed on the polymer composite layer. The bonding layer is disposed on the thick copper layer. The layer of IGBT chips is disposed on the bonding layer.
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17.发明授权公开(公告)号：US11988467B2
公开(公告)日：2024-05-21
申请号：US17890317
申请日：2022-08-18
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Ching-Ming Yang , Chun-Lung Wu , Tze-Yang Yeh
CPC classification number: F28F3/022 , F28F3/04 , F28F13/06 , F28F2215/04
Abstract: A liquid-cooling heat dissipation plate with pin-fins and an enclosed liquid cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of rhombus-shaped pin-fins, and a plurality of ellipse-shaped pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite to each other. The first heat dissipation surface is in contact with a heat source, and the second heat dissipation surface is in contact with a cooling fluid. The rhombus-shaped pin-fins and the ellipse-shaped pin-fins are integrally formed on the second heat dissipation surface and in a high density arrangement. The ellipse-shaped pin-fins correspond in position to a relative low temperature region of the heat source, and the rhombus-shaped pin-fins correspond in position to a relative high temperature region of the heat source.
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18.发明授权公开(公告)号：US11761719B1
公开(公告)日：2023-09-19
申请号：US17968804
申请日：2022-10-19
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Ching-Ming Yang , Chun-Te Wu , Tze-Yang Yeh
CPC classification number: F28F13/14 , F28F2215/04 , H05K7/208
Abstract: A two-phase immersion-type heat dissipation structure having fins with different thermal conductivities is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the plurality of fins. At least one of the plurality of fins is a functional fin that is made of a single metal material and has two or more thermal conductivities. A thermal conductivity of a lower portion of the functional fin that is connected with the heat dissipation substrate is lower than thermal conductivities of other portions of the functional fin.
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公开(公告)号：US11510342B1
公开(公告)日：2022-11-22
申请号：US17495780
申请日：2021-10-06
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Ching-Ming Yang , Cheng-Shu Peng , Tze-Yang Yeh
Abstract: An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A super-wetting layer is formed on a connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-wetting layer has a wetting angle of less than 10 degrees to water. Alternatively, a super-hydrophobic layer is formed on the connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-hydrophobic layer has a wetting angle of greater than 120 degrees to water.
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公开(公告)号：US11469154B2
公开(公告)日：2022-10-11
申请号：US17151203
申请日：2021-01-17
Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.
Inventor： Shih-Hsi Tai , Tze-Yang Yeh
IPC: H01L23/367 , H01L25/07 , H01L23/00 , H01L23/373
Abstract: An IGBT module with a heat dissipation structure having a specific layer thickness ratio includes a layer of IGBT chips, an upper bonding layer, a circuit layer, an insulating layer, and a heat dissipation layer. The insulating layer is disposed on the heat dissipation layer, the circuit layer is disposed on the insulating layer, the upper bonding layer is disposed on the circuit layer, and the layer of IGBT chips is disposed on the upper bonding layer. A thickness of the insulating layer is less than 0.2 mm, a thickness of the circuit layer is between 1.5 mm and 3 mm, and a thickness ratio of the circuit layer to the insulating layer is greater than or equal to 7.5:1.
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