公开(公告)号：US20180142354A1

公开(公告)日：2018-05-24

申请号：US15875726

申请日：2018-01-19

Applicant: Applied Materials, Inc.

Inventor： Sergio Fukuda SHOJI ,  Hamid NOORBAKHSH ,  Jong Mun KIM ,  Jason DELLA ROSA ,  Ajit BALAKRISHNA

IPC: C23C16/455 ,  C23C16/44 ,  H01J37/32 ,  F15D1/02

CPC classification number: C23C16/45591 ,  C23C16/4412 ,  F15D1/025 ,  H01J37/32633 ,  H01J37/32834

Abstract: Embodiments of the present invention provide apparatus and methods for reducing non-uniformity and/or skews during substrate processing. One embodiment of the present invention provides a flow equalizer assembly for disposing between a vacuum port and a processing volume in a processing chamber. The flow equalizing assembly includes a first plate having at least one first opening, and a second plate having two or more second openings. The first and second plates define a flow redistributing volume therebetween, and the at least one first opening and the two or more second openings are staggered.

公开(公告)号：US20180142352A1

公开(公告)日：2018-05-24

申请号：US15808543

申请日：2017-11-09

Applicant: Applied Materials, Inc.

Inventor： Kartik SHAH ,  Nisha Prakash HOLLA ,  Vijaykumar KRITHIVASAN ,  Anantha K. SUBRAMANI ,  Hamid NOORBAKHSH

IPC: C23C16/455 ,  C23C16/44 ,  C23C16/452

Abstract: An apparatus and method for cooling a gas distribution assembly with a cooling plate. The cooling plate having a body having a top surface, an outer perimeter, a center, an inner zone and an outer zone. A plurality of channels formed through the top surface. The plurality of channels having a first outer channel having one or more first outer channel segments configured for flowing a first cooling fluid from a cooling fluid inlet to a cooling fluid outlet and a first inner channel disposed between the first outer channel and the center having one or more first inner channel segments configured for flowing a second cooling fluid from a cooling fluid inlet to a cooling fluid outlet wherein flow in adjacent segments is in an opposite direction.

公开(公告)号：US20150134128A1

公开(公告)日：2015-05-14

申请号：US14497253

申请日：2014-09-25

Applicant: Applied Materials, Inc.

Inventor： Chetan MAHADESWARASWAMY ,  Kartik RAMASWAMY ,  Bryan LlAO ,  Sergio SHOJI ,  Duy D. NGUYEN ,  Hamid NOORBAKHSH ,  David PALAGASHVILI

IPC: G05D23/19 ,  G05B15/02 ,  H01J37/32

CPC classification number: G05D23/19 ,  G05B15/02 ,  H01J37/32522 ,  H01J37/32724 ,  H01J37/32908 ,  H01J37/3299 ,  H01L21/67248

Abstract: Methods and systems for controlling temperatures in plasma processing chamber for a wide range of setpoint temperatures and reduced energy consumption. Temperature control is coordinated between a coolant liquid loop and a heat source by a control algorithm implemented by the plasma processing module controller. The control algorithm may completely stop the flow of coolant liquid to a temperature-controlled component in response to a feedback signal indicating an actual temperature is below the setpoint temperature. The control algorithm may further be based at least in part on a feedforward control signal derived from a plasma power or change in plasma power input into the processing chamber during process recipe execution.

Abstract translation: 用于控制等离子体处理室中的温度的方法和系统，用于广泛的设定点温度和降低的能量消耗。 通过等离子体处理模块控制器实现的控制算法，在冷却液回路和热源之间进行温度控制。 控制算法可以响应于指示实际温度低于设定点温度的反馈信号，完全停止冷却剂液体流向温度控制部件的流动。 控制算法还可以至少部分地基于从等离子体功率导出的前馈控制信号或在处理配方执行期间输入到处理室中的等离子体功率的改变。

公开(公告)号：US20210043428A1

公开(公告)日：2021-02-11

申请号：US17077871

申请日：2020-10-22

Applicant: Applied Materials, Inc.

Inventor： Hamid NOORBAKHSH ,  Anwar HUSAIN ,  Reyn WAKABAYASHI

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687

Abstract: The present disclosure generally relates to apparatuses and methods for controlling a plasma sheath near a substrate edge. The apparatus relates to a processing chamber and/or a substrate support that includes an edge ring assembly with an edge ring electrode and an electrostatic chuck with a chucking electrode. The edge ring assembly is positioned adjacent the electrostatic chuck, such as with the edge ring assembly positioned exterior to or about the electrostatic chuck. The edge ring assembly includes a base and a cap positioned above the base with the edge ring electrode positioned between the cap and the base. The base of the edge ring electrode may include an inner recess and/or an outer recess with the cap including one or more lips that extend into the inner recess and/or the outer recess. One or more silicon rings and/or insulating rings are positioned adjacent the edge ring assembly.

公开(公告)号：US20190271082A1

公开(公告)日：2019-09-05

申请号：US16418994

申请日：2019-05-21

Applicant: Applied Materials, Inc.

Inventor： Haitao WANG ,  Hamid NOORBAKHSH ,  Chunlei ZHANG ,  Sergio Fukuda SHOJI ,  Kartik RAMASWAMY ,  Roland SMITH ,  Brad L. MAYS

IPC: C23C16/455 ,  C23C16/44 ,  H01J37/32

Abstract: Embodiments of the present disclosure relate to a showerhead assembly for use in a processing chamber. The showerhead assembly includes a porous insert disposed in a space defined between a gas distribution plate and a base plate to moderate the corrosive radicals resulting from plasma ignition to reduce particle issues and metal contamination in the chamber. The porous insert is a conductive material, such as metal, used to reduce the gap electrical field strength, or may be a dielectric material such as ceramic, polytetrafluoroethylene, polyamide-imide, or other materials with a low dielectric loss and high electrical field strength under conditions of high frequency and strong electric fields. As such, the electrical breakdown threshold is enhanced. The porous insert may reduce and/or eliminate showerhead backside plasma ignition and may include multiple concentric narrow rings that cover gas holes of the gas distribution plate.

公开(公告)号：US20190108983A1

公开(公告)日：2019-04-11

申请号：US15726139

申请日：2017-10-05

Applicant: Applied Materials, Inc.

Inventor： Hamid NOORBAKHSH

IPC: H01J37/32 ,  E06B3/50 ,  E06B5/00 ,  E05D15/56 ,  E06B7/23

Abstract: Embodiments disclosed herein generally relate to a substrate processing chamber component assembly with a split slit liner door assembly. In one embodiment, the split slit liner door assembly has a first door portion having a top surface, a rear face and a font face, a RF conductive gasket is disposed on the front face of the first door portion, a second door portion having sides, a bottom and a front surface, the bottom coupled to the actuator, and a linkage assembly coupling the first door portion to the second door portion wherein the linkage assembly is configured to translate a vertical motion of the second door portion relative to a first door portion and a horizontal motion spacing the first door portion from the second door portion.

公开(公告)号：US20180151402A1

公开(公告)日：2018-05-31

申请号：US15361365

申请日：2016-11-25

Applicant: Applied Materials, Inc.

Inventor： Hamid NOORBAKHSH

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/6831 ,  H01L21/68785

Abstract: Implementations described herein provide a substrate support assembly that includes a seal band. The seal band protects an adhesive layer that is disposed between an electrostatic chuck (ESC) and a cooling plate of the substrate support assembly. In one example, a substrate support assembly includes an electrostatic chuck and a cooling plate. A bonding layer secures a bottom surface of the electrostatic chuck to a top surface of the cooling plate. The bonding layer has an adhesive layer and a seal band. The seal band circumscribes and protects the adhesive layer. The seal band has a ring shaped body. The ring shaped body has a top surface connected to a bottom surface by an inner surface and an outer surface. The top surface and the bottom surface angled less than 85 degrees from the inner surface. The outer surface has an indent formed therein.

公开(公告)号：US20150001180A1

公开(公告)日：2015-01-01

申请号：US14020774

申请日：2013-09-06

Applicant: Applied Materials, Inc.

Inventor： Kenny Linh DOAN ,  Jason Della ROSA ,  Hamid NOORBAKHSH ,  Jong Mun KIM

IPC: H01J37/32 ,  B32B18/00

CPC classification number: H01J37/32642 ,  H01J37/32449 ,  H01J37/32623 ,  H01J37/32651

Abstract: A tunable ring assembly, a plasma processing chamber having a tunable ring assembly and method for tuning a plasma process is provided. In one embodiment, a tunable ring assembly includes an outer ceramic ring having an exposed top surface and a bottom surface and an inner silicon ring configured to mate with the outer ceramic ring to define an overlap region, the inner silicon ring having an inner surface, a top surface and a notch formed between the inner surface and the top surface, the inner surface defining an inner diameter of the ring assembly, the notch is sized to accept an edge of a substrate, an outer portion of the top surface of the inner silicon ring configured to contact in the overlap region and underlying an inner portion of the bottom surface of the outer ceramic ring.

Abstract translation: 提供了一种可调环组件，具有可调环组件的等离子体处理室和用于调谐等离子体工艺的方法。 在一个实施例中，可调谐环组件包括具有暴露的顶表面和底表面的外陶瓷环和被配置为与外陶瓷环配合以限定重叠区域的内硅环，内硅环具有内表面， 在所述内表面和所述顶表面之间形成的顶表面和凹口，所述内表面限定所述环组件的内径，所述凹口的尺寸设置成接受基底的边缘，所述内表面的顶表面的外部 硅环构造成在重叠区域中接触并且位于外陶瓷环的底表面的内部下方。