公开(公告)号：US20190265598A1

公开(公告)日：2019-08-29

申请号：US16408605

申请日：2019-05-10

Applicant: ASML NETHERLANDS B.V.

Inventor： Edo Maria HULSEBOS ,  Patricius Aloysius Jacobus TINNEMANS ,  Ralp BRINKHOF ,  Pieter Jacob HERES ,  Jorn Kjeld LUCAS ,  Loek Johannes Petrus VERHEES ,  Ingrid Margaretha Ardina VAN DONKELAAR ,  Franciscus Godefridus Casper BIJNEN

IPC: G03F7/20 ,  G03F9/00

Abstract: In a method of controlling a lithographic apparatus, historical performance measurements are used to calculate a process model relating to a lithographic process. Current positions of a plurality of alignment marks provided on a current substrate are measured and used to calculate a substrate model relating to a current substrate. Additionally, historical position measurements obtained at the time of processing the prior substrates are used with the historical performance measurements to calculate a model mapping. The model mapping is applied to modify the substrate model. The lithographic apparatus is controlled using the process model and the modified substrate model together. Overlay performance is improved by avoiding over- or under-correction of correlated components of the process model and the substrate model. The model mapping may be a subspace mapping, and dimensionality of the model mapping may be reduced, before it is used.

公开(公告)号：US20180348654A1

公开(公告)日：2018-12-06

申请号：US15737990

申请日：2016-06-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Franciscus Godefridus Casper BIJNEN

IPC: G03F9/00 ,  G03F7/20

Abstract: A method of characterizing a deformation of a plurality of substrates is described. The method comprising the steps of: —measuring, for a plurality of n different alignment measurement parameters λ and for a plurality of substrates, a position of the alignment marks; —determining a positional deviation as the difference between the n alignment mark position measurements and a nominal alignment mark position; —grouping the positional deviations into data sets; —determining an average data set; —subtracting the average data set from the data sets to obtain a plurality of variable data sets; —performing a blind source separation method on the variable data sets, thereby decomposing the variable data sets into a set of eigenwafers representing principal components of the variable data sets; —subdividing the set of eigenwafers into a set of mark deformation eigenwafers and a set of substrate deformation eigenwafers.

公开(公告)号：US20240151520A1

公开(公告)日：2024-05-09

申请号：US18536402

申请日：2023-12-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Franciscus Godefridus Casper BIJNEN ,  Junichi KANEHARA ,  Stefan Carolus Jacobus Antonius KEIJ ,  Thomas Augustus MATTAAR ,  Petrus Franciscus VAN GILS

IPC: G01B11/27

CPC classification number: G01B11/272

Abstract: In order to improve the throughput performance and/or economy of a measurement apparatus, the present disclosure provides a metrology apparatus including: a first measuring apparatus; a second measuring apparatus; a first substrate stage configured to hold a first substrate and/or a second substrate; a second substrate stage configured to hold the first substrate and/or the second substrate; a first substrate handler configured to handle the first substrate and/or the second substrate; and a second substrate handler configured to handle the first substrate and/or the second substrate, wherein the first substrate is loaded from a first, second or third FOUP, wherein the second substrate is loaded from the first, second or third FOUP, wherein the first measuring apparatus is an alignment measuring apparatus, and wherein the second measuring apparatus is a level sensor, a film thickness measuring apparatus or a spectral reflectance measuring apparatus.

公开(公告)号：US20220187722A1

公开(公告)日：2022-06-16

申请号：US17442951

申请日：2020-02-25

Applicant: ASML Netherlands B.V.

Inventor： Franciscus Godefridus Casper BIJNEN ,  Ralph BRINKHOF

IPC: G03F9/00

Abstract: The invention provides a method of measuring an alignment mark or an alignment mark assembly, wherein the alignment mark comprises grid features extending in at least two directions, the method comprising: measuring the alignment mark or alignment mark assembly using an expected location of the alignment mark or alignment mark assembly, determining a first position of the alignment mark or alignment mark assembly in a first direction, determining a second position of the alignment mark or alignment mark assembly in a second direction, wherein the second direction is perpendicular to the first direction, determining a second direction scan offset between the expected location of the alignment mark or alignment mark assembly in the second direction and the determined second position, and correcting the first position on the basis of the second direction scan offset using at least one correction data set to provide a first corrected position.

公开(公告)号：US20210341846A1

公开(公告)日：2021-11-04

申请号：US17377648

申请日：2021-07-16

Applicant: ASML NETHERLANDS B.V.

Inventor： Franciscus Godefridus Casper BIJNEN ,  Edo Maria HULSEBOS ,  Henricus Johannes Lambertus MEGENS ,  Robert John SOCHA ,  Youping ZHANG

IPC: G03F7/20 ,  G03F9/00 ,  G06F30/39

Abstract: A measurement apparatus and method for determining a substrate grid describing a deformation of a substrate prior to exposure of the substrate in a lithographic apparatus configured to fabricate one or more features on the substrate. Position data for a plurality of first features and/or a plurality of second features on the substrate is obtained. Asymmetry data for at least a feature of the plurality of first features and/or the plurality of second features is obtained. The substrate grid based on the position data and the asymmetry data is determined. The substrate grid and asymmetry data are passed to the lithographic apparatus for controlling at least part of an exposure process to fabricate one or more features on the substrate.

公开(公告)号：US20210318627A1

公开(公告)日：2021-10-14

申请号：US17271684

申请日：2019-08-22

Applicant: ASML Holding N.V. ,  ASML Netherlands B.V.

Inventor： Tamer Mohamed Tawfik Ahmed Mohamed ELAZHARY ,  Justin Lloyd KREUZER ,  Franciscus Godefridus Casper BIJNEN ,  Krishanu SHOME

IPC: G03F9/00 ,  G03F7/20

Abstract: An apparatus and system for determining alignment of a substrate in which a periodic alignment mark is illuminated with spatially coherent radiation which is then provided to a compact integrated optical device to create self images of the alignment mark which may be manipulated (e.g., mirrored, polarized) and combined to obtain information on the position of the mark and distortions within the mark. Also disclosed is a system for determining alignment of a substrate in which a periodic alignment mark is illuminated with spatially coherent radiation which is then provided to an optical fiber arrangement to obtain information such as the position of the mark and distortions within the mark.

公开(公告)号：US20170235230A1

公开(公告)日：2017-08-17

申请号：US15504621

申请日：2015-05-29

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Earl William EBERT ,  Franciscus Godefridus Casper BIJNEN

IPC: G03F7/20 ,  G01B11/14

CPC classification number: G03F7/7085 ,  G01B11/14 ,  G03F9/7088

Abstract: A measurement apparatus including an optical system to provide illumination radiation into a spot on a periodic structure and to receive radiation redirected by the periodic structure, the optical system including a first stop to block zero order radiation from the periodic structure and allow non-zero order radiation to pass, and a second stop to block zero order radiation passing the first stop and to allow the non-zero order radiation to pass, and a radiation detector, downstream of the optical system, to receive the non-zero order radiation.

公开(公告)号：US20160097983A1

公开(公告)日：2016-04-07

申请号：US14892880

申请日：2014-05-02

Applicant: ASML NETHERLANDS B.V.

Inventor： Erik Willem BOGAART ,  Franciscus Godefridus Casper BIJNEN ,  Arie Jeffrey DEN BOEF ,  Simon Gijsbert Josephus MATHIJSSEN

IPC: G03F7/20 ,  G01N21/956 ,  G01N21/95

CPC classification number: G03F7/70483 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/656 ,  G03F7/70625

Abstract: A substrate is provided with device structures and metrology structures (800). The device structures include materials exhibiting inelastic scattering of excitation radiation of one or more wavelengths. The device structures include structures small enough in one or more dimensions that the characteristics of the inelastic scattering are influenced significantly by quantum confinement. The metrology structures (800) include device-like structures (800b) similar in composition and dimensions to the device features, and calibration structures (800a). The calibration structures are similar to the device features in composition but different in at least one dimension. Using an inspection apparatus and method implementing Raman spectroscopy, the dimensions of the device-like structures can be measured by comparing spectral features of radiation scattered inelastically from the device-like structure and the calibration structure.

Abstract translation: 衬底具有器件结构和计量结构（800）。 器件结构包括显示一个或多个波长的激发辐射的非弹性散射的材料。 器件结构包括在一个或多个维度上足够小的结构，非弹性散射的特性受到量子限制的显着影响。 测量结构（800）包括与装置特征相似的组成和尺寸的装置状结构（800b）和校准结构（800a）。 校准结构类似于组合中的器件特征，但至少在一个维度上不同。 通过使用实施拉曼光谱的检查装置和方法，可以通过比较从器件状结构和校准结构中弹性散射的辐射的光谱特征来测量器件状结构的尺寸。

公开(公告)号：US20240263941A1

公开(公告)日：2024-08-08

申请号：US18562675

申请日：2022-05-24

Applicant: ASML Netherlands B.V.

Inventor： Rui CHENG ,  Joshua ADAMS ,  Franciscus Godefridus Casper BIJNEN ,  Eric Brian CATEY ,  Igor Matheus Petronella AARTS

IPC: G01B11/27 ,  G03F9/00

CPC classification number: G01B11/272 ,  G03F9/7046 ,  G03F9/7065 ,  G03F9/7069 ,  G03F9/7076 ,  G03F9/7092

Abstract: Systems, apparatuses, and methods are provided for correcting the detected positions of alignment marks disposed on a substrate and aligning the substrate using the corrected data to accurately expose patterns on the substrate. An example method can include receiving a measurement signal including a combined intensity signal corresponding to first and second diffracted light beams diffracted from first and second alignment targets having different orientations. The example method can further include fitting the combined intensity signal using templates to determine weight values and determining, based on the templates and weight values, first and second intensity sub-signals corresponding to the first and second diffracted light beams. The method can further include determining first and second intensity imbalance signals based on the first and second intensity sub-signals and determining a set of corrections to the measurement signal based on the first and second intensity imbalance signals.

公开(公告)号：US20230236515A1

公开(公告)日：2023-07-27

申请号：US18001255

申请日：2021-06-08

Applicant: ASML Netherlands B.V.

Inventor： Maurits VAN DER SCHAAR ,  Patrick WARNAAR ,  Franciscus Godefridus Casper BIJNEN ,  Olger Victor ZWIER

IPC: G03F7/00

CPC classification number: G03F7/70683 ,  G03F7/70633

Abstract: Disclosed is target arrangement comprising a first target region having at least a first pitch and at least a second pitch a second target region having at least a third pitch, wherein a portion of the first target region having a second pitch overlaps with a portion of the second target region.