公开(公告)号：US20230298985A1

公开(公告)日：2023-09-21

申请号：US18201145

申请日：2023-05-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Cheng Yuan CHEN ,  Chun Chen CHEN ,  Jiming LI ,  Chien-Wen TU

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC classification number: H01L23/49811 ,  H01L21/4889 ,  H01L23/66 ,  H01L2223/6605

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S 11 parameter of the connector is less than −20 dB.

公开(公告)号：US20230145588A1

公开(公告)日：2023-05-11

申请号：US18095513

申请日：2023-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng Yuan CHEN ,  Jiming LI ,  Chun Chen CHEN ,  Yuanhao YU

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L21/4853 ,  H01L23/66 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/526 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/3025

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

公开(公告)号：US20220199552A1

公开(公告)日：2022-06-23

申请号：US17133365

申请日：2020-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu HUANG ,  Chun Chen CHEN ,  Wei Chih CHO ,  Shao-Lun YANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.

公开(公告)号：US20220122950A1

公开(公告)日：2022-04-21

申请号：US17076480

申请日：2020-10-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Chun Chen CHEN ,  Shang Chien CHEN

IPC: H01L25/10 ,  H01L25/18

Abstract: The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.