公开(公告)号：US20240421103A1

公开(公告)日：2024-12-19

申请号：US18817136

申请日：2024-08-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu HUANG ,  Chun Chen CHEN ,  Wei Chih CHO ,  Shao-Lun YANG

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.

公开(公告)号：US20210135333A1

公开(公告)日：2021-05-06

申请号：US16670487

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin HO ,  Chih-Cheng LEE ,  Chun Chen CHEN ,  Yuanhao YU

IPC: H01Q1/22 ,  H01L23/28 ,  H01L23/66 ,  H01L23/495 ,  H01L21/768 ,  H01Q1/38

Abstract: A semiconductor device package and a method for manufacturing the same are provided. The semiconductor device package includes a circuit layer and an antenna module. The circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface. The lateral surface extends between the first surface and the second surface. The circuit layer has an interconnection structure. The antenna module has an antenna pattern layer and is disposed on the first surface of the circuit layer. The lateral surface of the circuit layer is substantially coplanar with a lateral surface of the antenna module.

公开(公告)号：US20220020680A1

公开(公告)日：2022-01-20

申请号：US16929018

申请日：2020-07-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu HUANG ,  Chun Chen CHEN ,  Wei Chih CHO ,  Shao-Lun YANG ,  Yu-Shun HSIEH

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48

Abstract: A lead frame includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion and an outer lead portion connecting to the inner lead portion. The inner lead portion is adjacent to and spaced apart from the die paddle. A bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion. The bottom surface of the inner lead portion includes one or more supporting members disposed thereon. The one or more supporting members have a convex surface facing away from the inner lead portion.

公开(公告)号：US20210125909A1

公开(公告)日：2021-04-29

申请号：US17140926

申请日：2021-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin HO ,  Chih-Cheng LEE ,  Chun Chen CHEN ,  Chen Yuang CHEN

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

公开(公告)号：US20200251421A1

公开(公告)日：2020-08-06

申请号：US16264599

申请日：2019-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chen Yuang CHEN ,  Jiming LI ,  Chun Chen CHEN ,  Yuanhao YU

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

公开(公告)号：US20230326878A1

公开(公告)日：2023-10-12

申请号：US18209412

申请日：2023-06-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu HUANG ,  Chun Chen CHEN ,  Wei Chih CHO ,  Shao-Lun YANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L23/3121 ,  H01L23/49822 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/49838 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.

公开(公告)号：US20220020654A1

公开(公告)日：2022-01-20

申请号：US16933806

申请日：2020-07-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Chih CHO ,  Chun Chen CHEN ,  Shao-Lun YANG

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L25/18 ,  H01L25/065

Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a first substrate, a second substrate, and a barrier structure. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface facing the second surface of the first substrate. The first substrate electrically bonds to the second substrate through a conductive terminal disposed between the second surface of the first substrate and the first surface of the second substrate. The barrier structure is disposed adjacent to the first surface of the first substrate.

公开(公告)号：US20240088001A1

公开(公告)日：2024-03-14

申请号：US18370320

申请日：2023-09-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin HO ,  Chih-Cheng LEE ,  Chun Chen CHEN ,  Cheng Yuan CHEN

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49838 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

公开(公告)号：US20230223676A1

公开(公告)日：2023-07-13

申请号：US18118738

申请日：2023-03-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin HO ,  Chih-Cheng LEE ,  Chun Chen CHEN ,  Yuanhao YU

IPC: H01Q1/22 ,  H01Q1/40 ,  H01L23/66 ,  H01Q21/00 ,  H01L23/31 ,  H01Q21/06

CPC classification number: H01Q1/2283 ,  H01Q1/40 ,  H01L23/66 ,  H01Q21/0093 ,  H01L2223/6677 ,  H01L23/3128 ,  H01Q21/061

Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

公开(公告)号：US20210225747A1

公开(公告)日：2021-07-22

申请号：US16749635

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao YU ,  Cheng Yuan CHEN ,  Chun Chen CHEN ,  Jiming LI ,  Chien-Wen TU

IPC: H01L23/498 ,  H01L23/66 ,  H01L21/48

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than −20 dB.